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Create High-Resolution Audio Devices Using Microchip’s New Bluetooth® Audio SoC with Sony’s LDAC™ Technology
Bluetooth 5-compliant SoC enables immersive audio sound in Audeze’s award-winning, high-end Mobius gaming headphones

With mainstream consumer demand for high-quality audio experiences growing, consumers expect Bluetooth audio devices to create an immersive and uninterrupted listening experience. However, Bluetooth audio designs are often limited by the bit depth and frequency rate of existing codecs, which are the communication and compression technology used to send audio over the air. Now designers of audio systems have a fully-certified, Bluetooth 5-compliant System-on-Chip (SoC) with Sony’s LDAC audio codec technology* in the IS2064GM-0L3 from Microchip Technology Inc. (NASDAQ: MCHP). The SoC allows manufacturers to develop a new generation of audio devices with an advanced codec, extending high-resolution audio beyond audiophiles and into mass market Bluetooth wireless products. Upscale headphone manufacturer, Audeze, has implemented the SoC into their high-end Mobius gaming headphone. For more information on the SoC visit: http://www.microchip.com/IS2064.

The Audeze Mobius headphone utilizes Microchip’s IS2064GM-0L3 SoC for the Bluetooth wireless connection supporting LDAC and other audio codec interfaces. Sony's LDAC is considered the highest-quality audio codec available. It transmits up to 990 kbps data throughput, which is three times higher than the standard Bluetooth Sub-band Codec (SBC), and maintains frequency and bit depth of up to 96 kHz/24-bit. The high compression and reproduction efficiency enables high-resolution audio listening experiences for Bluetooth audio devices.

“Our new Mobius headphone features many groundbreaking technologies. To ensure high-quality Bluetooth audio we implemented Microchip’s IS2064GM-0L3 SoC in our headphones,” said Sankar Thiagasamudram, CEO of Audeze. “Thanks to the outstanding support from Microchip, we were able to incorporate the LDAC codec quickly and easily into our products.”

The IS2064GM-0L3 SoC not only makes the LDAC codec available to the broader market of audio product vendors, it also allows customers to utilize Microchip’s outstanding global technical support and comprehensive development environment to assist customers with implementation and getting to market faster. The LDAC codec is also integrated into the Android 8.0 Oreo™ operating system Bluetooth stack, making the LDAC technology more widely available on the transmit side.

“Microchip enables OEMs to address consumers’ increasing demand for high-quality audio with the convenience and ubiquity of Bluetooth wireless,” said Steve Caldwell, vice president of Microchip’s wireless solutions group. “OEMs can focus on their audio product and sound quality and know that, because of Microchip, the Bluetooth wireless integration will be seamless.”

Development Tools

The IS2064GM-0L3 is available to customers upon request after approval. Development boards are also available.

Pricing and Availability

The IS2064GM-0L3 comes in an 8 x 8 mm LGA package and is available for volume production starting at $4.90 each in 10,000-unit quantities. Please contact Sony for additional licensing requirements when using LDAC technology: www.sony.net/Products/LDAC/index.html.

For additional information, contact any Microchip sales representative, visit Microchip’s website or send an email to BTAudio@microchip.com. To learn more about Microchip’s complete line of Bluetooth audio products, visit Microchip’s Bluetooth Audio Design Center.

2018080502 / 05.08.2018 / Electronic-components / Microchip Technology Inc. /

Easily Integrate Position, Navigation and Timing Technology With Microchip’s Portfolio of GNSS Disciplined Oscillator Modules
These high-performance, small-form-factor timing systems are designed for defense applications in GNSS-denied environments

Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions for the Future of Power Management
This agreement leverages Microchip’s mSiC™ technology and Delta’s smart energy-saving solutions to accelerate the development of sustainable applications

Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
Latest achievements highlight over 60 years of space heritage and commitment to high-reliability, radiation-tolerant technology for next-generation satellite and avionics systems.

Microchip Partners with Nippon Chemi-Con and NetVision on First ASA-ML Camera Development Ecosystem for Japanese Automotive Market
Ecosystem’s camera module and development tools are based on Microchip’s VS700 family of serializers and deserializers and will help Japanese OEMs speed ASA-ML adoption in ADAS applications

Microchip Enhances Digital Signal Controller Lineup with Industry-Leading PWM Resolution and ADC Speed
The latest DSC devices with specialized peripherals for efficient power conversion target data center power supplies and other complex real-time systems

Microchip Brings Hardware Quantum Resistance to Embedded Controllers
The MEC175xB family features post-quantum cryptography, enhanced security features and low power consumption

Microchip Expands Connectivity, Storage and Compute Portfolios to Meet the Growing Demands of AI Data Center Applications
Company delivers an innovative, secure and scalable ecosystem to support modern servers

Microchip Unveils New High-Density Power Module for AI at the Edge Applications
The MCPF1412 power module with integrated I2C and PMBus® interfaces for flexible configuration and monitoring

Microchip Introduces PIC16F17576 MCU Family to Simplify Analog Sensor Design
Integrated low-power analog peripherals reduce design costs and complexity

Microchip Completes Radiation-Hardened Power MOSFET Family to MIL-PRF-19500/746 and Achieves JANSF 300 Krad Capability
Designed for extreme environments and conditions, radiation-hardened MOSFETs are available from 100 Krad to 300 Krad Total Ionizing Dose

Microchip Launches High-Reliability BR235 and BR235D Series of Power Relays for Demanding Military Applications
The 25A QPL electromechanical power relays meet the requirements of MIL-PRF-83536 specification and ISO-9001 certification

Advanced PMIC for High-Performance AI, Industrial Computing and Data Center Applications
Microchip’s MCP16701 integrates buck converters, Low Dropout Voltage Regulators (LDOs) and a controller

Company of the week

Texas Instruments

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