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AMD Ryzen™ based congatec COM Express mo

congatec to enter the functional safety market
Functional safe computing platforms for mixed-critical applications

At embedded world  congatec – a leading vendor of embedded and edge computing technology – announced that it is making massive investments in functional safety (FuSa). Functionally safe embedded computing platforms are needed in many new applications ranging from industrial machinery and collaborative robotics to autonomous vehicles on shopfloors, rails, and roads. For all of these applications there is also a trend towards hardware consolidation that leads to the need to operate mixed-critical applications on functionally safe multicore embedded systems to manage multiple safety and non-safety critical tasks in parallel. Embedded x86 multicore platforms deliver a solid basis for such applications, which is why congatec now qualifies them for certification with FuSa standards including IEC 61508 and ISO 13849.

“Functionally safe hardware and hardware near software are fundamental building blocks for any functional safety application and require a detailed look at all components. OEMs who utilize a Computer-on-Module as an application ready building block – including relevant software components such as bootloader, hypervisor and BSP – that is already certifiable for functional safety can save a lot of time and money. They will then only need to qualify the customer specific carrier board and related adaptations for certification,” explains congatec CTO Konrad Garhammer, summing up the customer value of the company’s functional safety investments. An example of these FuSa building blocks is being presented in a live demo at embedded world.

The functional safety prepared COM Express Mini module conga-MA7 is running a FuSa demo application on the basis of the RTS hypervisor and integrated real-time Linux with the for FuSa qualified Intel CPU x6427FE including Safety Island support. This FuSa demo is impressive proof that congatec has already gone a long way to qualify its first Computer-on-Modules based on Intel Atom x6000 E processor technology (formerly codenamed Elkhart Lake), with further modules to follow. OEMs can immediately start implementing congatec’s functional safety ready modules, BSPs and own software components into their application platforms, and congatec is ready to support OEM customers with all customization needs compliant to their specific certification demands – be it component selection and implementation on carrier boards, OS and hypervisor support, or I/O driver implementation support in accordance with the certification needs.

To qualify Computer-on-Modules for safe operation, all components as well as the entire BSP need to be prepared for FuSa certification, including safety manuals and further required documentation. Also, all organizational processes and documents created during development and testing – such as FMEDA (Failure Modes, Effects and Diagnostic Analysis) as well as the verification and validation (V&V) process – need to be brought in line with the certification requirements and audited by external assessors. All this is available from congatec now so that customers can start their FuSa projects immediately at faster time to market, lower cost and less implementation risk.

More information on congatec’s functional safety ready Computer-on-Modules and custom system design support services can be found at https://www.congatec.com/en/technologies/functional-safety 

2022062803 / 28.06.2022 / Various / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

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