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First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
Microchip’s BL1, BL2 and BL3 family, developed with the Clean Sky consortium, is qualified to stringent aerospace standards for AC-to-DC and DC-to-AC power conversion

In the race to reduce aircraft emissions, developers increasingly are moving toward more efficient designs including electrical systems that replace today’s pneumatics and hydraulics powering everything from on-board alternators to actuators and Auxiliary Power Units (APUs). To enable next-generation aircraft electrical systems, new power conversion technology is required. Microchip Technology Inc. (Nasdaq: MCHP) today announced its development with Clean Sky, a joint European Commission (EC) and industry consortium, of the first aerospace-qualified baseless power modules enabling higher-efficiency, lighter and more compact power conversion and motor drive systems.

Partnering with Clean Sky to support aerospace industry goals set by the EC for stricter emission standards that result in climate neutral aviation by 2050, Microchip’s BL1, BL2 and BL3 family of baseless power modules provides greater efficiency in AC-to-DC and DC-to-AC power conversion and generation through the integration of its silicon carbide power semiconductor technology. Forty-percent lighter than others due to the modified substrate, the innovative design also produces an approximate 10% cost savings over standard power modules that incorporate metal baseplates. Microchip’s BL1, BL2, and BL3 devices meet all mechanical and environmental compliance guidelines set forth in RTCA DO-160G, the “Environmental Conditions and Test Procedures for Airborne Equipment,” Version G (August 2010). RTCA is the industry consortium that develops consensus on critical aviation modernization issues.

The modules are available in low-profile, low-inductance packaging with power and signal connectors that designers can solder directly on printed circuit boards, helping to speed development and increase reliability. And, the same height between the modules in the family enables them to be paralleled or connected in a three-phase bridge and other topologies to achieve higher-performing power converters and inverters.

”Microchip’s powerful new modules will help to drive innovation in aircraft electrification and, ultimately, progress toward a future of lower emissions,” said Leon Gross, vice president of Microchip’s discrete products business unit. “This is an enabling technology for the systems ushering in a new era of flight.”

The family incorporates silicon carbide MOSFETs and Schottky Barrier Diodes (SBDs) to maximize system efficiency. In packages delivering 100W to more than 10 KW of power, the BL1, BL2, and BL3 family is available in numerous topology options including phase leg, full bridge, asymmetric bridge, boost, buck and dual common source. These high-reliability power modules are available in voltage ranges from 600V to 1200V in silicon carbide MOSFETs and IGBTs to 1600V for rectifier diodes.

Microchip’s power module technology as well as its ISO 9000- and AS9100-certified fabrication facilities provide high-quality units through flexible manufacturing alternatives.

While introducing new innovations the company also teams with system manufacturers and integrators on obsolescence management, supporting customers’ efforts to minimize redesign work and lengthen life cycles, thereby reducing overall system costs.

The company’s baseless power modules complement its aerospace portfolio of motor drive controllers, storage integrated circuits, Field Programmable Gate Arrays (FPGAs), microcontrollers (MCUs), microprocessors (MPUs), timing products, semiconductors and point-of-load regulators – providing designers with total system solutions for a wide variety of aerospace and defense applications. Microchip also provides a full portfolio of silicon carbide technology solutions for aerospace, automotive and industrial applications.

Development Tools

Microchip provides end-to-end design support to accelerate time to market including analysis, qualification and production. Designers can obtain numerous analysis and qualification reports on demand.

Availability

Microchip’s BL1, BL2 and BL3 baseless power modules are available as 75A and 145A silicon carbide MOSFET, 50A as IGBT, and 90A as rectifier diode outputs.

For additional information, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s website. To purchase products mentioned here visit Microchip’s purchasing portal.

2021080902 / 12.08.2021 / Electronic-components / Microchip Technology Inc. /

New In-Circuit Emulator (ICE) Boosts Productivity with Feature-Rich Programming and Debugging
Microchip’s MPLAB ICE 4 In-Circuit Emulator is a full emulation, programming and debugging system featuring wireless connectivity, power debugging and real-time code profiling using trace

High-Precision Voltage Reference IC Provides Very-Low Drift for Extended-Temperature Automotive Applications
New device completes Microchip’s family of Vref products providing increased reliability and AEC-Q100 qualification

Microchip and Acacia Collaborate to Enable Market Transition to 400G Pluggable Coherent Optics for Data Center Routing, Switching and Metro OTN Platforms
Solutions enable encrypted 100/400 GbE, FlexE and Flexible OTN interfaces for 400ZR, OpenZR+ and Open ROADM applications

Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready
New technology enables electric buses and other e-transportation power systems to meet and exceed stringent environmental conditions while maximizing efficiency

Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI
META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates

Smart High Level Synthesis (HLS) Tool Suite Enables C++ Based Algorithm Development Using Microchip’s PolarFire® FPGA Platform
Enhances Accessibility to PolarFire FPGAs for Hardware Acceleration in Edge Compute Systems

New Chip Scale Atomic Clock (CSAC) Provides Wider Operating Temperatures, Faster Warm-up and Improved Frequency Stability in Extreme Environments
Microchip’s SA65 CSAC for military and industrial systems features ultra-high precision and low power consumption

New I2C Serial EEPROM Introduces 3.4MHz High-Speed Mode Operation, Software Write-Protection and Factory Programmed Serial Numbers
Industry First 3.4 MHz I2C Serial EEPROM Closes the Gap in Trade-Offs Between SPI and I2C Protocols

Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems
Microchip’s new low-density PolarFire® devices consume half the static power of alternatives while providing world’s smallest thermal footprint

First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
Microchip’s BL1, BL2 and BL3 family, developed with the Clean Sky consortium, is qualified to stringent aerospace standards for AC-to-DC and DC-to-AC power conversion

First Single-Chip Network Synchronization Solution Provides Ultra Precise Timing for 5G Radio Access Equipment
Combines integration and performance in one compact, low-power device supported by Microchip’s widely deployed IEEE 1588 Precision Time Protocol (PTP) and synchronization algorithm software modules

Replace Silicon IGBTs with Industry’s Most Rugged Silicon Carbide Power Solutions Now Available at 1700V
Silicon carbide portfolio with 1700V MOSFET die, discrete and power module devices extend designers’ options for efficiency, power density

Company of the week

Yamaichi Electronics USA Inc.

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Address Book


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


MACH SYSTEMS s.r.o.


A.P.O. - ELMOS v.o.s.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics



Calendary
HANNOVER MESSE 2022, 25.4.-29.4. 2022 - “The biggest transfo
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

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The ISS Design Challenge ...

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Mouser Electronics Warehouse Tour with Grant Imahara



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