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MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
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congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket
The ultimate performance boost consolidated edge applications have been waiting for

congatec – a leading vendor of embedded and edge computing technology – announces the availability of new COM-HPC Client Computer-on-Modules based on high-end processor variants of the 13th Gen Intel Core processors. The launch expands the already available portfolio of high-performance COM-HPC modules with soldered processors to include the even more powerful socketed variants of this processor generation. The new conga-HPC/cRLS Computer-on-Modules in COM-HPC Size C form factor (120x160mm) address application areas that require especially outstanding multi-core and multi-thread performance, large caches, and enormous memory capacities combined with high bandwidth and advanced I/O technology. Target markets are performance-hungry industrial, medical, and edge applications utilizing artificial intelligence (AI) and machine learning (ML), as well as all types of embedded and edge computing solutions with workload consolidation requirements for which congatec also supports real-time hypervisor technologies from Real-Time Systems.
 

"With currently up to 8 Performance cores in parallel to 16 Efficient cores, the socketed variants of the 13th Gen Intel Core processors empower our COM‑HPC modules to offer even more options for making edge computing more performant and efficient through workload consolidation," explains Jürgen Jungbauer, Senior Product Line Manager at congatec. IoT-connected systems have many tasks to process in parallel, and if OEMs do not want to realize this connectivity through adaptive systems, OEMs need to embed virtual machines into their solutions. The more cores a Computer-on-Module provides, the easier this becomes.
 

Major features that have been improved

The most remarkable improvement of the socketed 13th Gen Intel Core processors is the up to 34 % multi-thread and up to 4 % single-thread performance gain[1] as well as an impressive 25 % faster image classification inference performance[1], compared to 12th Gen Intel Core processors. The added DDR5-5600 support as well as an increased L2 & L3 cache on select variants contribute to even more outstanding multi-threaded performance. The computing core improvements of this performance hybrid architecture, which currently provides up to 8 Performance cores and 16 Efficient cores, are complemented by enhanced USB3.2 Gen 2x2 bandwidth of up to 20 Gigabit per second on the new congatec COM-HPC Size C Computer-on-Modules.

The new conga-HPC/cRLS Computer-on-Module in COM-HPC Size C form factor will become available in the below variants:

Processor Cores/
(P + E)

 
Max. Turbo 
Freq. [GHz]
P-cores/E-cores
Base Freq. [GHz]
P cores / E cores 
Threads GPU Execution Units CPU Base Power [W]
Intel Core i9-13900E 24 (8+16) 5.2 / 4.0 1.8 / 1.3 32 32 65
Intel Core i7-13700E 16 (8+8) 5.1 / 3.9 1.9 / 1.3 24 32 65
Intel Core i5-13400E  10 (6+4) 4.6 / 3.3 2.4 / 1.5 16 32 65
Intel Core i3-13100E 4 (4+0) 4.4 / - 3.3 / - 8 24 65

Application engineers can deploy the new COM-HPC Computer-on-Modules on congatec’s Micro-ATX Application Carrier Board (conga-HPC/mATX) for COM-HPC Client type modules to instantly capitalize on all the benefits and improvements of these new modules in combination with ultrafast PCIe connectivity.

For more information on the new conga-HPC/cRLS Computer-on-Module in COM-HPC Size C form factor, its tailored cooling solutions, and congatec’s implementation services please visit https://www.congatec.com/en/products/com-hpc/conga-hpccrls/

For more information on congatec’s 13th Gen Intel Core processor based embedded and edge computing solutions please visit
https://www.congatec.com/en/technologies/13th-gen-intel-core-computer-on-modules/

2023012101 / 21.01.2023 / Embedded / congatec AG /

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket
The ultimate performance boost consolidated edge applications have been waiting for

congatec introduces new Computer-on-Modules with 13th Gen Intel Core processors
Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here

PICMG COM-HPC committee approves COM-HPC Mini pinout
Mini form factor for maximum performance

congatec welcomes COM Express 3.1 specification with compliant Computer-on-Modules
Performance boost now standard-compliant

Accelerating the real-time digitization
congatec introduces its ecosystem for TSN networked real-time factories and critical infrastructures

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

congatec receives VDC Research’s Platinum Vendor Satisfaction Award for IoT & Embedded Hardware technology
Award-winning: congatec’s support of customers through dramatic business challenges and technological change

Company of the week

Digi-Key Electronics

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