Address Book
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

Digi-Key Electronics
 

AERS

28.03.2024 11:53:01
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Pneumatic
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Trade fairs, Events
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

TSN synchronized real-time over 5G
congatec introduces Computer-on-Modules for collaborative 5G robots and material handling systems at Smart Factory & Automation World

Seoul, Korea, April 6, 2022 * * * congatec – a leading vendor of embedded and edge computing technology – is pleased to introduce new Computer-on-Modules for 5G connected smart factories and industrial automation at Smart Factory & Automation World, Coex Hall C, Booth C522. Designed to simplify and accelerate the development of collaborative robotics and material handling systems, the smart mobility platforms from congatec are suitable for deployment in outdoor temperatures from -45°C to +85°C. Typical targets for these platforms range from next generation of real-time connected, functionally safe self-driving vehicles, to smart manufacturing and material handling applications ranging from collaborative and cooperative robots to substitutive solutions such as robots for THT assembly of PCB boards.

OEM vendors of next generation smart logistics vehicles and manufacturing robots must tackle a variety of tasks when designing those new controllers. They have to integrate vision and various other sensors for gathering situational raw data, need to implement data preprocessing and artificial intelligence (AI) to improve data analytics, and design controller logic for autonomous vehicle movement and operation. In addition, they need 5G device connectivity for vehicle-to-vehicle and vehicle-to-x communication, or respectively, robot-to-robot and robot-to-x-communication. And all this needs to be implemented with real-time capabilities and functional safety.

“congatec positions itself as the embedded computing platform and ecosystem provider that supports smart logistics vehicle and manufacturing robot vendors comprehensively in all these tasks, from TSN capable rugged Computer-on-Modules for the extended temperature ranges and real-time hypervisor technologies to application ready OEM platform building blocks provided by our constantly expanding network of solution partners,” says Yoonsun Kim, country manager at congatec Korea.

Highlights of the congatec presentations at Smart Factory & Automation World are the Intel Xeon D processor based COM-HPC Server modules for industrial edge servers and 5G campus network equipment; the 12th Gen Intel Core processor based COM-HPC Client and COM Express modules for smart vehicle/robot gateways and vehicle/robot network controllers; as well as Intel Celeron, Pentium and Atom processor based Pico-ITX Single Board Computers (SBCs) as application ready real-time processing cores for industrial edge computing applications.  

COM-HPC Server modules with Intel Xeon D processors

The new COM-HPC Server modules in Size E and Size D with Intel Xeon D processors are designed to accelerate the next generation of real-time microserver workloads in industrial factories and outdoor environments with extended temperature ranges. Improvements include up to 20 cores, up to 1 TB RAM, double throughput per PCIe lane compared to Gen 3, as well as up to 100 GbE connectivity and TCC/TSN support. Target use cases in smart factory applications range from servers deployed in 5G tactile internet applications to edge servers for larger machines and manufacturing equipment. More information about the new Intel Xeon D processor based Computer-on-Modules can be found at: https://www.congatec.com/en/technologies/intel-xeon-d-modules/  

Computer-on-Modules with 12th Gen Intel Core processors

Featuring 12th Generation Intel Core processors (formerly codenamed Alder Lake), the new congatec modules in COM-HPC Size A and Size C as well as COM Express Type 6 form factors offer major performance gains and improvements for the next generation of smart mobility systems and collaborative manufacturing robots. Most impressive is the fact that engineers can now leverage Intel’s innovative performance hybrid architecture. With up to 14 cores on BGA variants, 12th Gen Intel Core processors provide a quantum leap in multitasking and scalability to accelerate multithreaded vehicle and robotic applications and to execute dedicated real-time tasks more efficiently. In addition, with up to 96 Execution Units, the integrated Intel Iris Xe graphics is estimated to deliver extraordinary improvements of up to 129% in GPGPU processing to accelerate parallelized workloads such as AI algorithms, as compared to 11th Gen Intel Core processors. More information about the new 12th Gen Intel Core processor based Computer-on-Modules can be found at: https://www.congatec.com/en/technologies/intel-alder-lake-modules/

Pico-ITX Single Board Computers with Intel Atom x6000E processors

The Pico-ITX boards with Intel Atom x6000E Series processors or Intel Celeron and Pentium N & J Series processors (code named “Elkhart Lake”) are designed for edge-connected embedded systems. They impress with graphics performance up to three simultaneous displays running at 4kp60 and impressive multi-thread computing power on up to 4 cores. Further benefits especially welcomed in real-time industrial markets are Time Sensitive Networking (TSN), Intel Time Coordinated Computing (Intel TCC) and Real Time Systems (RTS) hypervisor support as well as BIOS configurable ECC and extended temperature options from -40°C to +85°C. The combination of rugged real-time operation, real-time connectivity and real-time hypervisor technologies is what OEMs need for IoT-connected industrial applications. More information about the conga-PA7 Pico-ITX Single Board Computers can be found at: https://www.congatec.com/en/products/pico-itx/conga-pa7/ 

2022040701 / 07.04.2022 / Embedded / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


MOXA


DANFOSS


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813