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06.02.2023 0:07:27
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DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
BHI260AB
 
An All-in-One Programmable Smart Sensor
BAHCO
 
BAHCO set of insulated wrenches
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TDK announces world’s first MIPI standar
Portable SSD T7 Touch
 
Samsung Releases Portable SSD T7 Touch –
AR236.B & AR232.B
 
APAR AR236.B & AR232.B radio loggers

congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket
he ultimate performance boost consolidated edge applications have been waiting for

congatec – a leading vendor of embedded and edge computing technology – announces the availability of new COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors. The launch expands the already available portfolio of high-performance COM-HPC modules with soldered processors to include the even more powerful socketed variants of this processor generation. The new conga-HPC/cRLS Computer-on-Modules in COM-HPC Size C form factor (120x160mm) address application areas that require especially outstanding multi-core and multi-thread performance, large caches, and enormous memory capacities combined with high bandwidth and advanced I/O technology. Target markets are performance-hungry industrial, medical, and edge applications utilizing artificial intelligence (AI) and machine learning (ML), as well as all types of embedded and edge computing solutions with workload consolidation requirements for which congatec also supports real-time hypervisor technologies from Real-Time Systems.
 

"With currently up to 8 Performance cores in parallel to 16 Efficient cores, the socketed variants of the 13th Gen Intel Core processors empower our COM‑HPC modules to offer even more options for making edge computing more performant and efficient through workload consolidation," explains Jürgen Jungbauer, Senior Product Line Manager at congatec. IoT-connected systems have many tasks to process in parallel, and if OEMs do not want to realize this connectivity through adaptive systems, OEMs need to embed virtual machines into their solutions. The more cores a Computer-on-Module provides, the easier this becomes.
 

Major features that have been improved

The most remarkable improvement of the socketed 13th Gen Intel Core processors is the up to 34 % multi-thread and up to 4 % single-thread performance gain[1] as well as an impressive 25 % faster image classification inference performance[1], compared to 12th Gen Intel Core processors. The added DDR5-5600 support as well as an increased L2 & L3 cache on select variants contribute to even more outstanding multi-threaded performance. The computing core improvements of this performance hybrid architecture, which currently provides up to 8 Performance cores and 16 Efficient cores, are complemented by enhanced USB3.2 Gen 2x2 bandwidth of up to 20 Gigabit per second on the new congatec COM-HPC Size C Computer-on-Modules.

The new conga-HPC/cRLS Computer-on-Module in COM-HPC Size C form factor will become available in the below variants:

Processor Cores/
(P + E)

 
Max. Turbo 
Freq. [GHz]
P-cores/E-cores
Base Freq. [GHz]
P cores / E cores 
Threads GPU Execution Units CPU Base Power [W]
Intel Core i9-13900E 24 (8+16) 5.2 / 4.0 1.8 / 1.3 32 32 65
Intel Core i7-13700E 16 (8+8) 5.1 / 3.9 1.9 / 1.3 24 32 65
Intel Core i5-13400E  10 (6+4) 4.6 / 3.3 2.4 / 1.5 16 32 65
Intel Core i3-13100E 4 (4+0) 4.4 / - 3.3 / - 8 24 65

Application engineers can deploy the new COM-HPC Computer-on-Modules on congatec’s Micro-ATX Application Carrier Board (conga-HPC/mATX) for COM-HPC Client type modules to instantly capitalize on all the benefits and improvements of these new modules in combination with ultrafast PCIe connectivity.

For more information on the new conga-HPC/cRLS Computer-on-Module in COM-HPC Size C form factor, its tailored cooling solutions, and congatec’s implementation services please visit https://www.congatec.com/en/products/com-hpc/conga-hpccrls/

For more information on congatec’s 13th Gen Intel Core processor based embedded and edge computing solutions please visit
https://www.congatec.com/en/technologies/13th-gen-intel-core-computer-on-modules/

2023012101 / 21.01.2023 / Embedded / editor /

embeddedworld, 14 - 16 March 2023, Nuremberg, DE
embedded. sustainable. responsible.

congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket
he ultimate performance boost consolidated edge applications have been waiting for

congatec, S.I.E and secunet present edge gateway at MEDICA 2022
Healthcare and the cloud: secunet medical connect securely links medical devices and networks

sps - smart production solutions, 08.–10.11.2022, Nuremberg, DE
With its unique concept, the SPS covers the entire spectrum of smart and digital automation – from simple sensors to intelligent solutions, from what is feasible today to the vision of a fully digitalized industrial world.

International Engineering Fair, 4.-7.10. 2022, Brno, CZ
The MSV International Engineering Fair is the most important industrial fair in Central Europe. The majority of visitors are professionals. Nearly 80% of those in attendance exert influence on business investment, and one third form part of the top management of their firms.

formnext, 15.-18.11.2022, Frankfurt am Main, DE
Formnext shows the entire world of Additive Manufacturing and its upstream and downstream processes under one roof. This is just one of the reasons why it has developed rapidly in recent years and become the international meeting point for suppliers and users of industrial 3D Printing. In Frankfurt am Main as well as digitally.

sps Italia, 13.-15.5.2023, Fiere di Parma, IT
SPS Italia is the highlight event for the intelligent, digital and flexible industry. SPS Italia is the annual appointment to discuss the most challenging issues of tomorrow's industry, recognized as a reference point for the Italian manufacturing sector. The next edition will take place in Parma from 23 to 25 May 2023.

AMPER 2023, 21.-23.3.2023, Prague, CZ
29TH INTERNATIONAL TRADE FAIR OF ELECTROTECHNICS, ENERGETICS, AUTOMATION, COMMUNICATION, LIGHTING, AND SECURITY TECHNOLOGIES

SMTconnect, 9.-11.5.2023, Nuremberg, DE
SMTconnect is the only trade fair for electronic production in Europe that brings people and technologies from the areas of development, production, services, and the applications of microelectronic assemblies and systems together in an inspiring work atmosphere.

PCIM Europe, 9.-11.5.2023, Nuremberg, DE
The PCIM Europe is the international leading exhibition and conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management.

AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
XXVII International Fair for Industrial Automation

AMPER TOUR 2022 - Experience the trade fair differently!
Visit AMPER 2022 Trade Fair and experience it differently than usual! This year's guided tours will focus on "modern technologies for flexible production".

Company of the week

Danisense

Interesting video


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


Intel Alder Lake Product Video


Address Book


Danisense


BINDER


Parker Hannifin


MOXA


DANFOSS


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.


PICMG


Laird Thermal Systems


HARTING


Jenoptik


MACH SYSTEMS s.r.o.


A.P.O. - ELMOS v.o.s.


Pico Technology


Lynred


Advantech


EBV


SECO S.p.A.


Crowd Supply


Digi-Key Electronics


Durakool


KEMET


CODICO



Calendary
DistribuTECH, 7.2.-9.2.2023, San Diego, CA
AUTOMATICON 2023, 7.3.-9.3.2023, Warsaw, PL
embeddedworld, 14 - 16 March 2023, Nuremberg, DE
AMPER 2023, 21.-23.3.2023, Prague, CZ
SMTconnect, 9.-11.5.2023, Nuremberg, DE
PCIM Europe, 9.-11.5.2023, Nuremberg, DE
sps Italia, 13.-15.5.2023, Fiere di Parma, IT
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara



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