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Yamaichi Electronics USA Inc.
 

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MACH SYSTEMS s.r.o.
 

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Pico Technology
 

Lynred
 

Advantech
 

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SECO S.p.A.
 

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Digi-Key Electronics
 

Durakool

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DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
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An All-in-One Programmable Smart Sensor
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TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
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AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers

Nexperia delivers first ESD protection device for USB4
TrEOS diodes fully support USB4TM standard; devices feature low clamping, low capacitance, low leakage and very robust

Nexperia, the expert in discrete, MOSFET and GaN FET components and analog & logic ICs, today announced the PESD2V8R1BSF, industry’s first ESD protection device dedicated for the USB4TM standard with industry-leading RF performance. Of special interest to engineers designing USB4TM and Thunderbolt interfaces, the new device uses Nexperia’s TrEOS ESD protection technology with active silicon-controlled rectification. It delivers a winning combination of extremely low capacitance (down to 0.1 pF); extremely low clamping (dynamic resistance down to 0.1 Ω) and very high robustness against surge and ESD pulses (up to 20A 8/20 µs for very fast datalines). PESD2V8R1BSF comes in the ultra-low inductance SOD962 package. 

Comments Stefan Seider, product manager at Nexperia: “To avoid signal integrity issues, the PESD2V8R1BSF ESD protection diode offers extremely low insertion loss figures of -0.21 dB at 10 GHz and correspondingly low return loss figures of -17.4 dB at 10 GHz. The new ESD protection device is suitable for the higher voltage requirements of USB 3.2. This means it can be placed right behind the USB Type-C® connector to protect the coupling capacitance as well, while still being backwards compatible to USB3.2.”

TrEOS protection diodes are packaged in the very compact, very robust DSN0603-2 (SOD962) package. The advantages of this widely-used 0603 form factor are lowest inductance for fastest protection and a reduction of mechanical and thermal stress, because bond-wires are replaced by integration into the monolithic circuit.

More information on the new ESD protection device PESD2V8R1BSF including product specifications and datasheet is available at www.nexperia.com/USB4protection

2020031202 / 13.03.2020 / Electronic-components / NEXPERIA /

Nexperia’s 50 µA Zener diodes portfolio extends battery-time and saves PCB space
The comprehensive product range covers every application from 1.8 V to 75 V

Nexperia introduces a range of A-selection Zener diodes for precise voltage reference with the industry’s lowest tolerance of ±1%
The comprehensive product range covers every application from 2.4 V to 75 V

Nexperia expands its wide bandgap semiconductor offering with new family of high-performance Silicon Carbide (SiC) Diodes
Samples of industrial-grade 650 V, 10 A SiC Schottky diode now available. Parts with 1200 V / 6-20 A current range and automotive-grade parts also planned

Nexperia delivers extremely low clamping bidirectional ESD protection devices for USB4 standard interfaces
TrEOS diodes offer industry-leading insertion loss and return loss characteristics for more robust USB4TM data transmission

Nexperia surface-mount device passes Board Level Reliability requirements for automotive application
Reliable and rugged CFP15B clip-bond FlatPower package selected by leading Tier 1 automotive supplier for use on an engine control unit

Nexperia launches ‘Power Live’ September 21-23 2021
Participate in live discussions on GaN, MOSFETs, power diodes and bipolar transistors for automotive and industrial applications; View on-demand video demos direct from Nexperia’s labs

Nexperia receives Bosch Global Supplier Award for the second time in a row
The prestigious award for ‘Purchasing of direct materials – Mobility Solutions’ recognizes Nexperia’s collaborative partnership with Bosch

Nexperia’s new Application-Specific MOSFETs (ASFETs) for hot-swap increase SOA by 166% and slash PCB footprint by 80%
New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability and reduced system cost

World’s smallest and thinnest standard logic DHXQFN packages from Nexperia in 14, 16, 20 and 24 pins
New packages enable large logic functions to be included in small form factor systems

Nexperia’s new bipolar junction transistors in DPAK-package deliver high reliability performance for automotive and industrial applications
MJD series now available covering 2 – 8 A and 45 – 100 V and strengthening Nexperia’s power portfolio

Nexperia obtains 100% ownership of Newport Wafer Fab, to be renamed Nexperia Newport.
Welsh semiconductor plant to focus on MOSFETs, IGBT, Analog and Compound Semiconductor Automotive-grade products

ITEC emerges as independent semiconductor equipment manufacturer in time to address semiconductor shortage with highest productivity chip-assembly systems
Fastest assembly and electrical test equipment; integrated smart manufacturing solutions using Big Data and machine learning for optimised Industry 4.0

Company of the week

Yamaichi Electronics USA Inc.

Interesting video


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)


11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview


Address Book


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


MACH SYSTEMS s.r.o.


A.P.O. - ELMOS v.o.s.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics



Calendary
HANNOVER MESSE 2022, 25.4.-29.4. 2022 - “The biggest transfo
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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