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Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo
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s-Sense
 
s-Sense modules from R&D SOFTWARE SOLUTI
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TH381 series miniature, high IP rated co
TP-1303
 
Twintex TP-1000 series dual channel powe

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

The two German embedded and edge computing heavyweights, congatec and Kontron, have concluded a cooperation agreement to standardize the design schematics of COM-HPC evaluation carrier boards from both companies, and to publish most of these schematics in public design guides. The goal is to improve design security through standardization, to reduce OEMs’ NRE costs, and to accelerate their time-to-market for new modular high-performance embedded and edge computing solutions based on the new COM-HPC® standard.

To solve the customers challenges the two German competitors cooperate not only to improve standardization but also to raise supply security through dual sourcing strategies. The global supply bottlenecks have drastically increased OEMs’ sensitivity over the last two years. The combined German design and engineering expertise addresses this need for high supply chain security by improving interoperability through joint carrier board design initiatives. congatec and Kontron will therefore put a distinct focus on plug & play capabilities so that Computer-on-Modules from either vendor can be used on any evaluation carrier board from either company to enable real multi-vendor COM and carrier strategies.

The initial focus of the cooperation between congatec and Kontron is the standardization of evaluation carrier boards for the COM-HPC® Client and Server form factors, with further module standards such as COM Express® and SMARC™ to follow. Customers will be able to use not only the design guides but also the carrier board layouts as best practice benchmarks for their own designs. As international threat scenarios have increased, the new standardized and interoperable evaluation carrier boards will follow highest cybersecurity requirements.

“This cooperation represents a new level of standardization par excellence. Even with the different module specifications and official PICMG carrier board design guides, there are still only a few efforts to ensure real interoperability on the evaluation carrier board level. And up to the application level, for that matter. It is therefore very valuable that we will now tackle these challenges together to achieve ultimate application-ready interoperability”, explains Konrad Garhammer, COO and CTO at congatec.

“Kontron and congatec are both highly focused on the benefits and good service for their customers. Therefore, I am pleased we came to this standardization agreement.

In fact, our companies are experienced in this already, having worked closely together in the PICMG and SGET standardization committees and having played a significant role in shaping all current standards. Based on this experience, we are convinced that the carrier board standardization efforts will also be executed with mutual appreciation of the respective inputs,” emphasizes Michael Riegert, CEO Kontron Europe GmbH and COO IoT Europe, Executive Board Member at Kontron AG . 

Both companies emphasize that the cooperation relates exclusively to the standardization of evaluation carrier boards and that module development will remain strictly separate, as this core business is highly competitive.

2023031202 / 12.03.2023 / Embedded / congatec AG /

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

congatec expands its portfolio of COM-HPC Computer-on-Modules with 13th Gen Intel Core processor to include high-end variants with LGA socket
The ultimate performance boost consolidated edge applications have been waiting for

congatec introduces new Computer-on-Modules with 13th Gen Intel Core processors
Happy new year for high-end embedded computers: The world’s fastest Client Computer-on-Modules generation is here

PICMG COM-HPC committee approves COM-HPC Mini pinout
Mini form factor for maximum performance

congatec welcomes COM Express 3.1 specification with compliant Computer-on-Modules
Performance boost now standard-compliant

Accelerating the real-time digitization
congatec introduces its ecosystem for TSN networked real-time factories and critical infrastructures

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor
Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs

Company of the week

INTEL

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Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


"Electronics is Magic" Adam Kuczyński Talks About Innovations - TME on Electronica 2022 [INTERVIEW]


Introducing NVIDIA DGX A100


Webinar | Realtime and AI integration with COM-HPC


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Calendary
DistribuTECH, 23.1.-25.1.2024, Indianapolis, IN
DistribuTECH, 11.2.-13.2.2025, Dallas, TX

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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