Address Book
 

BALLUFF
 

Seica
 

PEI-Genesis
 

KEYENCE
 

CML Microcircuits
 

SAMTEC
 

ams-OSRAM
 

INTEL
 

TDK Corporation
 

Giada
 

RS group
 

NOKIA
 

ANRITSU
 

Digi-Key Electronics
 

AERS

27.05.2024 0:07:07
bloky
maketa
HomePage
Electronic-components
Embedded
Industry automation
Pneumatic
Test & measurement
Tools
Electromobility
Solar energy
Lighting
Jobs
Trade fairs, Events
Virtual events
Interesting video
Various

Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec – a leading vendor of embedded and edge computing technology – announces the launch of a new carrier board design training program to impart best practice knowledge on how to design-in leading Computer-on-Module standards COM-HPC and SMARC. The goal is to provide system architects with a quick, easy, and efficient deep dive into the design rules of these PICMG and SGET standards. The training courses will guide engineers through all the mandatory and recommended design essentials and best practice carrier board schematics for Computer-on-Modules and will efficiently empower developers to start their own carrier board design projects. The knowledge transfer focusses on standard-compliant carrier board designs that are essential to build interoperable, scalable, and durable customized embedded computing platforms. The academy will operate globally, offering online and on-premises courses, and targets developers at OEMs, VARs and system integrators.

“The official design guides published by the standardization bodies are a great resource, but ultimately, they are just requirement specifications. Developers must also learn how to best implement these fundamentals in the real world. We have set up the training program with the goal in mind to accelerate the knowledge transfer required to start such real-world development projects. At the end of the training, developers should be confident to have learned everything needed to start their own carrier board designs,” explains Daniel Stadler, Manager Support & Design-In at congatec.

With the new congatec training program for carrier board designs, engineers get a kick-start into the world of high-end embedded and edge computing – from PCB layout principles, power management rules and signal integrity requirements to component selection. Sessions with a special focus on computer interfaces will provide guidance on how to avoid pitfalls in the challenging design of high-speed serial communications – from PCIe Gen 5, USB 3.2 Gen 2 and USB 4 with Thunderbolt, via USB‑C and Ethernet up to 100GbE, including the management of sideband signals that must be deserialized on the carrier board for COM-HPC. Last but not least, the course will explain how best practice designs utilize interface standards such as eSPI, I²C, and GPIOs. An introduction of congatec’s x86 firmware implementation – ranging from embedded BIOS to Board Management Controller and Module Management Controller features – rounds off the design-in sessions. Finally, there are sessions on verification and test strategies to tackle all challenges from initial carrier board design verification to mass production testing.

The COM-HPC and SMARC carrier board design courses are a service of the congatec training academy and require a service subscription. Each participant will automatically receive a certificate of successful participation, confirming that they have acquired the appropriate knowledge to become a carrier board design expert. More information about where and when the congatec training program will start and detailed course descriptions can be found at https://www.congatec.com/en/designintraining/. On request congatec can also arrange individual training sessions for groups of 5 participants or more.

2023022802 / 28.02.2023 / Various / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

Company of the week

BALLUFF

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


BALLUFF


Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


MOXA


DANFOSS


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial


NVIDIA


Yamaichi Electronics USA Inc.



Calendary
sps Italia, Parma, 28.-30.5.2024
SENSOR+TEST 2024, 11.-13.6.2024, Nuremberg, DE
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


naše portály dle jazyka:

česko/slovenská jazyková verze:
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIK-INFO.CZ

anglická jazyková verze:
WWW.ELECTRONICA.ONLINE
WWW.ELECTRONIC-INFO.EU
WWW.COMPONENTS.ONLINE

polská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIK-INFO.PL

ruská jazyková verze:
WWW.ELEKTRONIKA.ONLINE/ru
WWW.ELEKTRONIK-INFO.RU
naše portály dle zaměření:

ELEKTRONIKA.ONLINE :
WWW.ELECTRONICA.ONLINE
WWW.ELEKTRONIKA.CZ
WWW.ELEKTRONIKA.ONLINE/pl
WWW.ELEKTRONIKA.ONLINE/ru

ELEKTRONIK-INFO:
WWW.ELECTRONIC-INFO.EU
WWW.ELEKTRONIK-INFO.CZ
WWW.ELEKTRONIK-INFO.PL
WWW.ELEKTRONIK-INFO.RU

COMPONENTS:
WWW.COMPONENTS.ONLINE
  kontakt:

MALUTKI media s.r.o.
Těrlická 475/22
735 35 Horní Suchá
tel. 00420-603531605
e-mail: info@malutki-media.com



All trademarks are the property of their respective owners.
ISSN 1801-3813