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AMD Ryzen™ based congatec COM Express mo

congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change

congatec – a leading vendor of embedded and edge computing technology – has received the Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology from VDC Research. The deciding factor that won congatec the award is their outstanding support for customers going through dramatic business challenges and technological change. The award is based on vendor satisfaction ratings from more than 700 IoT, embedded, and edge solution providers sourcing commercial hardware platforms. The list includes OEMs, system integrators and engineering services companies. 

“Design and solution requirements are not easing up, and neither is the macroeconomic landscape with a variety of geopolitical, environmental, and supply/logistics issues across the world. It is now more important than ever to have a strong hardware technology platform provider to remain competitive in an increasingly complex and challenging environment,” says Chris Rommel, Executive Vice President at VDC Research. 

“congatec is one of the top three vendors in the boards and modules category to have received VDC’s Platinum Award for IoT & Embedded Hardware Vendor Satisfaction beside AMD-Xilinx and PHYTEC. We are immensely proud to be in the top position in our core competency area of Computer-on-Modules such as COM-HPC, COM Express and SMARC, and to have been recognized by our clients for delivering best-in-class service,” said a delighted Christian Eder, Director Product Marketing at congatec, when receiving the award. 

Achieving platinum status is a solid foundation for the future development of congatec as customer loyalty is high – 79.2% will definitely or probably use the same vendor. However, there is still a huge potential of customers to acquire: More than 20% of all providers sourcing commercial hardware platforms are either unsure whether they would like to change the vendor (16.7%) or will definitely or probably change the vendor (3.8%). Convincing those customers will be easier with such an excellent rating of services, which simplify the use of embedded computer technology in addition to distinct hardware features. 

VDC also ranks the most important technical selection criteria for boards and modules in their survey. First and foremost are the quality and reliability of the boards, followed by flexible high-performance networking capability and processor type. Long product availability as well as software frameworks and libraries are the next important criteria when sourcing boards and modules. Vendors who cannot deliver excellent results in these categories as well would never make the platinum rank. In this respect, the award is also a distinction for product excellence, which is a particular strength of congatec as a world leading vendor in this area. 

Further information on VDC Research’s 2022 IoT & Embedded Hardware Vendor Satisfaction Awards and congatec’s comprehensive product and service offerings can be found at: https://www.congatec.com/

2022072602 / 26.07.2022 / Various / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

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electronica 2024, 12.11.-15.11.2024, Munich, DE


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Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


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Friedrich Lütze GmbH


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ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

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The ISS Design Challenge ...

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Mouser Electronics Warehouse Tour with Grant Imahara


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