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QPL-qualified SupIR-SMD package for rad hard MOSFETs enables higher performing space power systems
Reliably attaching surface mount hermetic power packages to PCBs is a common challenge faced by space system designers.

Too often, different thermal coefficients lead to an expansion mismatch of different materials. IR HiRel, an Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) company, solves this issue with fourteen newly QPL-qualified radiation-hardened (rad hard) MOSFETs housed in an innovative direct-to-PCB mounting package. SupIR-SMD is key to higher performing space power systems such as satellite bus power distribution systems, payload power supplies, space-grade DC-DC converters, and other high-switching designs.

Capable of attaching directly to the PCB, the SupIR-SMD design is optimized for surface mount attach and proven to meet the most stringent reliability testing in this configuration, as detailed in IR HiRel’s application note #1222. Compared to the typical packaging solution used in space applications, the SupIR-SMD delivers a 37 percent smaller footprint, 34 percent lighter mass and 33 percent higher current density, while offering a more direct thermal path for heat transfer. “With this, the SupIR-SMD package is testament to IR HiRel’s commitment to deliver innovation that exceeds the specific requirements of the space market,” said Eric Toulouse, Vice-President and General Manager of IR HiRel.

Traditionally, designers resort to a ‘dead bug’ and lead configuration, where the packages are flipped upside down and soldered to the PCB via leads. Dead bug soldering dissipates heat sub-optimally and decreases MOSFET power capacity. Looking forward, system designers can optimize power system efficiency through direct mount of the SupIR-SMD package to the PCB, enabling the shortest thermal conduction path without any compromise in system reliability.

The SupIR-SMD package is JANS-qualified to MIL-PRF-19500. JANS is the most rigorous level of screening and acceptance requirements available to assure the performance, quality and reliability of discrete semiconductors intended for space flight. The new rad hard MOSFETs are also QPL-qualified in accordance with the Qualified Products List (QPL) for space applications.

Availability

The new SupIR-SMD QPL-qualified rad hard MOSFETs can be ordered now with the MIL-PRF-19500 package identifier ‘U2A.’ More information is available at www.infineon.com/supir-smd.

2020062302 / 23.06.2020 / Electronic-components / Infineon Technologies AG /

Infineon launches next-generation ZVS flyback converter chipset for advanced USB-C PD adapters and chargers
The growing popularity of USB-C power delivery (PD) charging increases the demand for compatible chargers. Users now seek powerful yet compact adapters.

Infineon Lighting Shoe: Infineon develops worldwide unique shoe prototype with adidas that listens to music and reacts to it with lighting effects

Infineon’s single-chip solution for NFC lock applications enables KISS to take self-storage to the next level with new smart lock solution

Infineon introduces new automotive 60 V and 120 V OptiMOS™ 5 in TOLx packages for 24 V-72 V supplied high power ECUs
The electrification of the transportation system is advancing continuously. In addition to passenger cars, 2- and 3-wheelers as well as light vehicles are increasingly being electrified. Therefore, the automotive market for Electronic Control Units (ECUs) powered by 24 V-72 V is expected to keep growing in the coming years.

Infineon presents highly integrated XENSIV™ 60 GHz radar sensor for consumer electronics, IoT applications, and healthcare devices

Engine management and pneumatic seat systems: Infineon launches two XENSIV™ barometric air pressure sensors

Infineon and SCHWEIZER extend cooperation in chip embedding to develop more efficient silicon carbide automotive solutions

Infineon introduces a new single-stage flyback controller for battery charging applications, enabling hassle-free and scalable designs
Battery-powered appliances, one of the industry’s fastest-growing segments, require energy-efficient, robust, and cost-effective battery charging. For this reason Infineon Technologies AG extends its offering of AC-DC controller ICs by introducing the ICC80QSG single-stage PWM controller for flyback topologies.

Infineon’s CoolSiC™ devices support bi-directional inverter from Delta to let electric vehicles become emergency backup power

Infineon and Oxford Ionics join forces to develop leading Trapped Ion Quantum Processors
Infineon Technologies AG and Oxford Ionics announce a collaboration to build high-performance and fully integrated quantum processing units (QPUs).

Optimized CoolSiC™ MOSFETs 650 V in D²PAK for lowest losses in the application and highest reliability in operation

World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications
Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices.

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Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

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