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Pico Technology
 

Lynred
 

Advantech
 

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SECO S.p.A.
 

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AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers

Microchip Releases Newest Generation of AEC-Q101 Qualified 700 and 1200V Silicon Carbide (SiC) Schottky Barrier Diode (SBD) for Automotive Applications
Automotive Electronics Council (AEC)-Q101-qualified devices targeted at helping electric vehicles achieve the highest levels of reliability and ruggedness

As vehicle electrification continues rapid growth worldwide, innovative power technologies such as Silicon Carbide (SiC) are required for high-voltage automotive systems ranging from motors to on-board charging and DC/DC converters. Microchip Technology Inc. (Nasdaq: MCHP) today announced its newly-qualified 700 and 1200V SiC Schottky Barrier Diode (SBD) power devices, providing Electric Vehicle (EV) system designers with solutions that meet stringent automotive quality standards across a wide range of voltage, current and package options.

For EV power designers who need to increase system efficiency while maintaining high quality, Microchip’s AEC-Q101-qualified devices maximize system reliability and ruggedness and enable stable and lasting application life. The devices’ superior avalanche performance allows designers to reduce the need for external protection circuits, reducing system cost and complexity.

“As a long-time supplier to the automotive industry, Microchip’s continued expansion of automotive-capable power solutions is leading the transformation of power systems in vehicle electrification,” said Leon Gross, vice president of Microchip’s discrete product business unit. “Our focus is to provide automotive solutions that help our clients easily transition to SiC while minimizing the risk of quality, supply and support challenges.”

Microchip has been a supplier to the automotive industry for more than 25 years. The company’s SiC technology, as well as its multiple IATF 16949:2016-certified fabrication facilities, provide high-quality devices through flexible manufacturing alternatives, helping minimize risk in the supply chain. 

Through Microchip internal and third-party testing, critical reliability metrics have proven Microchip devices’ superior performance when compared to other SiC manufactured devices. Unlike other SiC devices that degrade under extreme conditions, Microchip devices have demonstrated no degradation in performance, increasing the application life. Microchip SiC solutions lead the industry in reliability and ruggedness. The company’s SiC SBD ruggedness testing demonstrates 20 percent higher energy withstand in Unclamped Inductive Switching (UIS), and among the lowest leakage currents at elevated temperatures, increasing system life and enabling a more reliable operation.

Microchip’s SiC automotive power devices complement its broad portfolio of controllers, analog and connectivity solutions providing designers with total system solutions for electric vehicles and charging stations. Microchip also provides a broad portfolio of 700, 1200 and 1700V SiC SBD and Metal Oxide Silicon Field Effect Transistor (MOSFET) power modules utilizing its newest generation of SiC die. In addition, its dsPIC® digital signal controllers deliver performance, low power consumption and flexible peripherals. Microchip’s AgileSwitch® family of digital programmable gate drivers further accelerates the process of moving from the design stage to production. These solutions also have applications across renewable, grid, industrial, transportation, medical, data center and aerospace and defense systems.

Development Tools

Microchip’s AEC-Q101-qualified SiC SBD devices are supported with SPICE and PLECS simulation models and MPLAB® Mindi Analog Simulator. Also available is a PLECS reference design model that uses Microchip’s SBDs (1200V, 50A) as part of the power stage — the Vienna 3-Phase Power Factor Correction (PFC) reference design.

Pricing and Availability

Microchip’s AEC-Q101 qualified 700 and 1200V SiC SBD devices (also available as die for power modules) for automotive applications are available now for volume production orders. For additional information, contact a Microchip sales representative, authorized worldwide distributor, or visit Microchip’s website.

2020111801 / 19.11.2020 / Electronic-components / Microchip Technology Inc. /

New In-Circuit Emulator (ICE) Boosts Productivity with Feature-Rich Programming and Debugging
Microchip’s MPLAB ICE 4 In-Circuit Emulator is a full emulation, programming and debugging system featuring wireless connectivity, power debugging and real-time code profiling using trace

High-Precision Voltage Reference IC Provides Very-Low Drift for Extended-Temperature Automotive Applications
New device completes Microchip’s family of Vref products providing increased reliability and AEC-Q100 qualification

Microchip and Acacia Collaborate to Enable Market Transition to 400G Pluggable Coherent Optics for Data Center Routing, Switching and Metro OTN Platforms
Solutions enable encrypted 100/400 GbE, FlexE and Flexible OTN interfaces for 400ZR, OpenZR+ and Open ROADM applications

Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready
New technology enables electric buses and other e-transportation power systems to meet and exceed stringent environmental conditions while maximizing efficiency

Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI
META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates

Smart High Level Synthesis (HLS) Tool Suite Enables C++ Based Algorithm Development Using Microchip’s PolarFire® FPGA Platform
Enhances Accessibility to PolarFire FPGAs for Hardware Acceleration in Edge Compute Systems

New Chip Scale Atomic Clock (CSAC) Provides Wider Operating Temperatures, Faster Warm-up and Improved Frequency Stability in Extreme Environments
Microchip’s SA65 CSAC for military and industrial systems features ultra-high precision and low power consumption

New I2C Serial EEPROM Introduces 3.4MHz High-Speed Mode Operation, Software Write-Protection and Factory Programmed Serial Numbers
Industry First 3.4 MHz I2C Serial EEPROM Closes the Gap in Trade-Offs Between SPI and I2C Protocols

Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems
Microchip’s new low-density PolarFire® devices consume half the static power of alternatives while providing world’s smallest thermal footprint

First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
Microchip’s BL1, BL2 and BL3 family, developed with the Clean Sky consortium, is qualified to stringent aerospace standards for AC-to-DC and DC-to-AC power conversion

First Single-Chip Network Synchronization Solution Provides Ultra Precise Timing for 5G Radio Access Equipment
Combines integration and performance in one compact, low-power device supported by Microchip’s widely deployed IEEE 1588 Precision Time Protocol (PTP) and synchronization algorithm software modules

Replace Silicon IGBTs with Industry’s Most Rugged Silicon Carbide Power Solutions Now Available at 1700V
Silicon carbide portfolio with 1700V MOSFET die, discrete and power module devices extend designers’ options for efficiency, power density

Company of the week

Yamaichi Electronics USA Inc.

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ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


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11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview


Address Book


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


MACH SYSTEMS s.r.o.


A.P.O. - ELMOS v.o.s.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics



Calendary
HANNOVER MESSE 2022, 25.4.-29.4. 2022 - “The biggest transfo
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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