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Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI
META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates

Routers, switches and line cards need higher bandwidth, port density and up to 800 Gigabit Ethernet (GbE) connectivity to handle escalating data center traffic driven by 5G, cloud services and Artificial Intelligence (AI) and Machine Learning (ML) applications. To deliver the higher bandwidth, these designs need to overcome the signal integrity challenges associated with the industry’s transition to the 112G (gigabits per second) PAM4 Serializer/Deserializer (SerDes) connectivity that is needed to support the latest pluggable optics, system backplanes and packet processors. These challenges can now be overcome with the industry’s most compact, 1.6T (terabits per second), low-power PHY (physical layer) solution from Microchip Technology Inc. (Nasdaq: MCHP) with its PM6200 META-DX2L that reduces power per port by 35 percent compared to its 56G PAM4 predecessor, META-DX1, the industry’s first terabit-scale PHY solution.

“The industry is transitioning to a 112G PAM4 ecosystem for high-density switching, packet processing, and optics,” said Bob Wheeler, principal analyst for networking at The Linley Group. “Microchip’s META-DX2L is optimized to address these demands by bridging line cards to switch fabrics and multi-rate optics for 100 GbE, 400 GbE and 800 GbE connectivity”.

With its high-density 1.6T bandwidth, space-saving footprint, 112G PAM4 SerDes technology, and support for Ethernet rates from 1 to 800 GbE, Microchip’s META-DX2L Ethernet PHY is an industrial-temperature-grade device that offers the connectivity versatility to maximize design reuse across applications ranging from a retimer, gearbox or reverse gearbox to a hitless 2:1 multiplexor (mux). Highly configurable crosspoint and gearbox features make full use of a switch device’s I/O bandwidth to enable the flexible connections necessary for multi-rate cards that support a wide range of pluggable optics. The PHY’s low-power PAM4 SerDes enables it to support the next-generation infrastructure interface rate for cloud data centers, AI/ML compute clusters, 5G, and telecom service provider infrastructure, whether over long-reach direct attach copper (DAC) cables, backplanes, or connections to pluggable optics.

“For the 56G generation we introduced the industry’s first terabit PHY, META-DX1, and now we have followed with an equally transformative 112G solution that delivers the capabilities system developers need to solve today’s new challenges posed by cloud data centers, 5G networking, and AI/ML compute scale-out,” said Babak Samimi, vice president for Microchip’s communications business unit. “By delivering up to 1.6T of bandwidth within a low-power architecture and in the smallest footprint, the META-DX2L PHY doubles the bandwidth of previous solutions on the market while establishing a new level of power efficiency.”

META-DX2L is offered in the industry’s smallest package size, 23 x 30 millimeter (mm), which enables the space savings necessary to deliver the line card port densities demanded by hyperscalers and system developers. Product highlights include:

  • Dual 800 GbE, Quad 400 GbE and 16x 100/50/25/10/1 GbE PHY
  • Supports Ethernet, OTN, and Fibre Channel data rates
  • Supports proprietary data rates for AI/ML applications
  • Integrated 2:1 hitless mux enables high availability/protection architectures
  • Highly configurable crosspoint supporting multi-rate services on any port
  • Constant latency, enabling IEEE 1588 Class C/D PTP at the system level
  • FEC termination, monitoring and conversion between various interface rates
  • 32 long-reach (LR) capable 112G PAM4 SerDes with programmability to optimize power vs. performance
  • Support for DAC cables, including auto-negotiation and link training
  • Industrial-temperature-range support, enabling deployments in outdoor environments
  • Complete Software Development Kit (SDK) with hitless upgrade and warm restart capabilities and compatible with the field-proven META-DX1 SDK

Microchip provides a full set of design-in collateral, reference designs, and evaluation boards to support customers building systems with META-DX2L devices. In addition to Ethernet PHY technology, Microchip also provides system vendors with a total system solution including PolarFire® FPGAs, the ZL30632 high-performance PLL, oscillators, voltage regulators, and other components that have been pre-validated as a system with META-DX2L to help bring designs to production faster.

Product Availability

Initial META-DX2L devices are expected to sample during the fourth calendar quarter of 2021. For additional information visit the PM6200 META-DX2L web page or contact a Microchip sales representative.

2021090803 / 08.09.2021 / Electronic-components / Microchip Technology Inc. /

Microchip and Acacia Collaborate to Enable Market Transition to 400G Pluggable Coherent Optics for Data Center Routing, Switching and Metro OTN Platforms
Solutions enable encrypted 100/400 GbE, FlexE and Flexible OTN interfaces for 400ZR, OpenZR+ and Open ROADM applications

Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready
New technology enables electric buses and other e-transportation power systems to meet and exceed stringent environmental conditions while maximizing efficiency

Microchip Unveils Industry’s Most Compact 1.6T Ethernet PHY with Up to 800 GbE Connectivity for Cloud Data Centers, 5G and AI
META-DX2L enables routers, switches and line cards to double their bandwidth by transitioning to 112G PAM4 interface rates

Smart High Level Synthesis (HLS) Tool Suite Enables C++ Based Algorithm Development Using Microchip’s PolarFire® FPGA Platform
Enhances Accessibility to PolarFire FPGAs for Hardware Acceleration in Edge Compute Systems

New Chip Scale Atomic Clock (CSAC) Provides Wider Operating Temperatures, Faster Warm-up and Improved Frequency Stability in Extreme Environments
Microchip’s SA65 CSAC for military and industrial systems features ultra-high precision and low power consumption

New I2C Serial EEPROM Introduces 3.4MHz High-Speed Mode Operation, Software Write-Protection and Factory Programmed Serial Numbers
Industry First 3.4 MHz I2C Serial EEPROM Closes the Gap in Trade-Offs Between SPI and I2C Protocols

Mid-Range FPGAs Reach the Next Power and Performance Milestone for Edge Compute Systems
Microchip’s new low-density PolarFire® devices consume half the static power of alternatives while providing world’s smallest thermal footprint

First Aerospace-qualified Baseless Power Module Family Improves Aircraft Electrical System Efficiency
Microchip’s BL1, BL2 and BL3 family, developed with the Clean Sky consortium, is qualified to stringent aerospace standards for AC-to-DC and DC-to-AC power conversion

First Single-Chip Network Synchronization Solution Provides Ultra Precise Timing for 5G Radio Access Equipment
Combines integration and performance in one compact, low-power device supported by Microchip’s widely deployed IEEE 1588 Precision Time Protocol (PTP) and synchronization algorithm software modules

Replace Silicon IGBTs with Industry’s Most Rugged Silicon Carbide Power Solutions Now Available at 1700V
Silicon carbide portfolio with 1700V MOSFET die, discrete and power module devices extend designers’ options for efficiency, power density

Microchip Announces Production Shipments of Industry’s First NVMe and 24G SAS Tri-mode RAID and HBA Storage Adapters
Adaptec® Smart Storage Adapters Provide Increased Performance, Security and Scalability While Simplifying Storage Management

New Ethernet PHYs Enable Multidrop Bus Architecture, Enhancing Industrial Networks’ Scalability and Functionality
Microchip’s LAN867x family of Ethernet PHYs is the first to implement the IEEE® 10BASE-T1S single-pair Ethernet technology standard for connecting devices in industrial networks

Company of the week

A.P.O. - ELMOS v.o.s.

Interesting video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)


11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview


ORNO - OR-WAT-419 Power Meter [electricity consumption calculator]


Address Book


A.P.O. - ELMOS v.o.s.


MACH SYSTEMS s.r.o.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


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RUTRONIK


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TTI, Inc.


ANRITSU


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Molex, LLC


ON Semiconductor


NeoPhotonics


Murata Manufacturing Co.,



Calendary
MSV 2021 - Brno, 8.-12.11.2021
SPS 2021 - Nuremberg, 23.–25.11.2021
DistribuTECH, 25.1.-27.1.2022, Dallas, TX
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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