Address Book
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

Digi-Key Electronics
 

AERS

28.03.2024 0:07:07
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Pneumatic
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Trade fairs, Events
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

Microchip and Innovium Deliver Industry’s Highest-Density Secured Ethernet Switching Solution for Hyperscale Data Centers and Telecom Service Providers
Demonstrated interoperability between industry’s highest-capacity Ethernet PHY from Microchip and Innovium’s widely adopted Ethernet switch

Microchip Technology (Nasdaq: MCHP) today announced it has collaborated with Innovium to demonstrate interoperability between its META-DX1 terabit-class Ethernet Physical-Layer (PHY) devices and Innovium’s TERALYNX® 7 Ethernet switches. The accomplishment will significantly reduce both risk and development time for customers designing platform solutions that support and secure 400 Gigabit Ethernet (GbE) traffic. 

“Unprecedented bandwidth growth driven by video and enterprise service migration to the cloud continues to fuel the need for faster and more secure network connectivity to data centers,” said Babak Samimi, vice president and manager of Microchip’s communications business unit. “Leading hyperscalers have asked us to enable interoperable solutions between Innovium’s Ethernet switch and our META-DX1 Ethernet PHY. Together, we are providing an ecosystem of interoperable solutions for designing and deploying secure, high-density data center switching platforms.”

“Microchip has a unique Ethernet PHY portfolio with a rich and flexible set of capabilities,” said Amit Sanyal, vice president of marketing at Innovium. “Innovium, the leading provider of low-latency, programmable 12.8 Tbps switch silicon in the market, is excited to partner with Microchip to offer the industry a robust MACsec solution for 400 GbE connectivity that is proven and ready to deploy.”

Microchip’s META-DX1 delivers 50 percent more capacity than alternative PHY solutions while also delivering data protection and security. By offering Ethernet ports from 1 GbE to 400 GbE plus flexible Ethernet (FlexE), as well as Class C/D Precision Time Protocol (PTP) timestamping accuracy at terabit capacity, the META-DX1’s on-board MACsec encryption engine enables flexible security implementation across all Ethernet service rates. OEMs using META-DX1 can quadruple their line card capacity as compared to the previous generation – from 3.2 Terabits per second (Tbps) to 12.8 Tbps with 32 ports of 400 GbE or 128 ports of 100 GbE – while supporting key features needed by both service providers and hyperscalers.

Innovium is the only provider of robust PAM4 networking solutions with a consistent feature set for 1 to 25.6 Tbps products today, with a programmable architecture scaling to 51.2 Tbps+. It delivers unmatched telemetry, low latency, large buffers and best power efficiency. The company’s flagship production 12.8 Tbps TERALYNX 7 has enabled market-leading OEM and ODM system partners to deliver highly innovative and robust switch solutions. Top cloud and data center customers are deploying TERALYNX switches to scale their networks and benefit from the superior total cost of ownership.

The META-DX1 device family is part of an extensive product portfolio spanning the requirements for creating total system solutions, including Microchip’s PolarFire® Field Programmable Gate Arrays (FPGAs) and Microchip’s low-jitter PLLs that seamlessly support the META-DX1 with minimal developer effort. For a comprehensive overview of the total system solution for META-DX1, please see the product brief.

2020111803 / 25.11.2020 / Electronic-components / Microchip Technology Inc. /

Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device
A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration

Microchip’s Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
Cost-sensitive development platform helps student, beginner and seasoned designers work with emerging technologies

TimeProvider® 4500 Series Is the Industry’s First Grandmaster to Provide High-Speed Network Interfaces up to 25 Gbps
Extends Microchip’s IEEE®-1588 grandmaster portfolio and enables precise time accuracy to less than one nanosecond

Microchip Earns Certification in ISO/SAE 21434 Road Vehicle—Cybersecurity Engineering Standard from UL Solutions
Designing with certified security products can help Tier 1s and OEMs prove cybersecurity risk management compliance

The Next Evolutionary Step in Customizable Logic, Microchip Releases PIC16F13145 Family of MCUs
New Configurable Logic Block (CLB) module offers tailored hardware solutions and helps eliminate the need for external logic components

Microchip Launches 10 Multi-Channel Remote Temperature Sensors
MCP998x family represents one of the largest automotive-grade remote temperature sensor portfolios available from a single vendor

Next-Generation Family of Ethernet Switches Features Time Sensitive Networking and Scalable Port Bandwidths from 46 Gbps to 102 Gbps
Microchip’s LAN9694, LAN9696 and LAN9698 devices are integrated with High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP) for ease of design

Microchip Launches AVR® EB Family of Microcontrollers to Reduce Noise, Vibration and System Harshness in BLDC Applications
Offers a smaller, more cost-effective solution for sophisticated waveform control with increased efficiency

Automate Installation Process with Press-Fit Terminal Power Modules for a Solder-Free Solution in High-Volume Manufacturing
Microchip’s SP1F and SP3F power modules are highly configurable in Silicon Carbide (SiC) or Silicon (Si) technology and now available with Press-Fit terminals

Microchip Unveils New Standard of Enhanced Code Security With the PIC18-Q24 Family of MCUs
Added voltage level shifting capabilities help increase flexibility and reduce system costs

To Meet And Exceed Heightened Automotive Secure Authentication Requirements, Microchip Releases Its Latest TrustAnchor Security IC
Available as a CryptoAuthentication™ or CryptoAutomotive™ Secure IC, the new TA101 device focuses on larger key sizes and enhanced cybersecurity requirements

Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


MOXA


DANFOSS


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813