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congatec i.MX 8M Plus starter set for AI accelerated embedded vision applications
Fast track to NPU accelerated smart vision

congatec – a leading vendor of embedded and edge computing technology – extends its i.MX 8 ecosystem with a new starter set for AI accelerated intelligent embedded vision applications. Based on a SMARC Computer-on-Module with i.MX 8M Plus processor, the starter set’s sweet spot is the utilization of the new processor integrated NXP Neural Processing Unit (NPU). Delivering up to 2.3 TOPS of performance for deep learning based artificial intelligence, it can run inference engines and libraries such as Arm Neural Network (NN) and TensorFlow Lite. It also integrates seamlessly with Basler embedded vision software to give OEMs an application ready solution platform for the development of next-generation AI accelerated embedded vision systems. Typical applications are wide ranging, from price sensitive automated checkout terminals in retail to building safety, and from in-vehicle vision for navigation to surveillance systems in busses. Industrial use cases include HMIs with vision based user identification and gesture based machine operation as well as vision supported robotics and industrial quality inspection systems.

“A dedicated processing unit for neural algorithms that is supported by open source AI software solutions such as TensorFlow is an efficiency accelerator for many vision based systems. And when all this is integrated as an application ready, hardware and software validated platform including Basler pylon Camera Software Suite, it puts developers on a fast track to designing NPU accelerated smart vision applications,” explains Martin Danzer, Director Product Management at congatec.

The Basler pylon Camera Software Suite delivers a unified SDK for BCON for MIPI, USB3 vision and GigE vision cameras, and enables camera access from source code, GUI or 3rd party software. The high-performance pylon viewer is perfect for camera evaluation. Thanks to integration in the congatec i.MX 8M Plus starter set for AI accelerated vision applications, engineers get instant access to important AI supported machine vision features such as triggering, individual image capture, and highly differentiated camera configuration options plus easy access to customized inference algorithms on the basis of the Arm NN and TensorFlow Lite ecosystem.

The feature set in detail

The new starter set for AI accelerated vision applications contains the entire ecosystem developers need to instantly start designing applications on the basis of this next-generation platform, which offers highly efficient vision and AI integration. At the heart of the set is the new SMARC 2.1 Computer-on-Module conga-SMX8-Plus. It features 4 powerful Arm Cortex®-A53 cores, 1x Arm Cortex®-M72 controller and the NXP NPU to accelerate deep learning algorithms at the edge and comes with passive cooling. The 3.5 inch carrier board conga-SMC1/SMARC-ARM directly connects the 13 MP Basler dart daA4200-30mci BCON for MIPI camera with an F1.8 f4mm lens via MIPI CSI-2.0 without any additional converter modules. Next to MIPI CSI-2.0, USB and GigE vision cameras are also supported. On the software side, congatec provides a bootable SD card with preconfigured boot loader, Yocto OS image, matching BSPs, and processor-optimized Basler embedded vision software enabling immediate AI inference training on the basis of captured images and video sequences.


Further information on congatec’s ecosystem for i.MX 8 based designs can be found at: https://www.congatec.com/imx8
 

congatec will be presenting its comprehensive ecosystem for the i.MX 8 processor range at the virtual NXP Technology Days from June 8 to June 30: https://www.nxp.com/design/training/nxp-technology-days/nxp-technology-days-connectivity:NXP-TECHNOLOGY-DAYS-CONNECTIVITY

2021060902 / 10.06.2021 / Embedded / congatec AG /

Intel Alder Lake Product Video
Check out the new congatec Alder Lake video showing you performance gains and improvements to accelerate the world of embedded and real-time edge computing systems.

A quantum leap in core count
congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors

congatec announces changes in top management to further accelerate company growth
Dr. Dirk Haft is new CEO, Daniel Jürgens new CFO

congatec opens virtual trade show booth for interactive information exchange
Round-the-clock accessibility

congatec and SYSGO join forces
Computer-on-Modules meet functional safety and security

Real-Time Over the Air
congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices

congatec and MATRIX VISION present PCIe based high-speed vision technology
Virtually latency free vision with up to 226.5 FPS

Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus
congatec celebrates the 15th anniversary of Qseven Computer-on-Modules with the introduction of the conga-QMX8-Plus, a brand new Qseven module based on the NXP i.MX 8M Plus application processor.

Brand new Qseven upgrade: NXP i.MX 8
New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future

New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)
congatec introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor (condenamed Tiger Lake-H) for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications.

Leading edge, in more than just bandwidth
congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen Intel Core processors (formerly codenamed: Tiger Lake-H)

New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
congatec ntroduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.

Company of the week

Yamaichi Electronics USA Inc.

Interesting video


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)


11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview


Address Book


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


MACH SYSTEMS s.r.o.


A.P.O. - ELMOS v.o.s.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics



Calendary
HANNOVER MESSE 2022, 25.4.-29.4. 2022 - “The biggest transfo
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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