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02.12.2021 0:07:11
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DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
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AMD Ryzen™ based congatec COM Express module for the industrial temperature range
congatec introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen™ Embedded V1000 Series processors for the industrial temperature range from 40°C to +85°C. It is available with optional burn-in & cold-soak stress screening service for highest reliability.

The most demanding graphics and compute workloads benefit from the modules’ 4 cores, 8 threads and 8 GPU compute units delivering the well-reputed massive processing throughput of AMD’s Zen microarchitecture in an ultra-rugged shape. The TDP is scalable from 12W to 25W enabling truly immersive 4k UHD system designs with passive cooling only. Typical applications for the new industrial-grade COM Express modules can be found in rugged edge computing with embedded vision and artificial intelligence (AI), autonomous vehicles, railcars and wagons, outdoor equipment in the oil and gas industries, mobile ambulance equipment, broadcasting vans, or in security and video surveillance, as well as base station equipment for 5G, to name just a few.

The maximum performance of the new conga-TR4 COM Express Type 6 module depends on the environmental conditions and is specified with 1.6 GHz to 2.8 GHz turbo boost in the sub-zero temperature range, and 2.0 GHz to a maximum of 3.6 GHz in the positive temperature range. The impressive performance of the ultra-rugged conga-TR4 Computer-on-Modules has been made available in a real-time capable design and also includes real-time hypervisor support by Real-Time Systems for virtual machine deployments and workload consolidation in edge computing scenarios. 

The feature set in detail

The new conga-TR4 high-performance module with COM Express Type 6 pinout is based on the latest AMD Ryzen™ Embedded V1404I multi-core processor for the industrial temperature range. It supports up to 32GB energy-efficient and fast dual-channel DDR4 memory with up to 2400 MT/s and optional ECC for maximum data security. The integrated AMD Radeon™ Vega graphics with 8 compute units marks the cutting edge of embedded graphics. It supports up to four independent displays with up to 4k UHD resolution and 10-bit HDR, as well as DirectX 12 and OpenGL 4.4 for 3D graphics. The integrated video engine enables hardware-accelerated streaming of HEVC (H.265) video in both directions. Thanks to HSA and OpenCL 2.0 support, deep learning workloads can be assigned to the GPU. In safety-critical applications, the integrated AMD Secure Processor helps with hardware-accelerated RSA, SHA, and AES encryption and decryption. 

The new conga-TR4 allows a complete USB-C implementation on the carrier board including USB 3.1 Gen 2 with 10 Gbit/s, Power Delivery and DisplayPort 1.4, for example to connect external touchscreens with a single cable. Further performance-oriented interfaces include 1x PEG 3.0 x8, 4x PCIe Gen 3 and 4x PCIe Gen 2, 3x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 8x USB 2.0, 2x SATA Gen 3, and 1x Gbit Ethernet. I/Os for SD, SPI, LPC, I²C as well as 2x legacy UART from the CPU and High Definition Audio round off the range of interfaces. The supported operating systems include Linux, Yocto 2.0 and Microsoft Windows 10, or optionally Windows 7.  

The conga-TR4 COM Express Type 6 Computer-on-Modules can be ordered in the following variants, with standard temperature range configurations also available: 

Processor Cores/Threads Clock [GHz] (Base/Boost)  L2/L3 Cache (MB)  GPU Compute Units TDP [W] 
New: AMD Ryzen
Embedded V1404I
4 / 4 2.0 /3.6 
(<0°C: 1.6/2.8)
2 / 4 8 12 - 25
AMD Ryzen
Embedded V1807B
4 / 8 3.35 / 3.75 2 / 4 11 35 - 54
AMD Ryzen
Embedded V1756B
4 / 8 3.25 / 3.60 2 / 4 8 35 - 54
AMD Ryzen
Embedded V1605B
4 / 8 2.0 / 3.6 2 / 4 8 12 - 25
AMD Ryzen
Embedded V1202B
2 / 4 2.5 / 3.4 1 / 2 3 12 - 25

More information about the new conga-TR4 high-performance COM Express Type 6 module is available at: https://www.congatec.com/en/products/com-express-type6/conga-tr4.html 

2020051501 / 15.05.2020 / Embedded / congatec AG /

congatec and SYSGO join forces
Computer-on-Modules meet functional safety and security

Real-Time Over the Air
congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices

congatec and MATRIX VISION present PCIe based high-speed vision technology
Virtually latency free vision with up to 226.5 FPS

Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus
congatec celebrates the 15th anniversary of Qseven Computer-on-Modules with the introduction of the conga-QMX8-Plus, a brand new Qseven module based on the NXP i.MX 8M Plus application processor.

Brand new Qseven upgrade: NXP i.MX 8
New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future

New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)
congatec introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor (condenamed Tiger Lake-H) for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications.

Leading edge, in more than just bandwidth
congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen Intel Core processors (formerly codenamed: Tiger Lake-H)

New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
congatec ntroduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.

congatec i.MX 8M Plus starter set for AI accelerated embedded vision applications
Fast track to NPU accelerated smart vision

congatec to expand its business in Korea
congatec announces the foundation of congatec Korea Ltd. to meet increasing customer demand in South Korea. The establishment of a new subsidiary underlines the importance of Korea for congatec’s global business success.

11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview
congatec Product Manager Andreas Bergbauer explains us his view of the congatec’s modules based on the 11th Gen Intel® Core™ processors (Intel Tiger Lake) feature high-performance CPU/GPU computer with integrated AI acceleration for critical applications that demand high-speed processing and computer vision.

congatec presents artificial intelligence platforms for medical equipment market
congatec technology makes healthcare smarter

Company of the week

HARTING

Interesting video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)


11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview


ORNO - OR-WAT-419 Power Meter [electricity consumption calculator]


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ON Semiconductor



Calendary
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
HANNOVER MESSE 2022, 25.4.-29.4. 2022 - “The biggest transfo
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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