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congatec presents artificial intelligence platforms for medical equipment market
congatec technology makes healthcare smarter

Deggendorf, Germany, May 13, 2021 * * * congatec – a leading vendor of embedded and edge computing technology – will exhibit for the first time at China International Medical Equipment Fair (CMEF, Shanghai, May 13-16, Booth # 4.1P26). The congatec CMEF showcase will put the spotlight on the latest embedded computing and artificial intelligence (AI) technologies for medical imaging and diagnostics, operating theaters as well as mobile emergency and intensive care equipment. Advanced technologies are driving the demand for AI from pharmaceutical companies to hospitals, with the healthcare AI market forecast to grow at a compound annual growth rate (CAGR) of 43.6% by 2027.[1] congatec's embedded computing technologies provide the essential foundation for the development of such intelligent healthcare systems.

“Empowered by embedded computing, artificial intelligence is accelerating the speed of insights from medical imaging and big data analytics to improve patient health forecasts and early detection of diseases. The digitization of healthcare has the potential to radically change patient care and to significantly reduce healthcare costs. We equip developers of intelligent medical devices and healthcare solutions with appropriate application-ready building blocks to enable them to quickly and efficiently turn their smart solutions into reality,” says Fred Barden, Vice President, Worldwide Sales at congatec. 

congatec will be showcasing the entire spectrum of its latest embedded computer technologies and AI ecosystems at CMEF. Product highlights include Intel® Core™ and Intel Atom® processor (codename Tiger Lake and Elkhart Lake) based solutions with OpenVino™ implementations as well as the NXP i.MX8 portfolio with integrated neural processing unit (NPU). For medical device engineers, it is of utter importance to understand the different solution approaches to identify the best platform and ecosystem for their dedicated systems. Whatever their choice, congatec’s personal integration support simplifies the design-in of any of these platforms. 

Another important strategic lever for medical device engineers is the congatec product showcase around the new PICMG COM-HPC Computer-on-Module standard. This standard is built to fuel the development of the next-generation of connected medical computers and edge servers with massive bandwidth and connectivity no other Computer-on-Module standard can offer. congatec delivers entire solution platforms for this new COM-HPC standard – from Computer-on-Modules with the right cooling solutions for all performance levels, to application-ready carrier boards designed for the specific needs of OEM customers. 

For more information about congatec’s AI solutions for the healthcare sector, please visit CMEF Booth # 4.1P26 or our webpage https://www.congatec.com/en/industries/medical-technology/

2021051701 / 17.05.2021 / Various / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

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