Address Book
 

Yamaichi Electronics USA Inc.
 

PICMG
 

Laird Thermal Systems
 

HARTING
 

Jenoptik
 

MACH SYSTEMS s.r.o.
 

A.P.O. - ELMOS v.o.s.
 

Pico Technology
 

Lynred
 

Advantech
 

EBV
 

SECO S.p.A.
 

Crowd Supply
 

Digi-Key Electronics
 

Durakool

28.01.2022 0:07:38
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DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers

congatec announces changes in top management to further accelerate company growth
Dr. Dirk Haft is new CEO, Daniel Jürgens new CFO

Deggendorf, Germany, December 21, 2021 * * * congatec – a leading vendor of embedded and edge computing technology – is pleased to announce its new leadership team, with Dr. Dirk Haft taking over as the new CEO and Daniel Jürgens as the new CFO. Gerhard Edi, previously CTO, will assume the newly created position of CSO (Chief Strategy Officer). Konrad Garhammer, previously Worldwide Director of Engineering, will move to the position of CTO. The aim of the new top management team is to accelerate internationalization, make the supply chain even more reliable and efficient, and generate further growth in new markets such as functional safety and critical infrastructures, which require congatec to build up new competencies in both software and manufacturing. 

Dr. Haft brings a wealth of leadership experience to take congatec to a new level of growth in the embedded and edge computing markets. Jürgens adds international M&A and private equity experience to the updated congatec management team. Gerhard Edi, a congatec co-founder and a veteran of the embedded computing industry, will be responsible for the future technology and product strategy as CSO and also drive expansion of strategic partnerships with technology suppliers, partners and customers. 

The congatec advisory board warmly welcomes Dr. Dirk Haft, Daniel Jürgens and Konrad Garhammer to the management team and looks forward to working with them for the next stage of congatec’s growth trajectory, which aims to further strengthen the company’s position as a global market leader in embedded and edge computing. The accelerated growth strategy will make congatec an even stronger partner for customers, helping them even more effectively to solve their constantly changing technology and business challenges. 

Bringing more than 20 years of experience in leading technology companies, Dr. Haft is looking forward to his new position: “It is an honor to become the CEO of such an innovative high-tech company. congatec has a clear focus, direction and mission in a dynamic and growing market. My task now is to identify and coordinate internal and external growth opportunities, with the goal to continue elevating congatec’s status as a global player in embedded computer technologies. With Gerhard Edi as CSO, Konrad Garhammer as CTO, Daniel Jürgens as CFO and Thomas Schultze as COO, I am very fortunate to have such strong and experienced partners in the executive board who complement my skills and will support me in driving our growth strategies.” Dr. Haft comes to congatec from his roles as board member of Wittenstein SE and as CEO of attocube systems AG. He holds a PhD in Physics from LMU Munich (Ludwig-Maximilians-Universität München). 

Daniel Jürgens joins congatec from his previous position as CFO at VIA optronics AG, a fast-growing high-tech company listed at the New York stock exchange (NYSE:VIAO). On the basis of this experience, Jürgens also sees strong growth potential for congatec. “congatec is an iconic company in the embedded computing segment and already well positioned for growth,” states Jürgens, adding: “I’ll be bringing my M&A and private equity experience plus my own motivation to the table to accelerate the growth and success of congatec.” 

The new CTO Konrad Garhammer joined congatec in 2016 from what is now Saab Sensor Systems Germany (formerly Saab Medav Technologies). Under the leadership of Gerhard Edi, he expanded the global development team to over 100 employees in his role as Worldwide Director of Engineering, drove technological development, introduced agile workflows and led the team as Edi’s right hand. “I am very pleased to have been entrusted to take on full responsibility for this team and look forward to expanding our performance further,” explains Garhammer. 

Daniel Jürgens started in September 2021, Dr. Dirk Haft took up his new role on November 1. Gerhard Edi and Konrad Garhammer assumed their new positions on December 15. The outgoing CEO Jason Carlson and CFO Josef Wenzl will support the new management team as Senior Advisors to facilitate a smooth transition. The congatec advisory board wants to take the opportunity to thank Carlson and Wenzl for their efforts and leadership in helping to institutionalize congatec’s organization and processes, and in securing its global leadership position in embedded computing.

2021122701 / 27.12.2021 / Various / congatec AG /

Intel Alder Lake Product Video
Check out the new congatec Alder Lake video showing you performance gains and improvements to accelerate the world of embedded and real-time edge computing systems.

A quantum leap in core count
congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors

congatec announces changes in top management to further accelerate company growth
Dr. Dirk Haft is new CEO, Daniel Jürgens new CFO

congatec opens virtual trade show booth for interactive information exchange
Round-the-clock accessibility

congatec and SYSGO join forces
Computer-on-Modules meet functional safety and security

Real-Time Over the Air
congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices

congatec and MATRIX VISION present PCIe based high-speed vision technology
Virtually latency free vision with up to 226.5 FPS

Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus
congatec celebrates the 15th anniversary of Qseven Computer-on-Modules with the introduction of the conga-QMX8-Plus, a brand new Qseven module based on the NXP i.MX 8M Plus application processor.

Brand new Qseven upgrade: NXP i.MX 8
New congatec module with i.MX 8M Plus gives Qseven designs a massive performance boost for the future

New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)
congatec introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor (condenamed Tiger Lake-H) for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new modules target the most demanding IoT gateway and edge computing applications.

Leading edge, in more than just bandwidth
congatec sets a new benchmark with the launch of 20 new Computer-on-Modules with 11th Gen Intel Core processors (formerly codenamed: Tiger Lake-H)

New ultra-rugged 11th Gen Intel® Core® congatec modules with soldered RAM
congatec ntroduces new 11th Gen Intel® Core® processor based Computer-on-Modules with soldered RAM for highest shock and vibration resistance. Designed to withstand even extreme temperature ranges of -40°C to +85°C, the new COM Express Type 6 Computer-on-Modules provide full compliance for shock and vibration resistant operation in challenging transportation and mobility applications.

Company of the week

Yamaichi Electronics USA Inc.

Interesting video


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


New COM-HPC Client size B & COM Express Type 6 size Basic with 11th Gen Intel® Core (Tiger Lake-H)


11th Gen Intel® Core™ processors with two new design options - COM Express & COM-HPC | Interview


Address Book


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


MACH SYSTEMS s.r.o.


A.P.O. - ELMOS v.o.s.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations


AXIOMTEK


TDK Corporation


VISHAY


STMicroelectronics



Calendary
HANNOVER MESSE 2022, 25.4.-29.4. 2022 - “The biggest transfo
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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