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Microchip and Innovium Deliver Industry’s Highest-Density Secured Ethernet Switching Solution for Hyperscale Data Centers and Telecom Service Providers
Demonstrated interoperability between industry’s highest-capacity Ethernet PHY from Microchip and Innovium’s widely adopted Ethernet switch

Microchip Technology (Nasdaq: MCHP) today announced it has collaborated with Innovium to demonstrate interoperability between its META-DX1 terabit-class Ethernet Physical-Layer (PHY) devices and Innovium’s TERALYNX® 7 Ethernet switches. The accomplishment will significantly reduce both risk and development time for customers designing platform solutions that support and secure 400 Gigabit Ethernet (GbE) traffic. 

“Unprecedented bandwidth growth driven by video and enterprise service migration to the cloud continues to fuel the need for faster and more secure network connectivity to data centers,” said Babak Samimi, vice president and manager of Microchip’s communications business unit. “Leading hyperscalers have asked us to enable interoperable solutions between Innovium’s Ethernet switch and our META-DX1 Ethernet PHY. Together, we are providing an ecosystem of interoperable solutions for designing and deploying secure, high-density data center switching platforms.”

“Microchip has a unique Ethernet PHY portfolio with a rich and flexible set of capabilities,” said Amit Sanyal, vice president of marketing at Innovium. “Innovium, the leading provider of low-latency, programmable 12.8 Tbps switch silicon in the market, is excited to partner with Microchip to offer the industry a robust MACsec solution for 400 GbE connectivity that is proven and ready to deploy.”

Microchip’s META-DX1 delivers 50 percent more capacity than alternative PHY solutions while also delivering data protection and security. By offering Ethernet ports from 1 GbE to 400 GbE plus flexible Ethernet (FlexE), as well as Class C/D Precision Time Protocol (PTP) timestamping accuracy at terabit capacity, the META-DX1’s on-board MACsec encryption engine enables flexible security implementation across all Ethernet service rates. OEMs using META-DX1 can quadruple their line card capacity as compared to the previous generation – from 3.2 Terabits per second (Tbps) to 12.8 Tbps with 32 ports of 400 GbE or 128 ports of 100 GbE – while supporting key features needed by both service providers and hyperscalers.

Innovium is the only provider of robust PAM4 networking solutions with a consistent feature set for 1 to 25.6 Tbps products today, with a programmable architecture scaling to 51.2 Tbps+. It delivers unmatched telemetry, low latency, large buffers and best power efficiency. The company’s flagship production 12.8 Tbps TERALYNX 7 has enabled market-leading OEM and ODM system partners to deliver highly innovative and robust switch solutions. Top cloud and data center customers are deploying TERALYNX switches to scale their networks and benefit from the superior total cost of ownership.

The META-DX1 device family is part of an extensive product portfolio spanning the requirements for creating total system solutions, including Microchip’s PolarFire® Field Programmable Gate Arrays (FPGAs) and Microchip’s low-jitter PLLs that seamlessly support the META-DX1 with minimal developer effort. For a comprehensive overview of the total system solution for META-DX1, please see the product brief.

2020111803 / 25.11.2020 / Electronic-components / Microchip Technology Inc. /

New In-Circuit Emulator (ICE) Boosts Productivity with Feature-Rich Programming and Debugging
Microchip’s MPLAB ICE 4 In-Circuit Emulator is a full emulation, programming and debugging system featuring wireless connectivity, power debugging and real-time code profiling using trace

High-Precision Voltage Reference IC Provides Very-Low Drift for Extended-Temperature Automotive Applications
New device completes Microchip’s family of Vref products providing increased reliability and AEC-Q100 qualification

Microchip and Acacia Collaborate to Enable Market Transition to 400G Pluggable Coherent Optics for Data Center Routing, Switching and Metro OTN Platforms
Solutions enable encrypted 100/400 GbE, FlexE and Flexible OTN interfaces for 400ZR, OpenZR+ and Open ROADM applications

Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready
New technology enables electric buses and other e-transportation power systems to meet and exceed stringent environmental conditions while maximizing efficiency

Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI
META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates

Smart High Level Synthesis (HLS) Tool Suite Enables C++ Based Algorithm Development Using Microchip’s PolarFire® FPGA Platform
Enhances Accessibility to PolarFire FPGAs for Hardware Acceleration in Edge Compute Systems

New Chip Scale Atomic Clock (CSAC) Provides Wider Operating Temperatures, Faster Warm-up and Improved Frequency Stability in Extreme Environments
Microchip’s SA65 CSAC for military and industrial systems features ultra-high precision and low power consumption

New I2C Serial EEPROM Introduces 3.4MHz High-Speed Mode Operation, Software Write-Protection and Factory Programmed Serial Numbers
Industry First 3.4 MHz I2C Serial EEPROM Closes the Gap in Trade-Offs Between SPI and I2C Protocols

Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems
Microchip’s new low-density PolarFire® devices consume half the static power of alternatives while providing world’s smallest thermal footprint

First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
Microchip’s BL1, BL2 and BL3 family, developed with the Clean Sky consortium, is qualified to stringent aerospace standards for AC-to-DC and DC-to-AC power conversion

First Single-Chip Network Synchronization Solution Provides Ultra Precise Timing for 5G Radio Access Equipment
Combines integration and performance in one compact, low-power device supported by Microchip’s widely deployed IEEE 1588 Precision Time Protocol (PTP) and synchronization algorithm software modules

Replace Silicon IGBTs with Industry’s Most Rugged Silicon Carbide Power Solutions Now Available at 1700V
Silicon carbide portfolio with 1700V MOSFET die, discrete and power module devices extend designers’ options for efficiency, power density

Company of the week

Yamaichi Electronics USA Inc.

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New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)


11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview


Address Book


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


MACH SYSTEMS s.r.o.


A.P.O. - ELMOS v.o.s.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics



Calendary
HANNOVER MESSE 2022, 25.4.-29.4. 2022 - “The biggest transfo
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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