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Nexperia announces smallest logic package that can be used without a step-down mask
Nexperia announced the four pin X2SON4 package which is the smallest logic package that can be used without requiring an expensive and fragile step-down mask. Therefore, PCB assembly is quicker, easier, more reliable and more cost-effective.

Nexperia developed the X2SON packages - part of its MicroPak package range - to provide the smallest footprint for logic functions while ensuring pad pitch remains 0.4mm or over (step-down masks are only needed under that threshold). The company’s low-power AUP, AXP, LV and LVC technology families covering over one hundred logic solutions are now available in X2SON 8, 6, 5 and 4-pin packages.

The new 4-pin X2SON4 package option reduces the footprint of the same function by 44% when compared to 5-pin X2SON5, and by up to 64% when compared to XSON packages.

Michael Lyons, senior product manager at Nexperia commented: “X2SON4 enables the release of smaller buffers and inverters, that were previously only available in 5-pin or 6-pin leadless packages. All our X2SON solutions enable miniaturization without the use of expensive and fragile step down masks.”

As packages become smaller, the pad pitch is reduced – making the use of standard assembly tools difficult. If the pitch is reduced to less than 0.4mm, thinner and delicate step down masks (stencils) are required to apply solder paste. They typically need to be replaced regularly, may also require a different, more expensive solder paste, and the placement of components may be restricted because the mask won’t work over the entire board.

X2SON packages from Nexperia require no step-down mask, thus saving manufacturing costs. In addition, the X2SON’s larger pad pitch provides greater contact area, resulting in easier component placement, as well as improved joint strength and robustness. Larger pad pitches make it easier to avoid costly assembly problems such as misaligned components, and reduce the risk of short circuits. 

The new future-proof X2SON4 logic package also features a low 0.32mm profile and low 0.6mm width and length, suiting space-constrained, portable applications such as IoT, wearables and consumer electronics. Devices are RoHS & dark-green compliant with NiPdAu leadframe finish. Ten AUP and LVC logic buffers / inverters are currently available from Nexperia in the new X2SON4 (SOT1269-2) package. For more information on Nexperia’s portfolio in X2SON packages click here or download the leaflet here. Get datasheets here from the “Products” tab.

2018082803 / 28.08.2018 / Electronic-components / NEXPERIA /

USB4 ESD devices from Nexperia provide optimum balance of protection and performance
TrEOS based protection offers industry-leading insertion and return loss to help meet tight system budgets

Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.

Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks
Rugged and reliable devices are AEC-Q101 compliant and save board space

Nexperia’s 50 µA Zener diodes portfolio extends battery-time and saves PCB space
The comprehensive product range covers every application from 1.8 V to 75 V

Nexperia introduces a range of A-selection Zener diodes for precise voltage reference with the industry’s lowest tolerance of ±1%
The comprehensive product range covers every application from 2.4 V to 75 V

Nexperia expands its wide bandgap semiconductor offering with new family of high-performance Silicon Carbide (SiC) Diodes
Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned

Nexperia delivers extremely low clamping bidirectional ESD protection devices for USB4 standard interfaces
TrEOS diodes offer industry-leading insertion loss and return loss characteristics for more robust USB4TM data transmission

Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit

Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins
New packages enable large logic functions to be included in small form factor systems

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