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Danisense
 

BINDER
 

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MOXA
 

DANFOSS
 

Alliance Memory
 

Intelliconnect (Europe) Ltd.
 

KIOXIA Europe GmbH
 

Antenova Ltd
 

Friedrich Lütze GmbH
 

Analog Devices
 

ASRock Industrial

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Various

MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
TH381
 
TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe
T5808
 
TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –

congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change

congatec – a leading vendor of embedded and edge computing technology – has received the Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology from VDC Research. The deciding factor that won congatec the award is their outstanding support for customers going through dramatic business challenges and technological change. The award is based on vendor satisfaction ratings from more than 700 IoT, embedded, and edge solution providers sourcing commercial hardware platforms. The list includes OEMs, system integrators and engineering services companies. 

“Design and solution requirements are not easing up, and neither is the macroeconomic landscape with a variety of geopolitical, environmental, and supply/logistics issues across the world. It is now more important than ever to have a strong hardware technology platform provider to remain competitive in an increasingly complex and challenging environment,” says Chris Rommel, Executive Vice President at VDC Research. 

“congatec is one of the top three vendors in the boards and modules category to have received VDC’s Platinum Award for IoT & Embedded Hardware Vendor Satisfaction beside AMD-Xilinx and PHYTEC. We are immensely proud to be in the top position in our core competency area of Computer-on-Modules such as COM-HPC, COM Express and SMARC, and to have been recognized by our clients for delivering best-in-class service,” said a delighted Christian Eder, Director Product Marketing at congatec, when receiving the award. 

Achieving platinum status is a solid foundation for the future development of congatec as customer loyalty is high – 79.2% will definitely or probably use the same vendor. However, there is still a huge potential of customers to acquire: More than 20% of all providers sourcing commercial hardware platforms are either unsure whether they would like to change the vendor (16.7%) or will definitely or probably change the vendor (3.8%). Convincing those customers will be easier with such an excellent rating of services, which simplify the use of embedded computer technology in addition to distinct hardware features. 

VDC also ranks the most important technical selection criteria for boards and modules in their survey. First and foremost are the quality and reliability of the boards, followed by flexible high-performance networking capability and processor type. Long product availability as well as software frameworks and libraries are the next important criteria when sourcing boards and modules. Vendors who cannot deliver excellent results in these categories as well would never make the platinum rank. In this respect, the award is also a distinction for product excellence, which is a particular strength of congatec as a world leading vendor in this area. 

Further information on VDC Research’s 2022 IoT & Embedded Hardware Vendor Satisfaction Awards and congatec’s comprehensive product and service offerings can be found at: https://www.congatec.com/

2022072602 / 26.07.2022 / Various / congatec AG /

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket
The ultimate performance boost consolidated edge applications have been waiting for

congatec introduces new Computer-on-Modules with 13th Gen Intel Core processors
Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here

PICMG COM-HPC committee approves COM-HPC Mini pinout
Mini form factor for maximum performance

congatec welcomes COM Express 3.1 specification with compliant Computer-on-Modules
Performance boost now standard-compliant

Accelerating the real-time digitization
congatec introduces its ecosystem for TSN networked real-time factories and critical infrastructures

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change

Company of the week

Digi-Key Electronics

Interesting video


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Address Book


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


MOXA


DANFOSS


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


MACH SYSTEMS s.r.o.


A.P.O. - ELMOS v.o.s.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Durakool



Calendary
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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