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AMD Ryzen™ based congatec COM Express mo

More power for low power 24/7 systems
congatec doubles performance with AMD Ryzen™ Embedded V2000 processor

congatec – a leading vendor of embedded and edge computing technology – introduces the conga-TCV2, a brand new COM Express Compact Computer-on-Module based on AMD Ryzen™ Embedded V2000 processors. With double the performance compared to the earlier launched AMD Ryzen™ Embedded V1000, the module is setting a new performance per watt benchmark, which finds its sweetest spot in 15 Watt TDP designs[1]. This extraordinary low power platform performance has been validated using real-world cross-platform test suite Cinebench R15 nt. Compared to modules with AMD Ryzen Embedded V1608B processors, conga-TCV2 modules deliver a performance plus of 97% (V2516) to 140% (V2718) with up to 8 cores. Due to the new 7nm Zen 2 cores, single core performance also increased between 25% and 35%, making the new modules a perfect candidate for performance improvements in 24/7 connected and fanless embedded systems operating at the various industrial edges. Typical applications include multi-functional industrial edge gateways, digital signage systems, gaming terminals and infotainment platforms. With up to 40% more GPU capabilities[2] for up to 4x 4k60 graphics at 15 Watt and comprehensive GPGPU support, multi-headed medical imaging systems in the operating theater as well machine vision and machine learning systems are further target markets.

“While the new AMD Ryzen Embedded V2000 processor enhancements can be utilized in actively cooled systems with 54 Watt TDP, we see a significant number of customers with fanless and passively cooled systems operating at 15 Watt TDP or even lower. The goal to operate under such tight constraints is to enable highly rugged, sealed systems for reliable 24/7 operation in harsh environments. In those applications performance per watt improvements are welcomed with open arms, and the Zen 2 x86 CPU and the AMD Radeon™ graphics cores offer extraordinary scores in this area,” explains Martin Danzer, Director of Product Management at congatec. 

Next to stationary equipment, solar powered stationary, mobile and autonomous systems also welcome the low power values of the new AMD Ryzen Embedded V2000 processor based Computer-on-Modules, which can be configured down to as low as 10 Watt cTDP. This is significant because the productive operation time without re-charging extends the lower the TPD is. Competing 10 Watt TDP platforms with 4 cores offer only half the core count, which puts them into an entirely different, significantly weaker performance league. Other 15 Watt TPD platforms also have just 4 cores but without the ability to scale down the TPD, which limits the platform balancing options. The AMD Ryzen V2000 Embedded processors, on the other hand, offer an ultra broad performance range from 10 Watt up to 54 Watt on the basis of this single processor architecture. 

The feature set in detail

The new conga-TCV2 high-performance COM Express Compact modules with Type 6 pinout are based on the latest AMD Ryzen Embedded V2000 multi-core processors and will become available in 4 different flavors: 

Processor Cores/Threads Clock [GHz] (Base/Boost) [3] L2/L3 Cache (MB) GPU Compute Units TDP [W]
AMD Ryzen™ Embedded V2748 8 / 16 2.9 / 4.25 4 / 8 7 35 – 54
AMD Ryzen™ Embedded V2718 8 / 16 1.7 / 4.15 4 / 8 7 10 – 25
AMD Ryzen™ Embedded V2546 6 / 12 3.0 / 3.95 3 / 6 6 35 – 54
AMD Ryzen™ Embedded V2516 6 / 12 2.1 / 3.95 3 / 6 6 10 – 25

These modules offer up to double the compute performance per watt and double the core count over previous generations. Thanks to symmetrical multiprocessing capabilities, they also provide particularly high parallel processing performance with up to 16 threads. The modules feature 4MB L2 cache, 8MB L3 cache, and up to 32GB energy-efficient and fast dual-channel 64-bit DDR4 memory with up to 3200 MT/s and ECC support for maximum data security. The integrated AMD Radeon graphics with up to 7 compute units continues to support applications and use cases that need high-performance graphics computing.

The conga-TCV2 Computer-on-Module supports up to four independent displays with up to 4k60 UHD resolution over 3x DisplayPort 1.4/HDMI 2.1 and 1x LVDS/eDP. Further performance-oriented interfaces include 1x PEG 3.0 x8 and 8x PCIe Gen 3 Lanes, 4x USB 3.1, up to 8x USB 2.0, up to 2x SATA Gen 3, 1x Gbit Ethernet, 8 GPOIs I/Os, SPI, LPC, as well as 2x legacy UART provided by the board controller. 

The supported hypervisor and operating systems include RTS Hypervisor as well as Microsoft Windows 10, Linux/Yocto, Android Q and Wind River VxWorks. For safety-critical applications, the integrated AMD Secure Processor helps with hardware-accelerated encryption and decryption of RSA, SHA and AES. TPM support is onboard as well. 

More information about the new conga-TCV2 high-performance COM Express Compact Type 6 module is available at:
http://www.congatec.com/en/products/com-express-type6/conga-TCV2/

2021051101 / 11.05.2021 / Embedded / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

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