Nexperia’s MicroPak packages feature the same silicon die as larger PicoGate options, ensuring that electrical performance remains identical to leaded equivalents. MicroPak packages save up to 64% PCB space compared to leaded equivalents while providing a more reliable bond between device and board, thanks to a higher pad size-to-package footprint ratio. 

Nexperia’s complete MicroPak range is very broad and includes gates, analog switches, buffers / inverters / drivers, bus switches, translators, flip-flops, decoders / demultiplexers, multiplexers, latches, level shifters and Schmitt-trigger devices.

Twenty solutions in XSON6 (SOT886 and SOT1202) and XSON8 (SOT833-1 and SOT1203) packages are available immediately in Nexperia’s Automotive portfolio – including low-power single-gate and dual-gate functions in AUP (0.8 V to 3.6 V), AVC (1.2 V to 3.6 V) and LVC (1.65 V to 5.5 V) technologies, ranging from gates to translators. In addition, more devices from Nexperia’s MicroPak offering can be released for automotive applications upon request.

Ghislaine Jilisen-Janssen, Product Manager for Mini Logic, commented: “These are the smallest logic parts qualified for the automotive industry. Applications include in-car entertainment and ADAS (Advanced Driver Assist Systems) where miniaturisation is of paramount importance.”

For more information visit https://www.nexperia.com/products/logic/family/MICROPAK/ or download the MicroPak logic brochure.