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First COM-HPC and next-gen COM Express

First COM-HPC and next-gen COM Express

congatec fuels launch of 11th Gen Intel® Core™ processors with two great new design options

In parallel with the 11th Gen Intel® Core™ processor launch (code named “Tiger Lake”), congatec – a leading vendor of embedded computing technology – announces the availability of both its first COM-HPC Client size A module and a next generation COM Express Compact Computer-on-Module. This provides engineers the choice to further scale the performance of their existing systems or develop the next generation of products utilizing COM-HPC’s broader array of interfaces. OEMs will benefit from the substantial performance improvements as well as communication enhancements that the new modules based on 11th Gen Intel Core processors deliver to the high-end computing sector. Typical applications can be found in many high-end solutions, from embedded systems and edge computing nodes to network hubs, and local fog data centers to core network appliances, as well as ruggedized central cloud data centers for critical government applications.

“congatec’s modules based on the 11th Gen Intel Core processors feature high-performance CPU/GPU compute with integrated AI acceleration for critical applications that demand high-speed processing, and computer vision,” explains Gerhard Edi, CTO at congatec. The highlights of the 11th Gen Intel Core processors provide a massive CPU performance boost, fast DDR4 memory, expansive PCIe Gen4 and USB 4.0 bandwidth. These performance enhancements are complemented by features that are critical for communication connected edge computers such as congatec’s support for hypervisor technologies e.g. from Real-Time Systems. All this comes in a powerful and energy-efficient package leveraging Intel’s SuperFin technology delivering increased power savings, physical density and providing even more compute power for given thermal envelopes.

The benefits of choice

“For the first time, design engineers now have the choice to go either with COM Express or COM-HPC. Each provide unique benefits for example, we have an improved next-gen connector for COM Express that is expected to offer better bandwidth capacities compared to what was available in the past. This is essential information for engineers thinking about utilizing the high bandwidth interfaces such as PCIe Gen 4. Engineers choosing COM-HPC will benefit from by far more high-speed interfaces delivered over 800 signal pins in total. This is almost twice as many pins as COM Express Type 6 modules deliver with 440 pins,” explains Andreas Bergbauer, Product Line Manager at congatec. To help engineers make the best choice, congatec provides engineering support and is creating a COM Express and COM-HPC design decision guide and a whitepaper, which will be available on congatec’s 11th Gen Intel Core processors page.

Even more innovations and benefits

It is important to mention that besides PCIe Gen 4, the new congatec Computer-on-Modules with low-power 11th Gen Intel Core processors also offer USB 4.0, which is fundamentally based on Intel’s Thunderbolt technology. USB 4.0 supports amazing data transfer rates of up to 40 Gbit/s and tunneling of PCIe 4.0 as well as DP-Alt mode supporting video signals of up to 8k resolution with 10-bit HDR at 60 Hz.

The feature set in detail

The COM-HPC Client size A module conga-HPC/cTLU as well as the COM Express Compact conga-TC570 will become available with the 11th Gen Intel Core processors. Both modules are the first to support PCIe x4 in Gen 4 quality to connect external peripherals with massive bandwidth. In addition, designers can leverage 8x PCIe Gen 3.0 x1 lanes. Where the COM-HPC module offers latest 2x USB 4.0 and 2x USB 3.2 Gen 2 and 8x USB 2.0, the COM Express module offers 4x USB 3.2 Gen 2 and 8x USB 2.0 in compliance to the PICMG specification. Sound is provided via I2S, SoundWire by COM-HPC, and HDA by COM Express modules. Comprehensive board support packages are provided for all leading OS’s like Linux, Windows and Chrome, as well as hypervisor support from Real‑Time Systems.

Further information about congatec’s new modules based on 11th Gen Intel Core processors can be found on the main landing page www.congatec.com/11th-gen-intel-core/

Further information on the new conga-HPC/cTLU COM-HPC Client module can be found at: https://www.congatec.com/en/products/com-hpc/conga-hpcctlu/

The conga-TC570 COM Express Compact module has its landing page here: https://www.congatec.com/en/products/com-express-type-6/conga-tc570/

2020090602 / 06.09.2020 / Electronic-components / congatec AG /

ANYbotics’ ANYmal C robot is a multi-module machine
ANYbotics’ ANYmal C robot is a multi-module machine
Rugged four-legged robot with three brains
.....
First COM-HPC and next-gen COM Express
congatec fuels launch of 11th Gen Intel® Core™ processors with two great new design options
.....
First COM-HPC and next-gen COM Express
congatec COM Express Module with AMD Ryzen™ Embedded R1000 processors
congatec COM Express Module with AMD Ryzen™ Embedded R1000 processors
More performance and less dollars per watt
.....
congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications
See and understand
.....
congatec presents Intel® IoT RFP Kit for workload consolidation in vision based situational awareness applications
AMD Ryzen™ based congatec COM Express module for the industrial temperature range
AMD Ryzen™ based congatec COM Express module for the industrial temperature range
congatec introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen™ Embedded V1000 Series processors for the industrial temperature range from 40°C to +85°C. It is available with optional burn-in & cold-soak stress screening service for highest reliability.
.....
New congatec SMARC module with Arm® based NXP i.MX 8M Nano processor
congatec introduces a new SMARC 2.0 Computer-on-Module with Arm® Cortex®-A53 based NXP Semiconductors i.MX 8M Nano processor. The conga-SMX8-Nano defines a new low-end performance class for SMARC. With its stunning ultra-low power graphics capabilities as well as its limited number of carefully selected I/Os, the new NXP i.MX 8M Mini compatible NXP i.MX 8M Nano processor targets low cost application areas not previously reached by – but perfectly suited for – vendor independent, standardized Computer-on-Modules.
.....
New congatec SMARC module with Arm® based NXP i.MX 8M Nano processor
Computer-On-Modules are world-leading platforms for embedded system designs
Computer-On-Modules are world-leading platforms for embedded system designs
Computer-on-Modules (COM) Advantages when compared to a full custom design.
.....
congatec launches 100 Watt ecosystem for embedded edge and micro servers
Maximum Performance for COM Express Type 7 Servers
.....
congatec launches 100 Watt ecosystem for embedded edge and micro servers
New congatec SMARC module with NXP i.MX 8M Mini processor
New congatec SMARC module with NXP i.MX 8M Mini processor
congatec – a leading vendor of standardized and customized embedded computer boards and modules – today introduces a new SMARC 2.0 Computer-on-Module with NXP i.MX 8M Mini processor. The conga-SMX8-Mini offers higher performance at significantly fewer watts¹ due to the new 14nm FinFET structure. The module also offers impressive visualization capabilities – including 3D graphics with full-HD resolution – despite low thermal and system cost.
.....
congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability
congatec announced today that the brand new embedded versions of the 8th Generation Intel® Core™ Mobile processors (codenamed Whiskey Lake) are now available on COM Express Type 6 Compact modules, 3.5 inch SBCs, and Thin Mini-ITX motherboards. OEM customers benefit from an instant performance boost of up to 58%¹ compared to previous embedded U-Series processors – enabled by 4 instead of 2 cores plus an overall improved microarchitecture.
.....
congatec boards with 8th Gen Intel® Core™ Mobile processor and 10+ years availability
congatec doubles RAM support for Server-on-Modules
congatec doubles RAM support for Server-on-Modules
congatec – a leading vendor of standardized and customized embedded computer boards and modules – announces that its Intel Atom® C3000 processor based conga-B7AC Server-on-Modules now support up to 96 GB DDR4 SO-DIMM memory on 3 sockets. This is twice the previously supported capacity and sets a major new milestone for COM Express Type 7 based designs, as memory is one of the most important performance levers for embedded edge server technologies.
.....
New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
congatec introduces a deployment ready design study of a micro server carrier board with 10GbE support. The modular server board in the 5x5 inch Mini-STX form factor (140mm x 147mm) offers high scalability across all suitable embedded server processor sockets thanks to its COM Express Type 7 slot. This enables 10GbE edge node performance upgrades at lowest cost, as nearly all investments in the real-time system design of 10GbE edge nodes can be re-used. To upgrade the performance, OEMs and network operators only need to exchange the Server-on-Module.
.....
New modular 10GbE micro server carrier board from congatec in the Mini-STX form factor
New congatec quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
New congatec quick starter set simplifies evaluation of COM Express Type 7 server-on-modules
congatec – a leading technology company for embedded computer modules, single board computers and embedded design and manufacturing services – launches the new COM Express Type 7 quick starter set as the fundamental basis for OEM’s modular micro server designs.
.....
congatec presents first µQseven computer modules
congatec accelerates ongoing miniaturization trend by offering µQseven modules with Freescale i.MX 6 processors
.....
congatec presents first µQseven computer modules
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