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CML Microcircuits
 

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INTEL
 

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11.10.2024 9:25:18
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Access Point WBE750
 
NETGEAR Unveils the Ultimate Tri-band Wi
Intel Core 14th Gen i9
 
Intel Core 14th Gen i9-14900KS Powers De
DDRH-15/30/45/60
 
Mean Well’s DDRH Series Isolated Ultra-W
TimeProvider® 4500 Series
 
TimeProvider® 4500 Series Is the Industr
IAM-20381HT
 
TDK announces new 3-axis accelerometer,
Microchip’s 5071B
 
New Cesium Atomic Clock Provides Autonom
POLOLU-4980
 
MINIATURE STEP-UP/STEP-DOWN CONVERTERS F
MANSON SDP-2210
 
MANSON SDP-2210 PROGRAMMABLE LABORATORY
DPI 750E
 
RS Components adds range of enhanced pre
conga-TR4
 
AMD Ryzen™ based congatec COM Express mo

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec – a leading vendor of embedded and edge computing technology – welcomes PICMG’s ratification of the COM-HPC 1.2 specification, which introduces the COM-HPC Mini form factor. This new specification provides high-performance capabilities in a small form factor, measuring only 95 mm x 70 mm. Even devices with limited space can now benefit from the superior bandwidth and interface offerings of COM-HPC, including PCIe Gen 5 and Thunderbolt.

COM-HPC establishes itself as the most scalable Computer-on-Module (CoM) standard, covering a wide range of applications from small form factor designs to edge server designs. This simplifies the design-in process and enables the creation of complete product families with reduced engineering efforts. COM-HPC modules support not only specific processors like x86 or Arm but also FPGAs, ASICS, and AI accelerators, making it a comprehensive standard for developing innovative applications based on the latest embedded and edge data processing technologies.

Christian Eder, Chairman of PICMG's COM-HPC Working Group and Director of Market Intelligence at congatec, expresses his enthusiasm for the COM-HPC standard: “COM-HPC offers the highest performance, bandwidth, interfaces, and scalability compared to other computer-on-module standards and with COM-HPC Mini, engineers can now leverage all this on a real small form factor for space constrained embedded and edge computing designs.”

congatec is committed to supporting the adoption and implementation of the COM-HPC Mini specification, enabling customers to bring their solutions to market quickly. As a leading provider of embedded computing solutions, congatec also continues to develop and deliver products that align with the latest industry standards.

For more information about congatec and its COM-HPC ecosystem, please visit: https://www.congatec.com/en/ecosystems/com-hpc-ecosystem

The specification of congatec’s fist COM-HPC Mini module can be found here: https://www.congatec.com/en/technologies/com-hpc-mini/

The official PICMG COM-HPC page can be found here: https://www.picmg.org/openstandards/com-hpc/

2023101001 / 09.10.2023 / Embedded / congatec AG /

congatec presents new SMARC modules on the basis of the NXP i.MX 95 processor series
congatec modules set new benchmarks for secure edge AI applications

congatec COM-HPC Client modules with latest socketed Intel Core processors set performance record
Bringing a refreshing performance boost to the edge

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors
Next-generation AI computing for the edge

congatec launches new ultra-rugged 13th Gen Intel Core Computer-on-Modules with soldered RAM
Shock and vibration resistant for harsh environments

congatec takes over sales of Real-Time Systems’ products
The target: holistic consolidation and digitization offerings

congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini
Maximum performance for mini footprints

congatec introduces new SMARC modules with TI Jacinto™ 7 TDA4x or DRA8x processors
High-end edge AI and vision processing in ultra-low power envelop

congatec COM Express modules receive IEC-60068 railway certification
Proven shock and vibration resistant for harsh environments

congatec adds TI processors to its strategic solutions portfolio
Building a high-performance ecosystem for Arm based SMARC modules

congatec and Kontron conclude joint COM-HPC evaluation carrier board standardization agreement
The goals: Reduce NRE costs, accelerate time-to-market, and improve product & supply security

Solution platforms for high-performance engineering
congatec will be presenting its enhanced high-performance landscape for edge computing at Automation World Korea (hall C, booth 534).

congatec introduces a new carrier board design training program
Accelerating knowledge transfer

Company of the week

Cambridge GaN Devices

Interesting video


GAMING, COMPUTER ACCESSORIES AND OTHER RELATED PRODUCTS


New video for Pilot VX


electronica 2024, 12.11.-15.11.2024, Munich, DE


Video Report from AMPER 2022


INDUSTRIAL PRESSURE TRANSDUCERS FROM CYNERGY3


Address Book


Cambridge GaN Devices


Traco Power


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Seica


PEI-Genesis


KEYENCE


CML Microcircuits


SAMTEC


ams-OSRAM


INTEL


TDK Corporation


Giada


RS group


NOKIA


ANRITSU


Digi-Key Electronics


AERS


Flex Power Modules


Danisense


BINDER


Parker Hannifin


MOXA


DANFOSS


Alliance Memory


Intelliconnect (Europe) Ltd.


KIOXIA Europe GmbH


Antenova Ltd


Friedrich Lütze GmbH


Analog Devices


ASRock Industrial



Calendary
HKTDC Hong Kong Electronics Fair, 13.10.-16.10.2024
electronica 2024, 12.11.-15.11.2024, Munich, DE
DistribuTECH, 11.2.-13.2.2025, Dallas, TX
AMPER 2025, Brno, CZ, 18.-20.3.2025

Interesting video
The ISS Design Challenge ...

Interesting video
Mouser Electronics Warehouse Tour with Grant Imahara


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