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congatec and S.I.E launch co-creation services for the digitization of healthcare
Value partnership for creating medical edge computing systems that meet patient, data, and cybersecurity requirements

At embedded world 2022 congatec – a leading vendor of embedded and edge computing technology – and System Industrie Electronic (S.I.E) – an ISO 13485 certified expert in system design and integration, mass production and assembly of medical OEM platforms – have officially launched their new co-creation services for the design of IT/ OT systems dedicated for the medical and healthcare sector. The system engineering value of the collaboration between the two companies and its customers extends across the entire supply chain, from Computer-on-Modules to series production of certified system platforms. The joint offering targets medical device manufacturers and infrastructure solution providers requiring patient, data, and cybersecurity to digitize medical care. The first proofs of concept of congatec's and S.I.E's co-creation services will be celebrating their world premiere at the congatec booth even before the official market launch: two new medical edge computing systems, called secunet medical connect Carna and Athene, which are developed and manufactured in collaboration with OEM customer secunet. 

The two secunet systems are perfect examples for the most demanding system design challenges medical device OEMs are facing today: Edge computing platforms for the digitization of the healthcare sector must be 100% compliant with the data and cybersecurity specifications of ITSEC or Common Criteria and/or ready for B3S KRITIS and ISO/IEC 80001 certification. For point-of-care (POC) operation, their medical computing platforms must also be EN 60601-1/EN 60601-2 compliant and MDR/FDA certifiable. All this requires 100% reliable and traceable components, comprehensive documentation, and trusted sources across the entire supply chain and for the entire lifecycle of the medical devices. As application-ready platforms that meet these state-of-the-art patient, data, and cybersecurity requirements, secunet medical connect Carna and Athene address virtually all needs for the digitization of POC medical devices and secure patient data processing in hospital networks – such as backend systems for medical image processing in CT, MRT, x-ray and ultrasound appliances. 

The secunet Carna platform, for instance, can be connected to any medical device and is therefore ideally suited for the digitization of existing platforms, either driven by OEMs or hospitals themselves. OEMs looking for a dedicated solution to digitize their medical systems can use these platforms as proof-of-concept and are invited to ask for customization of the existing platforms or even evaluate entirely new platform co-creations with congatec, S.I.E and, of course, secunet. 

Beside these digitization-focused edge computing platforms, the co-creation team also targets any other medical panel or box PC needs OEMs may have – including functional safety on x86, enabled by Intel’s initiatives on the basis of Intel Atom x6000E processors for functional safety and the expected future support of further cores. Engineers of mixed-critical implementations can also take advantage of the new safety hypervisor technology support by congatec’s subsidiary Real-Time Systems, also announced today, and congatec’s value offering for application-ready safety Computer-on-Modules. Within the co-creation offering from congatec and S.I.E, OEMs receive an unparalleled value proposition with full system responsibility – from the computing core to certification, mass production and lifecycle management. This is especially valuable if customers in regulated markets want to concentrate on their core competences and are looking for a reliable source with central European roots. 

In addition to critical healthcare infrastructures and medical OEM equipment, the two companies also aim to enter further embedded and edge computing markets for critical infrastructures, such as the financial and insurance sector, water and energy utilities, information technology and telecommunications, and even transportation and traffic, all of which rely on cyber-secure systems for their IT infrastructures. 

More information about the co-creation offerings from congatec and S.I.E and all the benefits of this value partnership for OEMs can be found at https://www.congatec.com/en/congatec/partner/value-partner/

2022062804 / 28.06.2022 / Various / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

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