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Access Point WBE750
 
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Create High-Resolution Audio Devices Using Microchip’s New Bluetooth® Audio SoC with Sony’s LDAC™ Technology
Bluetooth 5-compliant SoC enables immersive audio sound in Audeze’s award-winning, high-end Mobius gaming headphones

With mainstream consumer demand for high-quality audio experiences growing, consumers expect Bluetooth audio devices to create an immersive and uninterrupted listening experience. However, Bluetooth audio designs are often limited by the bit depth and frequency rate of existing codecs, which are the communication and compression technology used to send audio over the air. Now designers of audio systems have a fully-certified, Bluetooth 5-compliant System-on-Chip (SoC) with Sony’s LDAC audio codec technology* in the IS2064GM-0L3 from Microchip Technology Inc. (NASDAQ: MCHP). The SoC allows manufacturers to develop a new generation of audio devices with an advanced codec, extending high-resolution audio beyond audiophiles and into mass market Bluetooth wireless products. Upscale headphone manufacturer, Audeze, has implemented the SoC into their high-end Mobius gaming headphone. For more information on the SoC visit: http://www.microchip.com/IS2064.

The Audeze Mobius headphone utilizes Microchip’s IS2064GM-0L3 SoC for the Bluetooth wireless connection supporting LDAC and other audio codec interfaces. Sony's LDAC is considered the highest-quality audio codec available. It transmits up to 990 kbps data throughput, which is three times higher than the standard Bluetooth Sub-band Codec (SBC), and maintains frequency and bit depth of up to 96 kHz/24-bit. The high compression and reproduction efficiency enables high-resolution audio listening experiences for Bluetooth audio devices.

“Our new Mobius headphone features many groundbreaking technologies. To ensure high-quality Bluetooth audio we implemented Microchip’s IS2064GM-0L3 SoC in our headphones,” said Sankar Thiagasamudram, CEO of Audeze. “Thanks to the outstanding support from Microchip, we were able to incorporate the LDAC codec quickly and easily into our products.”

The IS2064GM-0L3 SoC not only makes the LDAC codec available to the broader market of audio product vendors, it also allows customers to utilize Microchip’s outstanding global technical support and comprehensive development environment to assist customers with implementation and getting to market faster. The LDAC codec is also integrated into the Android 8.0 Oreo™ operating system Bluetooth stack, making the LDAC technology more widely available on the transmit side.

“Microchip enables OEMs to address consumers’ increasing demand for high-quality audio with the convenience and ubiquity of Bluetooth wireless,” said Steve Caldwell, vice president of Microchip’s wireless solutions group. “OEMs can focus on their audio product and sound quality and know that, because of Microchip, the Bluetooth wireless integration will be seamless.”

Development Tools

The IS2064GM-0L3 is available to customers upon request after approval. Development boards are also available.

Pricing and Availability

The IS2064GM-0L3 comes in an 8 x 8 mm LGA package and is available for volume production starting at $4.90 each in 10,000-unit quantities. Please contact Sony for additional licensing requirements when using LDAC technology: www.sony.net/Products/LDAC/index.html.

For additional information, contact any Microchip sales representative, visit Microchip’s website or send an email to BTAudio@microchip.com. To learn more about Microchip’s complete line of Bluetooth audio products, visit Microchip’s Bluetooth Audio Design Center.

2018080502 / 05.08.2018 / Electronic-components / Microchip Technology Inc. /

Microchip Technology Releases Qi® v2.0 Standards-Compliant dsPIC33-Based Reference Design
Wireless dual-pad charging design supports both Extended Power Profile and Magnetic Power Profile with a single controller

Microchip Technology Releases Next Generation of Easily Configurable Enterprise Storage Backplane Management Processors for Data Center and Storage Applications
Updated EEC1005 family of Universal Backplane Management devices complies with latest SFF-TA-1005 V. 1.4 specifications

Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device
A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration

Microchip’s Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
Cost-sensitive development platform helps student, beginner and seasoned designers work with emerging technologies

TimeProvider® 4500 Series Is the Industry’s First Grandmaster to Provide High-Speed Network Interfaces up to 25 Gbps
Extends Microchip’s IEEE®-1588 grandmaster portfolio and enables precise time accuracy to less than one nanosecond

Microchip Earns Certification in ISO/SAE 21434 Road Vehicle—Cybersecurity Engineering Standard from UL Solutions
Designing with certified security products can help Tier 1s and OEMs prove cybersecurity risk management compliance

The Next Evolutionary Step in Customizable Logic, Microchip Releases PIC16F13145 Family of MCUs
New Configurable Logic Block (CLB) module offers tailored hardware solutions and helps eliminate the need for external logic components

Microchip Launches 10 Multi-Channel Remote Temperature Sensors
MCP998x family represents one of the largest automotive-grade remote temperature sensor portfolios available from a single vendor

Next-Generation Family of Ethernet Switches Features Time Sensitive Networking and Scalable Port Bandwidths from 46 Gbps to 102 Gbps
Microchip’s LAN9694, LAN9696 and LAN9698 devices are integrated with High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP) for ease of design

Microchip Launches AVR® EB Family of Microcontrollers to Reduce Noise, Vibration and System Harshness in BLDC Applications
Offers a smaller, more cost-effective solution for sophisticated waveform control with increased efficiency

Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
Microchip’s SP1F and SP3F power modules are highly configurable in Silicon Carbide (SiC) or Silicon (Si) technology and now available with Press-Fit terminals

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GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


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electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


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Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

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The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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