2019041003

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AMD Ryzen™ based congatec COM Express mo

Industry’s First Automotive USB 3.1 SmartHub with Type-C™ Support Enables 10x Faster Data Rates in Infotainment Systems
5 Gbps SmartHub IC meets the increasing connectivity needs of today’s smartphone market

As firmware updates and larger media files become more prevalent in automotive entertainment consoles, faster data rates are required to reduce upload and download times. Microchip Technology Inc. (Nasdaq: MCHP) today announced an automotive-qualified USB 3.1 Gen1 SmartHub IC, offering up to 10 times faster data rates over existing USB 2.0 solutions and reducing indexing times to improve the user experience in vehicles. To support the rising adoption of USB Type-C in the smartphone market and enable universal connectivity in vehicles, the USB7002 SmartHub IC includes interfaces for USB Type-C connectors.

As automotive manufacturers continue to add more functions to vehicles and integrate with mobile phone applications, the role of USB for reliable data transfers requires robust functionality and faster transfer speeds. Consumers expect instant responses from infotainment systems despite many functions occurring simultaneously in vehicles, from transferring mapping data to playing music and interacting with user interfaces. The 5 Gbps SuperSpeed data rates of USB 3.1 ensure higher bandwidth and maximum functionality, making it well suited for applications that require gigabit speeds for faster data streaming, data download and in-vehicle communication. The USB7002 also reduces the download time for large videos, which is ideal for vehicles that have integrated 4K dash cams.

Consumer demand for faster mobile device charging has led to the rise of USB Type-C in the smartphone industry. The USB7002 combines the benefits of USB 3.1 technology with the rising popularity of USB Type-C. The USB7002 enables direct USB Type-C connections through native Configuration Channel (CC) pin interfaces and integrated 2:1 multiplexers that support the reversible connection feature of the USB Type-C connector. 

“Microchip continues to invest in bringing devices to market that are at the forefront of USB technology in the automotive industry,” said Charles Forni, general manager of Microchip’s USB and Networking business unit. “From providing faster charging for mobile devices in the car console and backseat to introducing the industry’s first automotive USB 3.1 solution with USB Type-C compatibility, we continue to offer solutions that enhance the in-vehicle experience.”

To support the driver assistance applications that are now standard on all mobile handsets, the SmartHub ICs also include Microchip’s patented FlexConnect technology, which provides the unique ability to dynamically swap between a USB host and USB device. The SmartHub ICs also feature patented multi-host end-point reflector technology, which enables USB data to be mirrored between two USB hosts. These fundamental features enable the graphical user interface of a phone to be displayed on the vehicle’s screen and integrate with voice commands inside the car, while simultaneously charging the mobile device. This allows consumers to easily and safely use their mobile devices while driving, providing a user-friendly way to make calls, send messages and get directions while focusing on the road.  

“Consumers expect infotainment systems in today’s vehicles to instantly respond without any delay,” said Dave Atkinson, director of business development, connected mobility solutions, Molex. “We leveraged Microchip’s USB7002 with 5 Gbps SuperSpeed data rates to ensure maximum functionality in our automotive media hub.”

Development Tools

The USB7002 IC comes with a complete solution including the MPLAB® Connect Configurator hub configuration tool, evaluation boards with schematics and gerbers to reduce development time. Microchip’s USBCheck™ services allow manufacturers to verify designs and layouts prior to sending out a PCB for manufacturing, significantly accelerating time to market for their end products.  

Pricing and Availability

The USB7002-I/KDXVA0 is AEC-Q100 Grade 3 qualified and available now starting at $4.05 in volume production quantities. For additional information and to purchase products mentioned here, contact a Microchip sales representative or authorized worldwide distributor.

2019041003 / 16.04.2019 / Electronic-components / Microchip Technology Inc. /

Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions for the Future of Power Management
This agreement leverages Microchip’s mSiC™ technology and Delta’s smart energy-saving solutions to accelerate the development of sustainable applications

Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
Latest achievements highlight over 60 years of space heritage and commitment to high-reliability, radiation-tolerant technology for next-generation satellite and avionics systems.

Microchip Partners with Nippon Chemi-Con and NetVision on First ASA-ML Camera Development Ecosystem for Japanese Automotive Market
Ecosystem’s camera module and development tools are based on Microchip’s VS700 family of serializers and deserializers and will help Japanese OEMs speed ASA-ML adoption in ADAS applications

Microchip Enhances Digital Signal Controller Lineup with Industry-Leading PWM Resolution and ADC Speed
The latest DSC devices with specialized peripherals for efficient power conversion target data center power supplies and other complex real-time systems

Microchip Brings Hardware Quantum Resistance to Embedded Controllers
The MEC175xB family features post-quantum cryptography, enhanced security features and low power consumption

Microchip Expands Connectivity, Storage and Compute Portfolios to Meet the Growing Demands of AI Data Center Applications
Company delivers an innovative, secure and scalable ecosystem to support modern servers

Microchip Unveils New High-Density Power Module for AI at the Edge Applications
The MCPF1412 power module with integrated I2C and PMBus® interfaces for flexible configuration and monitoring

Microchip Introduces PIC16F17576 MCU Family to Simplify Analog Sensor Design
Integrated low-power analog peripherals reduce design costs and complexity

Microchip Completes Radiation-Hardened Power MOSFET Family to MIL-PRF-19500/746 and Achieves JANSF 300 Krad Capability
Designed for extreme environments and conditions, radiation-hardened MOSFETs are available from 100 Krad to 300 Krad Total Ionizing Dose

Microchip Launches High-Reliability BR235 and BR235D Series of Power Relays for Demanding Military Applications
The 25A QPL electromechanical power relays meet the requirements of MIL-PRF-83536 specification and ISO-9001 certification

Advanced PMIC for High-Performance AI, Industrial Computing and Data Center Applications
Microchip’s MCP16701 integrates buck converters, Low Dropout Voltage Regulators (LDOs) and a controller

Microchip Introduces Electric Two-Wheeler Ecosystem to Accelerate E-Mobility Innovation
Scalable and flexible solutions to design diverse models of e-scooters and e-bikes

Company of the week

Texas Instruments

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