Address Book
 

Yamaichi Electronics USA Inc.
 

PICMG
 

Laird Thermal Systems
 

HARTING
 

Jenoptik
 

MACH SYSTEMS s.r.o.
 

A.P.O. - ELMOS v.o.s.
 

Pico Technology
 

Lynred
 

Advantech
 

EBV
 

SECO S.p.A.
 

Crowd Supply
 

Digi-Key Electronics
 

Durakool

28.01.2022 0:07:38
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Various

DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers

11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview
congatec Product Manager Andreas Bergbauer explains us his view of the congatec’s modules based on the 11th Gen Intel® Core™ processors (Intel Tiger Lake) feature high-performance CPU/GPU computer with integrated AI acceleration for critical applications that demand high-speed processing and computer vision.

 

 

 

Subscribe for more videos here: https://www.youtube.com/congatecAE

 

2021052401 / 25.05.2021 / Interesting video / congatec AG /

Intel Alder Lake Product Video
Check out the new congatec Alder Lake video showing you performance gains and improvements to accelerate the world of embedded and real-time edge computing systems.

A quantum leap in core count
congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors

congatec announces changes in top management to further accelerate company growth
Dr. Dirk Haft is new CEO, Daniel Jürgens new CFO

congatec opens virtual trade show booth for interactive information exchange
Round-the-clock accessibility

congatec and SYSGO join forces
Computer-on-Modules meet functional safety and security

Real-Time Over the Air
congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices

congatec and MATRIX VISION present PCIe based high-speed vision technology
Virtually latency free vision with up to 226.5 FPS

Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus
congatec celebrates the 15th anniversary of Qseven Computer-on-Modules with the introduction of the conga-QMX8-Plus, a brand new Qseven module based on the NXP i.MX 8M Plus application processor.

Brand new Qseven upgrade: NXP i.MX 8
New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future

New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)
congatec introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor (condenamed Tiger Lake-H) for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications.

Leading edge, in more than just bandwidth
congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen Intel Core processors (formerly codenamed: Tiger Lake-H)

New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
congatec ntroduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.

Company of the week

Yamaichi Electronics USA Inc.

Interesting video


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)


11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview


Address Book


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


MACH SYSTEMS s.r.o.


A.P.O. - ELMOS v.o.s.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics



Calendary
HANNOVER MESSE 2022, 25.4.-29.4. 2022 - “The biggest transfo
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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