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AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers
JZ-500 and JZ-500-C black
 
JZ-500 and JZ-500-C black cables manufac
HF41F
 
HF41F subminiature power relays from HON
GT-900B
 
GOLDTOOL toolsets in cases
Intel® Neural Compute Stick 2
 
RS Components announces availability of
MC4
 
MC4 solar connector sets
WIHA-SB24670
 
Multifunctional WIHA LED Torch
G2RV-SR
 
G2RV-SR interface relays from OMRON
LUP-20-LED
 
LUP-20-LED-SMD desktop magnifier
Tektronix AFG31000
 
Tektronix Redefines the Arbitrary/Functi

congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability

congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability

congatec announced today that the brand new embedded versions of the 8th Generation Intel® Core™ Mobile processors (codenamed Whiskey Lake) are now available on COM Express Type 6 Compact modules, 3.5 inch SBCs, and Thin Mini-ITX motherboards. OEM customers benefit from an instant performance boost of up to 58%¹ compared to previous embedded U-Series processors – enabled by 4 instead of 2 cores plus an overall improved microarchitecture.

Thanks to features such as optional Intel® Optane™ memory 2 or USB 3.1 Gen2, everyday tasks are even more responsive. The processor cores allow efficient task scheduling and furthermore support the use of the RTS hypervisor software to allow additional optimization of I/O throughput from the input channels to the processor cores.

Designed for harsh and space-constrained environments, the new high-end Intel® Core™ i7, Core™ i5, Core™ i3 and Celeron® embedded processor boards and modules are the first in the industry to offer long-term availability of 10+ years. This brand new embedded x86 design principle premiers at congatec and within the entire embedded board vendor space² with the launch of the new 8th Generation Intel® Core™ Mobile processor boards. Addressing in particular the increased life cycle needs of the transportation and mobility sector, these new boards and modules are also a perfect fit for all other embedded applications – such as medical equipment and industrial controls, embedded edge clients and HMIs – as they enable extended life cycles without additional costs for customers.

“One of our main goals is to simplify the use of embedded computer technology as much as possible for our OEM customers. That’s why we offer our brand new 8th Gen Intel® Core™ Mobile processor based embedded boards and modules now with 10+ and on basis of specific last time buy contract up to 15 years long-term availability right from the start, as 7 years are often insufficient for many high-end embedded computing sectors. Our extended life cycle – which, by the way, comes without additional costs – thus helps OEMs to extend their own product life cycles for an even better ROI,” explains Christian Eder, Director of Marketing at congatec.

In the past, many high-end embedded applications tended towards life cycles shorter than 7 years, as they often required a new performance boost from next generation processors before then. But with increased certification demands in several new embedded application areas such as mobile vehicles, OEMs are similarly keen on longer life cycles today. Extending the life cycles of standard embedded x86 platforms to 10 or even 15 years off the shelf is consequently a major bonus for customers across the entire embedded computing market.

“We are very happy to get our hands on embedded versions of this brand new Intel architecture with 10+ year long-term availability. Longer life cycles are a key requirement in many mobile applications we target in rugged environments, where high speed data streams need to be acquired and logged for 3D object recognition, lidar imaging, and mobile mapping. The same requirement that our end customers expect from our data recorders used for wireless network monitoring and automotive test systems or data loggers for test vehicles which store and analyze high speed data streams from external sensors on solid state drives or hard drives,” explains Thomas Hagios, CEO of MCTX Mobile & Embedded Computers GmbH.

The feature set in detail

The new conga-TC370 COM Express Type 6 modules, the conga-JC370 embedded 3.5 inch SBCs, and the conga-IC370 Thin Mini-ITX motherboards all feature the latest Intel® Core™ i7, Core™ i5, Core™ i3 and Celeron embedded processors with a long-term availability of 15 years. The memory is designed to match the demands of consolidating multi OS applications on a single platform: Two DDR4 SODIMM sockets with up to 2400 MT/s are available for a total of up to 64GB. For the first time, USB 3.1 Gen2 with transfer rates of 10 Gbps is now supported natively, which makes it possible to transfer even uncompressed UHD video from a USB camera or any other vision sensor. The new 3.5 inch SBCs provide this performance via a USB-C connector that also supports 1x DisplayPort++ and power supply for peripheral devices, thereby enabling monitor connection with a single cable for video, touch and power. The COM Express modules support the same feature set on carrier boards. Further interfaces depend on the form factor, but all support a total of 3 independent 60Hz UHD displays with up to 4096x2304 pixels as well as 1x Gigabit Ethernet (1x with TSN support). The new boards and modules offer all this and many more interfaces with an economical 15W TDP that is scalable from 10W (800 MHz) to 25W (up to 4.6 GHz in Turbo Boost mode).

Processor Cores / Threads Base freq. / Max. boost freq. [GHz]


Base TDP [W]

Temperature range
Intel® Core™ i7 8665UE 4 / 8 2.0 / 3.4 15 0 to +60°C
Intel® Core™ i5 8365UE 4 / 8 1.8/ 2.6 15 0 to +60°C
Intel® Core™ i3 8145UE 2 / 4 1.8 / 2.2 15 0 to +60°C
Intel® Celeron® 4305UE 2 / 2 1.8 15 0 to +60°C


Further information on the new 8th gen Intel Core processor technology and congatec's corresponding boards and modules can be found at: https://www.congatec.com/intel-whiskey-lake

2019062301 / 23.06.2019 / Embedded / congatec AG /

New congatec SMARC module with Arm® based NXP i.MX 8M Nano processor
New congatec SMARC module with Arm® based NXP i.MX 8M Nano processor
congatec introduces a new SMARC 2.0 Computer-on-Module with Arm® Cortex®-A53 based NXP Semiconductors i.MX 8M Nano processor. The conga-SMX8-Nano defines a new low-end performance class for SMARC. With its stunning ultra-low power graphics capabilities as well as its limited number of carefully selected I/Os, the new NXP i.MX 8M Mini compatible NXP i.MX 8M Nano processor targets low cost application areas not previously reached by – but perfectly suited for – vendor independent, standardized Computer-on-Modules.
.....
Computer-On-Modules are world-leading platforms for embedded system designs
Computer-on-Modules (COM) Advantages when compared to a full custom design.
.....
congatec launches 100 Watt ecosystem for embedded edge and micro servers
congatec launches 100 Watt ecosystem for embedded edge and micro servers
Maximum Performance for COM Express Type 7 Servers
.....
New congatec SMARC module with NXP i.MX 8M Mini processor
congatec – a leading vendor of standardized and customized embedded computer boards and modules – today introduces a new SMARC 2.0 Computer-on-Module with NXP i.MX 8M Mini processor. The conga-SMX8-Mini offers higher performance at significantly fewer watts¹ due to the new 14nm FinFET structure. The module also offers impressive visualization capabilities – including 3D graphics with full-HD resolution – despite low thermal and system cost.
.....
New congatec SMARC module with NXP i.MX 8M Mini processor
congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability
congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability
congatec announced today that the brand new embedded versions of the 8th Generation Intel® Core™ Mobile processors (codenamed Whiskey Lake) are now available on COM Express Type 6 Compact modules, 3.5 inch SBCs, and Thin Mini-ITX motherboards. OEM customers benefit from an instant performance boost of up to 58%¹ compared to previous embedded U-Series processors – enabled by 4 instead of 2 cores plus an overall improved microarchitecture.
.....
congatec doubles RAM support for Server-on-Modules
congatec – a leading vendor of standardized and customized embedded computer boards and modules – announces that its Intel Atom® C3000 processor based conga-B7AC Server-on-Modules now support up to 96 GB DDR4 SO-DIMM memory on 3 sockets. This is twice the previously supported capacity and sets a major new milestone for COM Express Type 7 based designs, as memory is one of the most important performance levers for embedded edge server technologies.
.....
congatec doubles RAM support for Server-on-Modules
New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
congatec introduces a deployment ready design study of a micro server carrier board with 10GbE support. The modular server board in the 5x5 inch Mini-STX form factor (140mm x 147mm) offers high scalability across all suitable embedded server processor sockets thanks to its COM Express Type 7 slot. This enables 10GbE edge node performance upgrades at lowest cost, as nearly all investments in the real-time system design of 10GbE edge nodes can be re-used. To upgrade the performance, OEMs and network operators only need to exchange the Server-on-Module.
.....
New congatec quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – launches the new COM Express Type 7 quick starter set as the fundamental basis for OEM’s modular micro server designs.
.....
New congatec quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
congatec presents first µQseven computer modules
congatec presents first µQseven computer modules
congatec accelerates ongoing miniaturization trend by offering µQseven modules with Freescale i.MX 6 processors
.....
Company of the week

Keysight Technologies
Address Book


Keysight Technologies


XP Power Limited


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Fischer Connectors SA


Nicomatic


TE Connectivity


akYtec GmbH


SOS electronic s.r.o.


MARVELL


Taiwan Semiconductor


ROHM Semiconductor


ČEZ a.s.


Pickering Interfaces Ltd


ANRITSU


Mouser Electronics


NEXPERIA


RS Components GmbH


Transfer Multisort Elektronik Sp. z o.o.


SECTRON


FAULHABER


Willow Technologies


ABB


ACS Motion Control


Visual Communications Company, LLC


Sonderhoff Holding GmbH


LASER COMPONENTS


LEM


Hradil Spezialkabel GmbH


Radio Frequency Systems


Apacer Technology Inc.
Calendary
NEPCON Japan, Tokio, 15.1.-17.1.2020
Intersec 2020, Dubai, UAE, 19.1.-21.1.2020
DistribuTECH, 28.1.-30.1.2020, San Antonio, TX
BATTERY JAPAN, Tokyo, 26.2.-28.2.2020
Light + Building 2020, Frankfurt am Main, 8.3.-13.3.2020
AMPER 200, Brno, CZ, 17.3.-20.3.2020
SECUTECH 2020, Taipei, 22.4.-24.4.2020
PCIM Europe, Nuremberg, 5.5.-7.5.2020
SMTconnect 2020, Nuremberg, 5.5.-7.5.2020
LED Expo Mumbai 2020, 7.5.-9.5.2020
SPS Italia, Fiere di Parma, 26.5.-28.5.2020
Wire & Cable Guangzhou, China, 27.5.-29.5.2020
Automechanika Dubai, 7.6.-9.7.2020
hardware+tools, Dubai, UAE, 7.6.-9.6.2020
PCIM Asia, Shanghai, 1.7.-3.7.2020
SPS Automation Middle East, Dubai, 20.8.-21.8.2020
Intersec Buenos Aires, 26.8.-28.8.2020
Automechanika Frankfurt, DE, 8.9.-12.9.2020
BATTERY JAPAN, Osaka, 9.9.-11.9.2020
IMTS2020, 14.9.-19.9.2020, Chicago, IL
Interlight Russia, Moscow, 14.9.-17.9.2020
Prolight + Sound NAMM, Moscow, 17.9.-19.9.2020
Prolight + Sound Shanghai, 28.10.-30.10.2020
SPS 2020, Nuremberg, 24.11.-26.11.2020
ISE 2021, Barcelona, Spain, 2.2.-5.2.2021
DistribuTECH, 9.2.-11.2.2021, San Diego, CA
BATTERY JAPAN, Tokyo, 3.3.-5.3.2021
BATTERY JAPAN, Osaka, 29.9.-1.10.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
Interesting video
The ISS Design Challenge ...
Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara
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