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See us at PCIM 2024 on Booth 7-640 ... Microchip Makes it Easier to Design an On-Board Charger Solution
Designers can speed time to market for their on-board charger application with key technologies from one supplier, including the control, gate drive and power stage

The market for Battery Electric Vehicles (BEVs) and Plug-in Hybrid Electric Vehicles (PHEVs) continues to grow as the push towards decarbonization requires sustainable solutions to reduce emissions. A critical application for EVs is the on-board charger, which converts AC power into DC power to recharge the vehicle’s high-voltage battery. Microchip Technology (Nasdaq: MCHP) today announces an On-Board Charger (OBC) solution that uses a selection of its automotive-qualified digital, analog, connectivity and power devices, including the dsPIC33C Digital Signal Controller (DSC), the MCP14C1 isolated SiC gate driver and mSiC™ MOSFETs in an industry-standard D2PAK-7L XL package.

This solution is designed to increase an OBC system’s efficiency and reliability by leveraging the dsPIC33 DSC’s advanced control functions, the MCP14C1 gate driver’s high-voltage reinforced isolation with robust noise immunity and the mSiC MOSFETs’ reduced switching losses and improved thermal management capabilities. To further simplify the supply chain for customers, Microchip provides the key technologies that support the other functions of an OBC, including communication interfaces, security, sensors, memory and timing.

To accelerate system development and testing, Microchip offers a flexible programmable solution with ready-to-use software modules for Power Factor Correction (PFC), DC-DC conversion, communication and diagnostic algorithms. The software modules in the dsPIC33 DSC are designed to optimize performance, efficiency and reliability, while offering flexibility for customization and adaptation to specific OEM requirements.

“Microchip established an E-Mobility megatrend team with dedicated resources to support this growing market, so in addition to providing the control, gate drive and power stage for an OBC, we can also provide customers with connectivity, timing, sensors, memory and security solutions,” said Joe Thomsen, corporate vice president of Microchip’s digital signal controller business unit. “As a leading supplier to OEMs and Tier-1s, Microchip offers comprehensive solutions to streamline the development process, including automotive-qualified products, reference designs, software and global technical support.”

Here is an overview of the key components in this OBC solution:

  • The dsPIC33C DSC is AEC-Q100 qualified and features a high-performance DSP core, high-resolution Pulse-Width Modulation (PWM) modules and high-speed Analog-to-Digital Converters (ADCs), making it optimal for power conversion applications. It is functional safety ready and supports the AUTOSAR® ecosystem.
  • The MCP14C1 isolated SiC gate driver is AEC-Q100 qualified and is offered in SOIC-8 wide-body package supporting reinforced isolation and SOIC-8 narrow-body supporting basic isolation. Compatible with the dsPIC33 DSC, the MCP14C1 is optimized to drive mSiC MOSFETs via Undervoltage Lockout (UVLO) for VGS = 18V gate drive split output terminals, which simplifies implementation and eliminates the need for an external diode. Galvanic isolation is achieved by leveraging capacitive isolation technology, which results in robust noise immunity and high Common-Mode Transient Immunity (CMTI).
  • The mSiC MOSFET in an AEC-Q101-qualified D2PAK-7L XL surface mount package includes five parallel source sense leads to reduce switching losses, increase current capability and decrease inductance. This device supports 400V and 800V battery voltages.

Microchip has published a white paper that provides more information about how this OBC solution can optimize a design’s performance and speed up its time to market.

For more information about Microchip's OBC solutions for EVs, visit Microchip's website.

Development Tools

The dsPIC33C DSC is an AUTOSAR-ready device and is supported by the MPLAB® development ecosystem including MPLAB PowerSmart™ Development Suite.

Availability

The main components for an OBC solution including the dsPIC33C DSC, the MCP14C1 isolated SiC gate driver and the mSiC MOSFET in a D2PAK-7L XL package are now available. For additional information and to purchase, contact a Microchip sales representative, authorized worldwide distributor or visit Microchip’s Purchasing and Client Services website, www.microchipdirect.com.

2024061001 / 10.06.2024 / Electronic-components / Microchip Technology Inc. /

Four-Channel Thermocouple Measurement with Integrated Conditioning Now Possible with ±1.5°C System Accuracy
Microchip’s MCP9604 thermocouple conditioning IC reduces the cost and complexity of in-line production applications that operate in high and low temperature extremes

Microchip Introduces Flexible New Family of Gigabit Ethernet Switches with TSN/AVB and Redundancy For Industrial Applications
Microchip’s next generation LAN9645xF and LAN9645xS GbE switches are highly configurable with multiple ports and advanced features

New DualPack 3 IGBT7 Modules Deliver High Power Density and Simplify System Integration
Microchip launches six variants targeting high-growth motor drive, data center and sustainability applications

Deca and Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
The collaboration provides customers with a modular, memory-centric foundation for advanced multi-die architectures

Easily Integrate Position, Navigation and Timing Technology With Microchip’s Portfolio of GNSS Disciplined Oscillator Modules
These high-performance, small-form-factor timing systems are designed for defense applications in GNSS-denied environments

Microchip Enters into Partnership Agreement with Delta Electronics on Silicon Carbide Solutions for the Future of Power Management
This agreement leverages Microchip’s mSiC™ technology and Delta’s smart energy-saving solutions to accelerate the development of sustainable applications

Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
Latest achievements highlight over 60 years of space heritage and commitment to high-reliability, radiation-tolerant technology for next-generation satellite and avionics systems.

Microchip Partners with Nippon Chemi-Con and NetVision on First ASA-ML Camera Development Ecosystem for Japanese Automotive Market
Ecosystem’s camera module and development tools are based on Microchip’s VS700 family of serializers and deserializers and will help Japanese OEMs speed ASA-ML adoption in ADAS applications

Microchip Enhances Digital Signal Controller Lineup with Industry-Leading PWM Resolution and ADC Speed
The latest DSC devices with specialized peripherals for efficient power conversion target data center power supplies and other complex real-time systems

Microchip Brings Hardware Quantum Resistance to Embedded Controllers
The MEC175xB family features post-quantum cryptography, enhanced security features and low power consumption

Microchip Expands Connectivity, Storage and Compute Portfolios to Meet the Growing Demands of AI Data Center Applications
Company delivers an innovative, secure and scalable ecosystem to support modern servers

Microchip Unveils New High-Density Power Module for AI at the Edge Applications
The MCPF1412 power module with integrated I2C and PMBus® interfaces for flexible configuration and monitoring


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Texas Instruments

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electronica 2024, 12.11.-15.11.2024, Munich, DE

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Cambridge GaN Devices


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Parker Hannifin


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Intelliconnect (Europe) Ltd.



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electronica 2026, München, DE, 10.-13.11.2026

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The ISS Design Challenge ...

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Mouser Electronics Warehouse Tour with Grant Imahara


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