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congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket
The ultimate performance boost consolidated edge applications have been waiting for

congatec – a leading vendor of embedded and edge computing technology – announces the availability of new COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors. The launch expands the already available portfolio of high-performance COM-HPC modules with soldered processors to include the even more powerful socketed variants of this processor generation. The new conga-HPC/cRLS Computer-on-Modules in COM-HPC Size C form factor (120x160mm) address application areas that require especially outstanding multi-core and multi-thread performance, large caches, and enormous memory capacities combined with high bandwidth and advanced I/O technology. Target markets are performance-hungry industrial, medical, and edge applications utilizing artificial intelligence (AI) and machine learning (ML), as well as all types of embedded and edge computing solutions with workload consolidation requirements for which congatec also supports real-time hypervisor technologies from Real-Time Systems.
 

"With currently up to 8 Performance cores in parallel to 16 Efficient cores, the socketed variants of the 13th Gen Intel Core processors empower our COM‑HPC modules to offer even more options for making edge computing more performant and efficient through workload consolidation," explains Jürgen Jungbauer, Senior Product Line Manager at congatec. IoT-connected systems have many tasks to process in parallel, and if OEMs do not want to realize this connectivity through adaptive systems, OEMs need to embed virtual machines into their solutions. The more cores a Computer-on-Module provides, the easier this becomes.
 

Major features that have been improved

The most remarkable improvement of the socketed 13th Gen Intel Core processors is the up to 34 % multi-thread and up to 4 % single-thread performance gain[1] as well as an impressive 25 % faster image classification inference performance[1], compared to 12th Gen Intel Core processors. The added DDR5-5600 support as well as an increased L2 & L3 cache on select variants contribute to even more outstanding multi-threaded performance. The computing core improvements of this performance hybrid architecture, which currently provides up to 8 Performance cores and 16 Efficient cores, are complemented by enhanced USB3.2 Gen 2x2 bandwidth of up to 20 Gigabit per second on the new congatec COM-HPC Size C Computer-on-Modules.

The new conga-HPC/cRLS Computer-on-Module in COM-HPC Size C form factor will become available in the below variants:

Processor Cores/
(P + E)

 
Max. Turbo 
Freq. [GHz]
P-cores/E-cores
Base Freq. [GHz]
P cores / E cores 
Threads GPU Execution Units CPU Base Power [W]
Intel Core i9-13900E 24 (8+16) 5.2 / 4.0 1.8 / 1.3 32 32 65
Intel Core i7-13700E 16 (8+8) 5.1 / 3.9 1.9 / 1.3 24 32 65
Intel Core i5-13400E  10 (6+4) 4.6 / 3.3 2.4 / 1.5 16 32 65
Intel Core i3-13100E 4 (4+0) 4.4 / - 3.3 / - 8 24 65

Application engineers can deploy the new COM-HPC Computer-on-Modules on congatec’s Micro-ATX Application Carrier Board (conga-HPC/mATX) for COM-HPC Client type modules to instantly capitalize on all the benefits and improvements of these new modules in combination with ultrafast PCIe connectivity.

For more information on the new conga-HPC/cRLS Computer-on-Module in COM-HPC Size C form factor, its tailored cooling solutions, and congatec’s implementation services please visit https://www.congatec.com/en/products/com-hpc/conga-hpccrls/

For more information on congatec’s 13th Gen Intel Core processor based embedded and edge computing solutions please visit
https://www.congatec.com/en/technologies/13th-gen-intel-core-computer-on-modules/

2023012101 / 21.01.2023 / Embedded / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

Company of the week

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