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congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications

congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications

See and understand

congatec – a leading vendor of embedded computing technology – presents its brand new workload consolidation kit for vision based situational awareness that is qualified by Intel as Intel® IoT RFP (Ready For Production) Kit. Based on a COM Express Type 6 module equipped with Intel® Xeon® E2 processor, the RFP kit has three virtual machines (VMs) built on Real-Time Systems’ hypervisor technology for workload consolidation in vision applications. One VM runs a vision based AI application on the basis of Intel® OpenVino® software for situational awareness, the second VM is real-time capable and runs deterministic control software, and the third VM operates a IIoT/Industry 4.0 gateway. The congatec kit designed in cooperation with Intel® and Real-Time Systems targets the next generation of vision based collaborative robotics, automation controls and autonomous vehicles that have to tackle multiple tasks in parallel, including situational awareness utilizing deep learning based AI algorithms.
 

The Real-Time Systems based virtual machines make it possible to consolidate the different tasks on a single edge computing platform, which ultimately saves costs. The Intel® OpenVino® software delivers the appropriate artificial intelligence for situational awareness. OEMs just need to load their control to the real-time VM and they are ready to enrich their real-time control with data from the situational awareness VM and to communicate in real-time with IIoT/Industry 4.0 counterparts to enable tactile internet controls.
 

“Workload consolidation demand is rapidly increasing in vision based situational awareness applications: Machine controls, collaborative robotics and autonomous vehicles need virtualization, as OEMs don’t want to assign the different control, vision and networking tasks to multiple dedicated systems,” explains Martin Danzer, Director Product Management at congatec.

 

The workload consolidation RFP kit unpacked

congatec’s ‘Intel® IoT RFP Kit’ for workload consolidation in vision based situational awareness applications includes a COM Express Type 6 module based platform with Intel® Xeon® E2 processor, a Basler vision camera, a pendulum controlled by a demo controller, and an Intel® Arria® 10 FPGA card from REFLEX CES. The platform has three pre-installed application ready VMs on the basis of Real-Time Systems’ hypervisor technology. One VM analyses videos on the basis of Intel® OpenVino® software, the second VM runs real-time Linux to control the balance of an inverted pendulum in real-time. The third partition hosts a gateway for IIoT/Industry 4.0 connectivity. More information about the new Intel® IoT RFP Kit for workload consolidation is available at:

https://marketplace.intel.com/s/offering/a5b3b000000ThjQAAS/realtime-workload-consolidation-starter-set

and https://www.congatec.com/workload-consolidation

Related Files

2020061701 / 17.06.2020 / Tools / congatec AG /

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congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications
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congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications
AMD Ryzen™ based congatec COM Express module for the industrial temperature range
AMD Ryzen™ based congatec COM Express module for the industrial temperature range
congatec introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen™ Embedded V1000 Series processors for the industrial temperature range from 40°C to +85°C. It is available with optional burn-in & cold-soak stress screening service for highest reliability.
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New congatec SMARC module with Arm® based NXP i.MX 8M Nano processor
congatec introduces a new SMARC 2.0 Computer-on-Module with Arm® Cortex®-A53 based NXP Semiconductors i.MX 8M Nano processor. The conga-SMX8-Nano defines a new low-end performance class for SMARC. With its stunning ultra-low power graphics capabilities as well as its limited number of carefully selected I/Os, the new NXP i.MX 8M Mini compatible NXP i.MX 8M Nano processor targets low cost application areas not previously reached by – but perfectly suited for – vendor independent, standardized Computer-on-Modules.
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New congatec SMARC module with Arm® based NXP i.MX 8M Nano processor
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congatec launches 100 Watt ecosystem for embedded edge and micro servers
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congatec – a leading vendor of standardized and customized embedded computer boards and modules – today introduces a new SMARC 2.0 Computer-on-Module with NXP i.MX 8M Mini processor. The conga-SMX8-Mini offers higher performance at significantly fewer watts¹ due to the new 14nm FinFET structure. The module also offers impressive visualization capabilities – including 3D graphics with full-HD resolution – despite low thermal and system cost.
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congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability
congatec announced today that the brand new embedded versions of the 8th Generation Intel® Core™ Mobile processors (codenamed Whiskey Lake) are now available on COM Express Type 6 Compact modules, 3.5 inch SBCs, and Thin Mini-ITX motherboards. OEM customers benefit from an instant performance boost of up to 58%¹ compared to previous embedded U-Series processors – enabled by 4 instead of 2 cores plus an overall improved microarchitecture.
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congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability
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congatec – a leading vendor of standardized and customized embedded computer boards and modules – announces that its Intel Atom® C3000 processor based conga-B7AC Server-on-Modules now support up to 96 GB DDR4 SO-DIMM memory on 3 sockets. This is twice the previously supported capacity and sets a major new milestone for COM Express Type 7 based designs, as memory is one of the most important performance levers for embedded edge server technologies.
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.....
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