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congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

Deggendorf, Germany, 28 September 2023 * * * congatec - a leading vendor of embedded and edge computing technology - has announced the launch of its latest SMARC Module 2.1 Computer-on-Modules based on Texas Instruments Jacinto™ 7 TDA4x or DRA8x processors. These new industrial-grade Computer-on-Modules are ideal for high-performance AI edge applications with an ultra-low power (ULP) envelope featuring dual Arm Cortex-A72 processors, powerful AI accelerators, and 3D graphics. The conga-STDA4 modules consuming only 5 to 10 Watt, target industrial mobile machinery that requires 2d/3d camera, radar, and lidar based near-field analytics, such as automated guided vehicles (AGVs) and autonomous mobile robots (AMRs), as well as applications in construction and agricultural machinery. They are also suitable for any vision-focused industrial automation or medical solutions that require powerful and energy-efficient AI processing at the edge.

The new SMARC modules come with two MIPI CSI camera inputs. The TDA4x processor based conga-STDA4 adds an Image Signal Processor (ISP), vision accelerators, and pre-trained AI models from the TI Model Zoo, allowing for a seamless start into AI-powered application development. Additionally, it includes a Robotic SDK for enhanced functionality. The DRA8x variants offer a cost-efficient option without vision processing accelerators. Designed to withstand harsh industrial environments, both high-throughput module variants support the extended temperature range from -40 °C to +85 °C, as well as Time-Sensitive Networking (TSN), and cybersecurity measures.

“By integrating the powerful Texas Instruments Jacinto™ 7 TDA4x and TI DRA8x processors in our high-performance SMARC Module 2.1 ecosystem, congatec simplifies the design-in process for this advanced Arm Cortex-A72 based SoC technology. This allows vision-based situational awareness designers in various embedded industries to focus on their core competencies, saving upfront costs and reducing time to market, especially for industrial quantity production”, explains Martin Danzer, Director of Product Management at congatec. Industrial OEMs, particularly those without time and financial resources for full custom designs, can benefit from the innovative SMARC high-performance ecosystem offered by congatec. It streamlines the design process while ensuring high design security and low non-recurring engineering (NRE) costs.

The feature set in detail

The new congatec conga-STDA4 Computer-on-Modules based on the SMARC Module 2.1 specification are equipped with Texas Instruments Jacinto™ 7 TDA4VM or DRA829J processors based on 2 Arm Cortex-A72 and 6 Arm Cortex-R5F. With 2x MIPI-CSI 4-lanes and integrated Image Signal Processor (ISP) for MIPI-CSI cameras, the new modules enable high-quality camera, lidar, or radar data capture and processing. Featuring Deep-learning Matrix Multiply Accelerators (MMA) with up to 8 TOPS and C7x floating-point vector DSP with up to 80 GFLOPs, the module delivers exceptional performance for deep learning and AI processing. Exclusive to the Jacinto™ 7 TDA4VM variant are the Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators ensuring high-quality image processing and analysis. Common to both processor variants are the Depth and Motion Processing Accelerators (DMPAC) to enable accurate depth perception and motion tracking. Graphics performance including GPGPU capabilities are enhanced with the integrated Graphics Accelerator 3D GPU PowerVR Rogue 8XE GE8430. The new modules are embedded in congatec’s high-performance SMARC 2.1 Module ecosystem featuring tailored cooling solutions, evaluation and application ready carrier boards as well as value-adding services including signal compliance testing, conformal coating, and design-in trainings.

The new conga-STDA4 SMARC Computer-on-Modules based on Texas Instruments Jacinto™ 7 TDA4V and DRA8 processors support Linux, QNX, RTOS, and VxWorks and are available in the following standard configurations, with customization options available upon request:
 

Processor ARM Cortex-A72 ARM Cortex-R5F DSP Cores / GFLOPs VPAC / DMPAC
TI TDA4VM 2 6

1x C7x / 80
2x C66 / 40

Yes
TI DRA829J 2 6

1x C7x / 80
2x C66 / 40

No


For more information about congatec's new conga-STDA4 SMARC modules and its capabilities,
please visit: https://www.congatec.com/en/products/smarc/conga-STDA4/

2023092801 / 28.09.2023 / Embedded / congatec AG /

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

congatec introduces first COM-HPC Mini modules at embedded world 2023
Small form factor to complete high-performance ecosystem

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