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DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
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TDK announces world’s first MIPI standar
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AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers

PICMG COM-HPC committee approves COM-HPC Mini pinout
Mini form factor for maximum performance

congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini. The new COM-HPC Mini standard is now entering the home stretch towards final ratification, which is scheduled for the first half of 2023. Designed for small yet extremely performance-hungry applications the new COM-HPC Mini specification will open up the prospect of developing ultra-powerful microcomputers the size of a 4- or 8-port Ethernet switch, for example. Such small system sizes are needed in many segments of embedded and edge computing. Target markets include box PCs and control cabinet / DIN-rail PCs, adaptive IoT gateways for the brownfield, cyber-secure edge computers for critical IT/OT infrastructures, rugged tablets, and even ultra-rugged robots and in-vehicle computers wanting to take advantage of the soldered RAM which is a standard feature of these modules. Processors predestined for this new form factor are the 12th Gen Intel Core processor series – for which congatec already offers a ready-to-deploy design study for initial lab tests and customer feedback loops – and its future successors.

“The pinout approval is an essential milestone as carrier board designers and Computer-on-Module manufacturers such as congatec who are active in the COM-HPC working group can now embark on first compliant small form factor sized embedded and edge computer solutions based on this pre-approved data. The goal is to bring modules to market at the same time as Intel and other application processor vendors launch their new high-end processor generations, which is expected to happen next year,” explains Christian Eder, director product marketing congatec, and chairman of the COM-HPC working group.

Providing 400 pins, as compared to COM Express Mini’s 220 pins, the new COM-HPC Mini standard is designed to satisfy the rising interface needs of heterogeneous and multi-functional edge computers. Extensions include up to 4x USB 4.0 with full functionality including Thunderbolt and DisplayPort alternate mode, PCIe Gen 4/5 with up to 16 lanes, 2x 10 Gbit/s Ethernet port and much more. Add to that the fact that the COM-HPC Mini connector is qualified for bandwidths of more than 32 Gbit/s – enough to support PCIe Gen 5 or even Gen 6 – it is clear that its capabilities go well beyond those of all other credit-card-sized module standards.

For more information on the new COM-HPC Mini Computer-on-Module standard and the congatec COM-HPC Mini design study based on the 12th Gen Intel® Core™ processor series that is pin-compatible to upcoming successors, please visit https://www.congatec.com/en/technologies/com-hpc-mini/.

2022121301 / 13.12.2022 / Embedded / congatec AG /

congatec introduces new Computer-on-Modules with 13th Gen Intel Core processors
Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here

PICMG COM-HPC committee approves COM-HPC Mini pinout
Mini form factor for maximum performance

congatec welcomes COM Express 3.1 specification with compliant Computer-on-Modules
Performance boost now standard-compliant

Accelerating the real-time digitization
congatec introduces its ecosystem for TSN networked real-time factories and critical infrastructures

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change

congatec modules drive Intel Labs China’s Robot 4.0 platform for research and education
Making the robotic edge modular

congatec launches five new COM-HPC Server Size D modules with Intel Xeon D-2700 processors following the “less is more” approach
An advance into the world of mixed-critical real-time servers

congatec extends its 12th Gen Intel Core processor based COM-HPC and COM Express Computer-on-Module portfolio with seven more power-efficient new processor variants
Highly powerful, yet passively cooled

congatec to enter the functional safety market
Functional safe computing platforms for mixed-critical applications

congatec and S.I.E launch co-creation services for the digitization of healthcare
Value partnership for creating medical edge computing systems that meet patient, data, and cybersecurity requirements

Modular 5G cells for real-time communications
Real-time capable 5G cells with integrated edge servers are a key enabling technology for digital transformation, opening a plethora of new opportunities for IIoT, Industry 4.0 and critical infrastructure applications.

Company of the week

Danisense

Interesting video


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


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Calendary
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
embeddedworld, 14 - 16 March 2023, Nuremberg, DE
AMPER 2023, 21.-23.3.2023, Prague, CZ
SMTconnect, 9.-11.5.2023, Nuremberg, DE
PCIM Europe, 9.-11.5.2023, Nuremberg, DE
sps Italia, 13.-15.5.2023, Fiere di Parma, IT
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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