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Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe

congatec simplifies Arm deployments with i.MX 8M Plus
Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified

congatec – a leading vendor of embedded and edge computing technology – announces that its SMARC Computer-on-Modules based on NXP i.MX8 M Plus processor technology have achieved SystemReady IR certification within the Arm driven Cassini project. The project aims to overcome the barriers of Arm deployments by providing a comprehensive and secure ecosystem of standards while delivering a cloud-native software experience similar to an app store with easy download, install and run routines with only a few clicks. By leveraging software that allows hardware diversity and provides powerful security APIs and certification, OEMs benefit from reduced development effort and time to market as they can now port and deploy their applications to the entire Cassini certified Arm ecosystem. Hardware with Cassini SystemReady IR certified bootloader is validated to run unmodified ISO images of Ubuntu, Fedora, openSUSE and Debian operating systems, making native software installation an easily executable task. Combined with congatec’s OS build services and build environment expertise on the basis of the Yocto project, OEMs not only gain instant entry but also efficient customization services for applications based on congatec’s SMARC module conga-SMX8-Plus with NXP i.MX8 processor. 

By building Arm systems on the basis of Computer-on-Module standards and standardized ISO images, application designs become highly efficient, reducing NRE costs and accelerating OEMs’ time to market. As a long term strategy, Cassini Project also has the potential to become the standard for how Arm based IoT and edge devices will be updated, managed and secured. 

“We love the idea of Project Cassini as it builds a comprehensive ecosystem to improve the design-in efficiency of Arm applications,” explains Martin Danzer, Director Product Management at congatec. “Testing applications on standard platforms with standard ISO images is the right step to fast and easy evaluation, for example - securely managed virtualized gateways hosting cloud-native stacks that can be orchestrated remotely. But please don’t forget that a secure boot implementation is mandatory for such applications.” 

The congatec Cassini enabled platform in detail

The first congatec starter set suitable to implement the Cassini SystemReady IR certified bootloader available at congatec’s GIT server targets AI accelerated vision applications and contains the entire ecosystem developers need to instantly start designing applications on the basis of the next-generation NXP i.MX 8M plus platform, which offers highly efficient vision and AI integration. At the heart of the starter set is the new SMARC 2.1 Computer-on-Module conga-SMX8-Plus. It features 4 powerful Arm Cortex®-A53 cores, 1x Arm Cortex®-M7 controller and the NXP Neural Processing Unit (NPU) to accelerate deep learning algorithms and comes with passive cooling. Within the scope of customer-specific projects, the 3.5 inch carrier board conga-SMC1/SMARC-ARM can be directly connected to the 13 MP Basler dart daA4200-30mci BCON for MIPI camera via MIPI CSI-2.0 without any additional converter modules. Next to MIPI, CSI-2.0 also USB and GigE vision cameras can be also supported. On the software side, congatec provides a bootable SD card with preconfigured boot loader,Yocto build OS image, and matching BSPs. Also the processor-optimized Basler embedded vision software enabling immediate AI inference training on the basis of captured images and video sequences can be made available as plug & play ready for qualified customer projects.
 

Further information on congatec’s ecosystem for i.MX 8 based designs can be found at: https://www.congatec.com/imx8

2022051901 / 18.05.2022 / Embedded / congatec AG /

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket
The ultimate performance boost consolidated edge applications have been waiting for

congatec introduces new Computer-on-Modules with 13th Gen Intel Core processors
Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here

PICMG COM-HPC committee approves COM-HPC Mini pinout
Mini form factor for maximum performance

congatec welcomes COM Express 3.1 specification with compliant Computer-on-Modules
Performance boost now standard-compliant

Accelerating the real-time digitization
congatec introduces its ecosystem for TSN networked real-time factories and critical infrastructures

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

Company of the week

INTEL

Interesting video


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


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A.P.O. - ELMOS v.o.s.


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Calendary
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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