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Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems
Microchip’s new low-density PolarFire® devices consume half the static power of alternatives while providing world’s smallest thermal footprint

Edge compute systems need compact programmable devices with low power consumption and a small enough thermal footprint to eliminate fans and other heat mitigation while providing robust compute horsepower. Microchip Technology Inc. (Nasdaq: MCHP) has solved this challenge by cutting static power consumption for its mid-bandwidth Field Programmable Gate Arrays (FPGAs) and FPGA System-on-Chip (SoC) devices in half and giving them the smallest thermal footprint and best performance and compute horsepower compared to all alternative devices in their class.

“Our new PolarFire FPGAs and FPGA SoCs reduce our customers’ system costs while enabling them to solve difficult thermal management challenges without having to forfeit bandwidth,” said Bruce Weyer, vice president of Microchip’s FPGA business unit. “The award-winning PolarFire FPGA platform already delivered the industry’s best combination of power and performance, and now we have reduced power consumption by up to 50 percent or more with the introduction of lower density offerings, while maintaining best-in-class capabilities on these platforms. No other offering in this class can match these capabilities.”

With their ultra-low power consumption, Microchip’s latest low-density PolarFire FPGAs (MPF050T) and PolarFire SoC (MPFS025T) additions exceed the performance/power metrics of any low-density FPGA or SoC FPGA alternatives in the market, with fast FPGA fabric and signal processing capabilities, the most capable transceivers and the industry’s only hardened application class RISC-V® architecture-based processor complex with 2 megabytes (MB) of L2 cache and Low-Power DDR4 (LPDDR4) memory support. Extending the portfolio with a 25K logic elements multi-core RISC-V SoC and a 50K logic elements FPGA opens new application possibilities. They are ideal for low-power smart embedded vision applications and thermally constrained automotive, industrial automation, communications, defense and IoT systems where neither power nor performance can be compromised.

The new PolarFire devices are complemented by a suite of Microchip devices for complete systems solutions for applications including smart embedded vision, machine learning, security, aerospace and defense, and embedded compute. They also provide plug-and-play solutions for power and timing designs. Lead customers are using the PolarFire devices to solve a variety of design challenges.

“As one of the world’s major suppliers of video converter hardware and software, we are always striving to meet demanding market requirements as we work with our customers to enable exciting new use cases,” said Nick Ma, CEO and CTO at Magewell. “Microchip’s PolarFire FPGA solution expands our opportunities to innovate with our USB 3.2 video capture product line. It offers ideal dimensions, industry-low power consumption and a unique combination of mid-range transceivers, logic, DSP and RAM resources.”

“Xenics is a pioneer in infrared imaging technology with a 20-year legacy of delivering a best-in-class portfolio of short-wave, mid-wave and long-wave infrared imagers, cores and cameras. SWaP (Size, Weight and Power) are extremely important considerations while designing a thermal imaging system,” said Frederic Aubrun, CCO of Xenics. “These are key differentiating capabilities for our customers. Microchip’s SmartFusion®2 and PolarFire FPGAs provide us the best balance between small form factor, power efficiency and processing resources required to support embedded algorithms like shutter-less compensation and image enhancement within an extremely low power budget in our current and next-generation product portfolios.”

“Kaya Instruments prides itself in designing industrial-grade, small-form-factor, low-power cameras that are capable of providing the best quality video under most challenging and severe conditions,” said Michael Yamposkly, Founder and CEO of Kaya Instruments. “The PolarFire FPGA-based Iron cameras utilize the FPGA’s small form factor and low-power performance to offer a compact outline that can be fitted into tight spaces while presenting the magnificent quality of the most advanced global-shutter CMOS sensor with excellent low-light performance.”

Availability

Developers can begin designing with Microchip’s PolarFire FPGAs and FPGA SoCs now using the company’s recently released Libero® 2021.2 software tools, which are available on the company’s website. Volume shipment of production silicon is scheduled for the first calendar quarter of 2022. Complete product information is available here.

2021082001 / 20.08.2021 / Electronic-components / Microchip Technology Inc. /

Microchip Technology Expands TrustFLEX Family with CEC1736 Real-time Platform Root of Trust Devices
TrustFLEX devices along with the Trust Platform Design Suite tool will simplify the enablement of root of trust from concept to production in wide range of applications

Microchip Technology Releases Qi® v2.0 Standards-Compliant dsPIC33-Based Reference Design
Wireless dual-pad charging design supports both Extended Power Profile and Magnetic Power Profile with a single controller

Microchip Technology Releases Next Generation of Easily Configurable Enterprise Storage Backplane Management Processors for Data Center and Storage Applications
Updated EEC1005 family of Universal Backplane Management devices complies with latest SFF-TA-1005 V. 1.4 specifications

Microchip Launches New dsPIC® DSC-Based Integrated Motor Drivers that Bring Controllers, Gate Drivers and Communications to a Single Device
A corresponding ecosystem of support tools will help simplify motor control system development and accelerate time to market

Microchip Expands its mSiC™ Solutions with the 3.3 kV XIFM Plug-and-Play mSiC Gate Driver to Accelerate the Adoption of High-Voltage SiC Power Modules
The highly integrated 3.3 kV XIFM plug-and-play digital gate driver is designed to work out-of-the-box with high-voltage SiC-based power modules to simplify and speed system integration

Microchip’s Low-Cost PolarFire® SoC Discovery Kit Makes RISC-V and FPGA Design More Accessible for a Wider Range of Embedded Engineers
Cost-sensitive development platform helps student, beginner and seasoned designers work with emerging technologies

TimeProvider® 4500 Series Is the Industry’s First Grandmaster to Provide High-Speed Network Interfaces up to 25 Gbps
Extends Microchip’s IEEE®-1588 grandmaster portfolio and enables precise time accuracy to less than one nanosecond

Microchip Earns Certification in ISO/SAE 21434 Road Vehicle—Cybersecurity Engineering Standard from UL Solutions
Designing with certified security products can help Tier 1s and OEMs prove cybersecurity risk management compliance

The Next Evolutionary Step in Customizable Logic, Microchip Releases PIC16F13145 Family of MCUs
New Configurable Logic Block (CLB) module offers tailored hardware solutions and helps eliminate the need for external logic components

Microchip Launches 10 Multi-Channel Remote Temperature Sensors
MCP998x family represents one of the largest automotive-grade remote temperature sensor portfolios available from a single vendor

Next-Generation Family of Ethernet Switches Features Time Sensitive Networking and Scalable Port Bandwidths from 46 Gbps to 102 Gbps
Microchip’s LAN9694, LAN9696 and LAN9698 devices are integrated with High-availability Seamless Redundancy (HSR) and Parallel Redundancy Protocol (PRP) for ease of design

Microchip Launches AVR® EB Family of Microcontrollers to Reduce Noise, Vibration and System Harshness in BLDC Applications
Offers a smaller, more cost-effective solution for sophisticated waveform control with increased efficiency

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Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

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