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congatec introduces new Computer-on-Modules with 13th Gen Intel Core processors
Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here

Deggendorf, Germany, 3 January 2023 * * * congatec – a leading vendor of embedded and edge computing technology – announces the availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly. congatec expects series production of OEM designs based on these new modules to ramp up quickly and massively as the new processors with long life availability offer vast improvements in many features yet are fully hardware compatible to the predecessors, which makes implementation very fast and easy. With Thunderbolt and enhanced PCIe support up to Gen5, the modules based on the new COM-HPC standard open up new horizons for developers in terms of data throughput, I/O bandwidth and performance density. The COM Express 3.1 compliant modules primarily help to secure investments in existing OEM designs, which includes upgrade options for more data throughput thanks to PCIe Gen4 support.
 

The new COM-HPC and COM Express Computer-on-Modules provide up to 8% single thread and up to 5% multithread[1] performance gains from the soldered 13th Gen Intel Core processors compared to 12th Gen Intel Core processors. The performance gains go hand in hand with a distinctly higher power efficiency due to an enhanced manufacturing process. Also new in this performance class (15-45 W Base Power) are DDR5 memory support and PCIe Gen5 connectivity on selected SKUs. Both contribute to even better multithread performance and data throughput. With up to 80 EU and ultra-fast encode and decode capabilities, the integrated Intel Iris Xe graphics architecture is ideally suited for enhanced graphics demands such as those found in video streaming and video data based situational awareness applications. All these features effect significant improvements in a wide range of industrial, medical, artificial intelligence (AI) and machine learning (ML) applications, as well as all types of embedded and edge computing with workload consolidation.

“The numerous improvements of the 13th Gen Intel Core processors help to make these new generations of Computer-on-Modules really outstanding. They give industry the opportunity to instantly upgrade already existing high-end embedded and edge computing solutions, which is what makes this new launch so extraordinarily significant for all our OEM customers and Value Adding Reseller partners,” explains Jürgen Jungbauer, Senior Product Line Manager at congatec.

The new conga-HPC/cRLP Computer-on-Module in COM-HPC Size A form factor and the compact conga-TC675 module based on the new COM Express 3.1 specification will become available in the below variants:

Processor Cores/ (P + E) Max. Turbo Freq. [GHz] P-cores / E-cores  Base Freq. [GHz] P-cores / E-cores Threads GPU Execution Units CPU Base Power [W]
Intel Core i5-1340PE 12 (4+8) 4.5 /3.3 1.8 / 1.3 16 80 28
Intel Core i5-1335UE 10 (2+8) 4.5 / 3.3 1.3 / 1.1 12 80 15
Intel Core i3-13300HE  8 (4+4) 4.6 / 3.4 2.1 / 1.5 12 48 45
Intel Core i3-1320PE 8 (4+4) 4.5 / 3.3 1.7 / 1.2 12 48 28
Intel Core i3-1315UE  6 (2+4) 4.5 / 3.3 1.2 / 0.9 8 64 15
Intel Pentium U300E 5 (1+4) 4.3 / 3.2 1.1 / 0.9 6 48 15


Application engineers can deploy the new COM-HPC Computer-on-Modules on congatec’s Micro-ATX Application Carrier Board conga-HPC/uATX for COM-HPC Client type modules to instantly capitalize on all the benefits and improvements of these new modules in combination with ultra-fast PCIe Gen5 connectivity.

For more information on the new Computer-on-Modules in COM-HPC Size A and COM Express 3.1 form factors, their tailored cooling solutions, and congatec’s migration services, please visit congatec’s landing page for 13th Gen Intel Core processor based embedded and edge computing solutions:
https://www.congatec.com/en/technologies/13th-gen-intel-core-computer-on-modules/

The datasheet of the new conga-HPC/cRLP Computer-on-Module in COM-HPC Size A is ready for download at
https://www.congatec.com/en/products/com-hpc/conga-hpccrlp/

The datasheet of the new conga-TC675 Computer-on-Module in COM Express Compact Type 6 can be found at
https://www.congatec.com/en/products/com-express-type-6/conga-tc675/


[1] Estimated results comparing Intel Core i7-13800HE to previous-generation Intel Core i7-12800HE processor are based on SPECrate2017_int_base (1-copy and n-copy) using InteI Compiler version 2021.2. Intel Configurations:

Performance results are based on Intel estimates as of November 2022.
Processor: Intel Core i7-13800HE PL1=45W, (6C+8c) 14C20T Turbo up to5.2 GHz; Intel Iris Xe graphics architecture with up to 96 EUs, DDR5-5200 2x32GB memory; Samsung* PM9A1(CPU attached) OS: Windows* 11

Performance results are based on Intel measurements as of November 2022.
Processor: Intel Core i7-12800HE PL1=45W, (6C+8c) 14C20T Turbo up to 4.6 GHz, Intel Iris Xe graphics architecture with up to 96 EUs, DDR5-4800 32GB memory, Samsung SSD 970 EVO Plus 1TB; Platform/ motherboard: Intel Corporation AlderLake-P DDR5 RVP, Windows 10 Enterprise LTSC 21H2 Bios: ADLPFWI1.R00.2504.B00.2112100444    12/10/2021
CPUzMicrocode: 413h

Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries.

2023010301 / 03.01.2023 / Embedded / congatec AG /

congatec introduces new Computer-on-Modules with 13th Gen Intel Core processors
Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here

PICMG COM-HPC committee approves COM-HPC Mini pinout
Mini form factor for maximum performance

congatec welcomes COM Express 3.1 specification with compliant Computer-on-Modules
Performance boost now standard-compliant

Accelerating the real-time digitization
congatec introduces its ecosystem for TSN networked real-time factories and critical infrastructures

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change

congatec modules drive Intel Labs China’s Robot 4.0 platform for research and education
Making the robotic edge modular

congatec launches five new COM-HPC Server Size D modules with Intel Xeon D-2700 processors following the “less is more” approach
An advance into the world of mixed-critical real-time servers

congatec extends its 12th Gen Intel Core processor based COM-HPC and COM Express Computer-on-Module portfolio with seven more power-efficient new processor variants
Highly powerful, yet passively cooled

congatec to enter the functional safety market
Functional safe computing platforms for mixed-critical applications

congatec and S.I.E launch co-creation services for the digitization of healthcare
Value partnership for creating medical edge computing systems that meet patient, data, and cybersecurity requirements

Modular 5G cells for real-time communications
Real-time capable 5G cells with integrated edge servers are a key enabling technology for digital transformation, opening a plethora of new opportunities for IIoT, Industry 4.0 and critical infrastructure applications.

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DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
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The ISS Design Challenge ...

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Mouser Electronics Warehouse Tour with Grant Imahara



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