Address Book
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

Digi-Key Electronics
 

AERS

29.03.2024 0:07:15
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Pneumatic
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Trade fairs, Events
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

World premiere for x86 based COM-HPC Server
congatec introduces three new Server-on-Module families with Intel Xeon D processors

congatec – a leading vendor of embedded and edge computing technology – celebrates the world premiere for x86 based COM-HPC Server modules by announcing the availability of three new Server-on-Module families parallel to the launch of the brand-new Intel Xeon D processor family, formerly codenamed Ice Lake D. The new COM-HPC Server modules in Size E and Size D as well as the COM Express Type 7 modules will accelerate the next generation of real-time microserver workloads in rugged environments and extended temperature ranges. Improvements include up to 20 cores, RAM to up to 1 TB, double throughput per PCIe lanes to Gen 4 speed, as well as up to 100 GbE connectivity and TCC/TSN support. Target applications range from industrial workload consolidation servers for automation, robotics and medical backend imaging to outdoor servers for utilities and critical infrastructures – such as smart grids for oil, gas and electricity as well as rail and communication networks – and also includes vision enabled applications such as autonomous vehicles and video infrastructures for safety and security.

“The launch of our massive workload accelerating Intel Xeon D processor based COM-HPC Server-on-Modules is a milestone for the various edge server industries in three respects,” explains Martin Danzer, Director of Product Management at congatec. “First, Intel Xeon D processor based Server-on-Modules now target not only standard industrial environments but also outdoor and in-vehicle applications due to the extended temperature range support. Second, the worldwide first x86 COM-HPC Server-on-Modules extend the available number of cores for the first time to 20 and with up to 8 RAM sockets enable massively more memory bandwidth, which is essential for server workloads. Third, these server modules have real-time capabilities both with respect to the processor cores and TCC/TSN enabled real-time Ethernet. This is a combination that many OEMs have been eagerly waiting for.”

Besides the huge bandwidth and performance improvements, congatec’s three new Server-on-Module families will significantly extend the lifecycle of next-gen rugged edge server designs compared to common servers as long-term availability of up to ten years is planned. The module families further convince with a comprehensive server-grade feature set: For mission critical designs, they offer powerful hardware security features including Intel Boot Guard, Intel Total Memory Encryption – Multi-Tenant (Intel TME-MT) and Intel Software Guard Extensions (Intel SGX). AI applications benefit from built-in hardware acceleration including AVX-512 and VNNI. For best RAS capabilities, the processor modules integrate the Intel Resource Director Technology (Intel RDT) and support remote hardware management features such as IPMI and redfish.

The new modules will become available in a High Core Count (HCC) and a Low Core Count (LCC) variant featuring different flavors of the Intel Xeon D processor series:

  • The conga-HPC/sILH COM-HPC Server Size E modules will be equipped with 5 different Intel Xeon D-2700 processors with a choice of 4 to 20 cores, 8 DIMM sockets for up to 1 TByte of 2933 MT/s fast DDR4 memory with ECC, 32x PCIe Gen 4 and 16x PCIe Gen 3 as well as 100 GbE throughput plus real-time capable 2.5 Gbit/s Ethernet with TSN and TCC support at a processor base power of 65 to 118 Watt.
  • The COM-HPC Server Size D and COM Express Type 7 modules will come with 5 different Intel Xeon D-1700 processors with a choice of 4 to 10 cores. While the conga-B7Xl COM Express Server-on-Module supports up to 128 GB DDR4 2666 MT/s RAM via up to 3 SODIMM sockets, the conga-HPC/sILL COM-HPC Server Size D module offers 4 DIMM sockets for up to 256 GB of 2933 MT/s fast DDR4 RAM. Both module families offer 16x PCIe Gen 4 and 16x PCIe Gen 3 lanes. For fast networking, they provide up to 100 GbE throughput and TSN TCC support via 2.5 Gbit/s Ethernet at a processor base power of 40 to 67 Watt.

The Intel Xeon D-2700 processor based conga-HPC/sILH COM-HPC Server Size E modules (200 mm x 160 mm) will be available in the following variants:

Processor Cores / Threads Freq. [GHz] LLC Cache [MB] CPU Base Power [W] Temperature 
range
Intel Xeon D-2796TE 20 / 40 2.0 30 118 Extended Temp
Intel Xeon D-2775TE 16 / 32 2.0 25 100 Extended Temp
Intel Xeon D-2752TER 12 / 24 1.8 20 77 Extended Temp
Intel Xeon D-2733NT 8 / 16 2.1 15 80 Commercial Temp
Intel Xeon D-2712T 4 / 8 1.9 15 65 Commercial Temp


The Intel Xeon D-1700 processor based conga-HPC/sILL COM-HPC Server Size D modules (160mm x 160mm) and conga-B7Xl COM Express Type 7 modules (95 mm x 120 mm) will be available in the following configurations:

Processor Cores / Threads Freq. [GHz] LLC Cache [MB] CPU Base Power [W] Temperature 
range
Intel Xeon D-1746TER 10 / 20 2.0 15 67 Extended Temp
Intel Xeon D-1732TE 8 / 16 1.9 15 52 Extended Temp
Intel Xeon D-1735TR 8 / 16 2.2 15 59 Commercial Temp
Intel Xeon D-1715TER 4 / 8 2.4 10 50 Extended Temp
Intel Xeon D-1712TR 4 / 8 2.0 10 40 Commercial Temp

The new COM-HPC and COM Express Server-on-Modules are application ready and available with appropriate rugged cooling solutions, ranging from powerful active cooling with heat pipe adapter to fully passive cooling solutions for best mechanical resilience against vibration and shocks. On the software side, the new modules come with comprehensive board support packages for Windows, Linux and VxWorks. For workload consolidation, real-time virtual machine support is available thanks to congatec’s comprehensive support of RTS Hypervisor implementations from Real-Time Systems.


For more information on the conga-HPC/sILH COM-HPC Server Size E Server-on-Module, please visit https://www.congatec.com/en/products/com-hpc/conga-hpcsilh/  

For more information on the conga-HPC/sILL COM-HPC Server Size D Server-on-Module, please visit https://www.congatec.com/en/products/com-hpc/conga-hpcsill/

For more information on the conga-B7Xl COM Express Type 7 Server-on-Module, please visit https://www.congatec.com/en/products/com-express-type7/conga-b7xi/

Further information about the new Intel Xeon D1700 and D2700 processors (formerly Ice Lake) can be found on the main landing page: https://www.congatec.com/en/technologies/intel-xeon-d-modules/

2022022601 / 26.02.2022 / Embedded / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


MOXA


DANFOSS


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813