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Nexperia delivers first ESD protection device for USB4
TrEOS diodes fully support USB4TM standard; devices feature low clamping, low capacitance, low leakage and very robust

Nexperia, the expert in discrete, MOSFET and GaN FET components and analog & logic ICs, today announced the PESD2V8R1BSF, industry’s first ESD protection device dedicated for the USB4TM standard with industry-leading RF performance. Of special interest to engineers designing USB4TM and Thunderbolt interfaces, the new device uses Nexperia’s TrEOS ESD protection technology with active silicon-controlled rectification. It delivers a winning combination of extremely low capacitance (down to 0.1 pF); extremely low clamping (dynamic resistance down to 0.1 Ω) and very high robustness against surge and ESD pulses (up to 20A 8/20 µs for very fast datalines). PESD2V8R1BSF comes in the ultra-low inductance SOD962 package. 

Comments Stefan Seider, product manager at Nexperia: “To avoid signal integrity issues, the PESD2V8R1BSF ESD protection diode offers extremely low insertion loss figures of -0.21 dB at 10 GHz and correspondingly low return loss figures of -17.4 dB at 10 GHz. The new ESD protection device is suitable for the higher voltage requirements of USB 3.2. This means it can be placed right behind the USB Type-C® connector to protect the coupling capacitance as well, while still being backwards compatible to USB3.2.”

TrEOS protection diodes are packaged in the very compact, very robust DSN0603-2 (SOD962) package. The advantages of this widely-used 0603 form factor are lowest inductance for fastest protection and a reduction of mechanical and thermal stress, because bond-wires are replaced by integration into the monolithic circuit.

More information on the new ESD protection device PESD2V8R1BSF including product specifications and datasheet is available at www.nexperia.com/USB4protection

2020031202 / 13.03.2020 / Electronic-components / NEXPERIA /

USB4 ESD devices from Nexperia provide optimum balance of protection and performance
TrEOS based protection offers industry-leading insertion and return loss to help meet tight system budgets

Nexperia launches new portfolio of application specific MOSFETs (ASFETs) for automotive airbags
Provides excellent transient linear mode performance using new SOA trench technology in LFPAK packaging providing designers with a smaller and more reliable choice.

Nexperia widens its offering of discrete components in miniature DFN packaging with side-wettable flanks
Rugged and reliable devices are AEC-Q101 compliant and save board space

Nexperia’s 50 µA Zener diodes portfolio extends battery-time and saves PCB space
The comprehensive product range covers every application from 1.8 V to 75 V

Nexperia introduces a range of A-selection Zener diodes for precise voltage reference with the industry’s lowest tolerance of ±1%
The comprehensive product range covers every application from 2.4 V to 75 V

Nexperia expands its wide bandgap semiconductor offering with new family of high-performance Silicon Carbide (SiC) Diodes
Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned

Nexperia delivers extremely low clamping bidirectional ESD protection devices for USB4 standard interfaces
TrEOS diodes offer industry-leading insertion loss and return loss characteristics for more robust USB4TM data transmission

Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit

Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins
New packages enable large logic functions to be included in small form factor systems

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