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DPI 750E
 
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AMD Ryzen™ based congatec COM Express mo
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congatec to enter the functional safety market
Functional safe computing platforms for mixed-critical applications

At embedded world  congatec – a leading vendor of embedded and edge computing technology – announced that it is making massive investments in functional safety (FuSa). Functionally safe embedded computing platforms are needed in many new applications ranging from industrial machinery and collaborative robotics to autonomous vehicles on shopfloors, rails, and roads. For all of these applications there is also a trend towards hardware consolidation that leads to the need to operate mixed-critical applications on functionally safe multicore embedded systems to manage multiple safety and non-safety critical tasks in parallel. Embedded x86 multicore platforms deliver a solid basis for such applications, which is why congatec now qualifies them for certification with FuSa standards including IEC 61508 and ISO 13849.

“Functionally safe hardware and hardware near software are fundamental building blocks for any functional safety application and require a detailed look at all components. OEMs who utilize a Computer-on-Module as an application ready building block – including relevant software components such as bootloader, hypervisor and BSP – that is already certifiable for functional safety can save a lot of time and money. They will then only need to qualify the customer specific carrier board and related adaptations for certification,” explains congatec CTO Konrad Garhammer, summing up the customer value of the company’s functional safety investments. An example of these FuSa building blocks is being presented in a live demo at embedded world.

The functional safety prepared COM Express Mini module conga-MA7 is running a FuSa demo application on the basis of the RTS hypervisor and integrated real-time Linux with the for FuSa qualified Intel CPU x6427FE including Safety Island support. This FuSa demo is impressive proof that congatec has already gone a long way to qualify its first Computer-on-Modules based on Intel Atom x6000 E processor technology (formerly codenamed Elkhart Lake), with further modules to follow. OEMs can immediately start implementing congatec’s functional safety ready modules, BSPs and own software components into their application platforms, and congatec is ready to support OEM customers with all customization needs compliant to their specific certification demands – be it component selection and implementation on carrier boards, OS and hypervisor support, or I/O driver implementation support in accordance with the certification needs.

To qualify Computer-on-Modules for safe operation, all components as well as the entire BSP need to be prepared for FuSa certification, including safety manuals and further required documentation. Also, all organizational processes and documents created during development and testing – such as FMEDA (Failure Modes, Effects and Diagnostic Analysis) as well as the verification and validation (V&V) process – need to be brought in line with the certification requirements and audited by external assessors. All this is available from congatec now so that customers can start their FuSa projects immediately at faster time to market, lower cost and less implementation risk.

More information on congatec’s functional safety ready Computer-on-Modules and custom system design support services can be found at https://www.congatec.com/en/technologies/functional-safety 

2022062803 / 28.06.2022 / Various / congatec AG /

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change

congatec modules drive Intel Labs China’s Robot 4.0 platform for research and education
Making the robotic edge modular

congatec launches five new COM-HPC Server Size D modules with Intel Xeon D-2700 processors following the “less is more” approach
An advance into the world of mixed-critical real-time servers

congatec extends its 12th Gen Intel Core processor based COM-HPC and COM Express Computer-on-Module portfolio with seven more power-efficient new processor variants
Highly powerful, yet passively cooled

congatec to enter the functional safety market
Functional safe computing platforms for mixed-critical applications

congatec and S.I.E launch co-creation services for the digitization of healthcare
Value partnership for creating medical edge computing systems that meet patient, data, and cybersecurity requirements

Modular 5G cells for real-time communications
Real-time capable 5G cells with integrated edge servers are a key enabling technology for digital transformation, opening a plethora of new opportunities for IIoT, Industry 4.0 and critical infrastructure applications.

congatec simplifies Arm deployments with i.MX 8M Plus
Arm Project Cassini completed: congatec modules with NXP i.MX 8M Plus processor now Arm SystemReady IR certified

TSN synchronized real-time over 5G
congatec introduces Computer-on-Modules for collaborative 5G robots and material handling systems at Smart Factory & Automation World

congatec introduces vehicle computing technology for smart mobility at Intertraffic Amsterdam
Embedded computing engines that put smart vehicle developers into the fast lane

congatec and S.I.E join in strategic partnership
Focus on OEM platforms for regulated industries

Company of the week

Friedrich Lütze GmbH

Interesting video


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


Address Book


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


MACH SYSTEMS s.r.o.


A.P.O. - ELMOS v.o.s.


Pico Technology


Lynred


Advantech


EBV


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Calendary
International Engineering Fair, 4.-7.10. 2022, Brno, CZ
electronica 2022, 15.11.-18.11.2022, München, DE
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

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The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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