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congatec modules drive Intel Labs China’s Robot 4.0 platform for research and education
Making the robotic edge modular

Deggendorf, Germany, 12 July 2022 * * * congatec – a leading vendor of embedded and edge computing technology – announced today that Intel Labs China has chosen congatec COM Express modules for easy and efficient design-in and flexible processor scalability in its Heterogeneous Extensible Robot Open (HERO) platform. Created by the Autonomous System Lab of Intel Labs China to simplify and accelerate the development of next-generation IoT connected service robots, retail robots, and self-driving vehicles, the Robot 4.0 platform integrates artificial intelligence (AI) for research, education, and experimental purposes. The open platform combines Intel’s heterogeneous processor technology with Intel’s OpenVINO AI toolkit and offers a comprehensive suite of software libraries for localization, navigation, planning, and human-robot interaction. In this environment, the congatec COM Express modules are now providing the demanded performance scalability from low-power Intel Atom to high end Intel Xeon processors. The standard configuration utilizes conga-TC370 Computer-on-Modules with 8th Generation Intel Core SoC processors.
 

The global robotics market reached 23.7 billion USD in 2020 and is expected to grow to 74 billion USD by 2026 with an average growth rate of about 20 % [1]. For the market to continue this strong growth, robots need greater flexibility and autonomy, as well as fast configurability to expand the range of tasks and applications. This requires massive computing power with the lowest possible latency, which makes real-time edge computing a key technology.
 

"HERO is a compact and heterogeneous low-power, high-performance system platform solution that the Intel Labs China built specifically for the development of intelligent robots – such as service robots, medical robots, self-driving cars, etc.," says Dr. Song Jijiang, VP, Director of Intel Labs China "After three years of continuous development, and thanks to the heterogeneous and open approach, HERO is now a perfect development platform for a wide range of Robotics 4.0 projects. Going forward, the Intel Labs China will continue its focus on the four main areas of artificial intelligence, intelligent transportation, wireless data communication and service robotics, collaborating with industry, universities and research partners to fully leverage the value of data and jointly drive the digital transformation of industry."

 

“We are excited to be an elementary part of Intel Labs China’s HERO ecosystem. Robotics 4.0 is a truly progressive and forward-looking technology area, especially in combination with AI and the OpenVINO toolkit that facilitate the optimization of a deep learning model on Intel’s heterogeneous computing hardware,” says Becky Lin, Country Manager China at congatec. “This is where the congatec COM Express modules really demonstrate their potential since flexible edge computing platforms are a paradigm of Robotics 4.0.”

 

Requirements for Robotics 4.0

Besides the computing hardware, Intel Labs China equipped its HERO education kits with the Advanced AI Practice Suite including libraries for basic perception, interaction, navigation, planning, and manipulation. An optional Senior AI Development Suite adds adaptive interaction and continuous learning, including 3D semantic scene understanding. The HERO platform can also be extended further as needed. For example, the heterogeneous computing platform can incorporate an Intel Arria 10 GX FPGA or other third party hardware acceleration modules. The adaptive learning part can be expanded with additional perception modules to enhance existing or add new perception functions. This way, robots can quickly and flexibly be adapted to the different requirements of their future missions. Additionally, the modular hardware also enables application-specific load and performance balancing.

 

Proof of the HERO concept

The versatile congatec COM Express modules allow the creation of reliable and optimized robotic systems for a multitude of applications while simplifying system integration. This independent, scalable and future-proof modular platform gives HERO designers more time to focus on the development of innovative robotic systems.

For more information please visit: https://www.congatec.com/en/technologies/making-the-robotic-edge-modular/


[1] https://www.mordorintelligence.com/industry-reports/robotics-market

2022072001 / 20.07.2022 / Industry automation / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

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