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congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec — a leading vendor of embedded and edge computing technology, announced today that its conga-TC570r COM Express Type 6 Compact modules, based on the 11th Generation Intel® Core™ processor family (code name "Tiger Lake"), have received IEC-60068 certification. This certification qualifies these modules for operation in railway applications, confirming that they meet the requirements for extreme conditions such as extended temperatures, rapid temperature changes, shocks, and vibrations. Customers benefit from an application-ready building block with proven ruggedness for various mission critical applications.

The IEC-60068 certified conga-TC570r module suits various new railway applications, including Train Control and Management Systems (TCMS), predictive maintenance, passenger information systems, video surveillance and analytics, ticketing and fare collection, and fleet management and optimization. Additionally, they are an ideal fit for all applications beyond railway and transportation that are exposed to extreme conditions including automation, autonomous guided vehicles (AGV), autonomous mobile robots (AMR). These applications require advanced embedded computing capabilities provided by Intel's 11th Gen Core processor technology, which the module offers in an industry-compliant design certified to meet all required IEC-60068 specifications.

The certifications in detail

The conga-TC570r module has undergone rigorous testing and certification against various IEC-60068 standards. It is certified for reliable operation under extended temperatures ranging from -40 °C to +85 °C, including change of temperature (IEC-60068-2-14 Nb) and rapid change of temperature (IEC-60068-2-14 Na). It also provides shock and vibration resistance on the basis of DIN EN 61373 April 2011 category 2 (railway applications). The module is further protected against severe environmental conditions, such as high humidity, in accordance with IEC-60721-3-7 class 7K3, 7M2. Optional features include conformal coatings to enhance resistance to liquids and moisture further.

The ultra-rugged COM Express Compact Type 6 11th Gen Intel Core modules with soldered RAM and In-Band ECC (IBECC) are available in the following standard configurations, with customization options available upon request:
 

Processor

Cores/
Threads

Frequency at 28/15/12W TDP,
(Max Turbo) [GHz]

Cache [MB] Graphics [Execution Units]
Intel® Core™ i7-1185GRE 4/8 2.8/1.8/1.2 (4.4) 12 96 EU
Intel® Core™ i5-1145GRE 4/8 2.6/1.5/1.1 (4.1) 8 80 EU
Intel® Core™ i3-1115GRE 2/4 3.0/2.2/1.7 (3.9) 6 48 EU
Intel® Celeron® 6305E 2/2 1.8 3 48 EU


congatec offers also corresponding carrier boards and comprehensive cooling solutions for its IEC-60068 certified COM Express module, allowing for fast application design. The unique heat-pipe based passive cooling solutions provided by congatec ensure optimized heat dissipation and ruggedness, thanks to the fanless design, which extends the module's lifetime and reliability. Additionally, congatec's design-in and compliance measurement services for PCIe Gen4/5 and USB4 simplify and accelerate application design, improving design security and reducing time-to-market.

Further information on the new conga-TC570r COM Express Compact modules can be found here: www.congatec.com/en/products/com-express-type-6/conga-tc570r/

More information on additional 11th Generation Intel® Core™ processors solutions from congatec can be found on the main landing page: https://congatec.com/11th-gen-intel-core/

2023091001 / 10.09.2023 / Embedded / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

Company of the week

PEI-Genesis

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