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Infineon’s CoolSiC™ devices support bi-directional inverter from Delta to let electric vehicles become emergency backup power

CoolSiC™ products from Infineon Technologies AG are adopted by Delta Electronics, a Taiwan-based global leading provider of power and energy management solutions, to allow for a big step towards energy transition and carbon neutrality with green power. With the successful development of bi-directional inverters, a hybrid three-in-one system that integrates solar, energy storage and charging of electric vehicles (EV), Delta is enabling EVs to become an household emergency backup power.

The bi-directional inverter can be used to supply power to charge electric vehicles (EVs) and home batteries, while acting as a backup power for unexpected outages and a high-efficiency green energy control core. Products from Infineon include the 1200 V M1H CoolSiC EasyPACK™ 1B modules and 1200 V CoolSiC D²PAK 7-pin, a surface mount device. The integration of three applications is also a milestone. This three-in-one system was realized in a compact package of just 425 x 865 x 160 mm 3. With an output power of about 10 kW, the system allows a maximum continuous current of 34 A and achieves peak efficiencies of more than 97.5 percent.

“Infineon is a trusted brand that has been spearheading the development of power semiconductors and power efficiency for many years”, said Raymond Lee, director of Delta PV Inverter business unit. “With the company's devices, we were able to integrate three applications into one system, which allows us to take a giant leap toward green energy.”

“We are proud to be a big part of this project, representing a major milestone on the road to carbon neutrality,” said Dr. Peter Wawer, President of Infineon’s Industrial Power Control Division. “We look forward to a long-term collaboration between Infineon and Delta and are proud that our devices contribute to this smart energy solution.”

One of the essential elements for creating the three-in-one system includes the1200 V M1H CoolSiC EasyPACK 1B module (F4-23MR12W1M1_B11) with integrated NTC temperature sensor and PressFIT contact technology. The module offers maximum flexibility and high-current density. With best-in-class package technology combined with CoolSiC MOSFETs, the module features a low-inductive design with minimal switching and conduction losses. Furthermore, high-switching frequency operation is enabled on the customer side, which allows for smaller system designs. The EasyPACK module helps optimize the development time and reduces the overall costs for the customer.

Several other components from Infineon are used in the system, including devices using CoolMOS™ C7 and TRENCHSTOP™ 5 IGBT technologies. Additionally, the 1200 V CoolSiC MOSFET (IMBG120R350M1H) in a surface-mounted device (SMD) package, the D²PAK 7-pin, is also a part of this system. This device uses .XT interconnection technology for best-in-class thermal properties, as well as the Kelvin source concept. The MOSFETs ensure very low switching losses, improving the system’s efficiency.

The devices include a 3 µs short-circuit resistance, and the MOSFETs provide full slew rate (dV/dt) control as well as a benchmark gate threshold voltage (V GS(th)) of 4.5 V. They are also robust against parasitic turn-on and can be operated with a turn-off voltage of 0 V. Furthermore, the MOSFETs contain a robust body diode that enables hard commutation. The package creepage and clearance distances are 6.1 mm. Additionally, the SMD package allows direct integration into PCBs with natural convection cooling without additional heat sinks.

More information about Infineon’s contribution to energy efficiency: www.infineon.com/green-energy

2022072901 / 29.07.2022 / Electronic-components / Infineon Technologies AG /

Infineon’s CoolSiC™ devices support bi-directional inverter from Delta to let electric vehicles become emergency backup power

Infineon and Oxford Ionics join forces to develop leading Trapped Ion Quantum Processors
Infineon Technologies AG and Oxford Ionics announce a collaboration to build high-performance and fully integrated quantum processing units (QPUs).

Optimized CoolSiC™ MOSFETs 650 V in D²PAK for lowest losses in the application and highest reliability in operation

World’s first TPM 2.0 with open-source software stack cuts down security integration efforts in industrial, automotive and IoT applications
Trusted Platform Modules (TPM) enable secured remote software updates, disc encryption and user authentication. Hence, they are crucial for connected industrial, automotive and other embedded devices.

1200 V level-shift three-phase SOI EiceDRIVER™ offers superior robustness
Infineon Technologies AG broadens its level-shift EiceDRIVER™ portfolio with a 1200 V three-phase gate driver. It is based on the company’s unique silicon-on-insulator (SOI) technology. The device provides leading negative VS transient immunity, superior latch-up immunity, fast over-current protection, and the monolithic integration of real bootstrap diodes. These unique features reduce BOM and enable a more robust design with a compact form factor suitable for industrial drives and embedded inverter applications.

Infineon adds 40 V device in PQFN to its OptiMOS™ Source-Down power MOSFET family
Contemporary power system designs demand high power density levels and small form factors to maximize system-level performance. Infineon Technologies AG tackles this challenge by focusing on system innovation with enhancements on the component level. Adding to the 25 V device introduced in February, Infineon now brings the OptiMOS™ 40 V low-voltage power MOSFET to the market.

QPL-qualified SupIR-SMD package for rad hard MOSFETs enables higher performing space power systems
Reliably attaching surface mount hermetic power packages to PCBs is a common challenge faced by space system designers.

CoolSiC™ MOSFET 1700 V SMD enables best efficiency and reduced complexity for high voltage auxiliary power supplies
Infineon Technologies AG complements its CoolSiC™ MOSFET offering with yet another voltage class. Having added 650 V to the portfolio earlier this year, the company is now launching the 1700 V class with its proprietary trench semiconductor technology.

Secured connectivity and blockchain technology for data-driven supply chains
Industrial supply chain solutions like digital twins, usage-based pricing models, product warranties or licensing solutions increasingly require reliable and auditable sensor and process data. Yet security is paramount, especially when data is transferred from one company or organization to another.

Safety in cars: Infineon’s AURIX™ is the first embedded safety controller worldwide to be ASIL-D certified according to ISO 26262:2018

CES 2020: Infineon presents the world’s smallest 3D image sensor for face authentication and photo effects on smartphones and the like
Munich/Las Vegas, Germany/USA, 6 January 2020 – Reliable face authentication, improved photo functions and authentic augmented reality experiences: 3D depth sensors assume a key role in smartphones and for applications that rely on accurate 3D image data.

3D image sensor: Infineon enables easy smartphone unlock by face recognition
One megatrend feature in mobile communications is to unlock smartphones by 3D face recognition instead of fingerprint or PIN. Making authentication more convenient and more secure, it may soon become indispensable for mobile payment applications and mobile ID. With the 3D image sensor chip from Infineon Technologies AG the unlock-with-your-face feature becomes smarter, faster and more reliable.

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Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Brand new Qseven upgrade: NXP i.MX 8 | conga-QMX8-Plus


ENERGETAB 2021 Poland, Bielsko Biala, 14.9.-16.9.2021


Address Book


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


MACH SYSTEMS s.r.o.


A.P.O. - ELMOS v.o.s.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


CODICO


Future Electronics


Foremost Electronics


Littelfuse


Mouser Electronics


RUTRONIK


Infineon Technologies AG


TTI, Inc.


ANRITSU


Power Integrations



Calendary
International Engineering Fair, 4.-7.10. 2022, Brno, CZ
electronica 2022, 15.11.-18.11.2022, München, DE
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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